KR20260009885A - 적층 세라믹 전자부품 - Google Patents

적층 세라믹 전자부품

Info

Publication number
KR20260009885A
KR20260009885A KR1020257041302A KR20257041302A KR20260009885A KR 20260009885 A KR20260009885 A KR 20260009885A KR 1020257041302 A KR1020257041302 A KR 1020257041302A KR 20257041302 A KR20257041302 A KR 20257041302A KR 20260009885 A KR20260009885 A KR 20260009885A
Authority
KR
South Korea
Prior art keywords
intermetallic compound
metal terminal
plating film
layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257041302A
Other languages
English (en)
Korean (ko)
Inventor
사토시 미야우치
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20260009885A publication Critical patent/KR20260009885A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020257041302A 2023-06-27 2023-06-27 적층 세라믹 전자부품 Pending KR20260009885A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/023868 WO2025004199A1 (ja) 2023-06-27 2023-06-27 積層セラミック電子部品

Publications (1)

Publication Number Publication Date
KR20260009885A true KR20260009885A (ko) 2026-01-20

Family

ID=93937834

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257041302A Pending KR20260009885A (ko) 2023-06-27 2023-06-27 적층 세라믹 전자부품

Country Status (5)

Country Link
US (1) US20250006429A1 (https=)
JP (1) JPWO2025004199A1 (https=)
KR (1) KR20260009885A (https=)
CN (1) CN121444190A (https=)
WO (1) WO2025004199A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12495495B2 (en) * 2023-07-05 2025-12-09 Olympus Medical Systems Corp. Wiring board, image pickup unit, endoscope, and method for manufacturing wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019145767A (ja) 2018-02-19 2019-08-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577012B1 (en) * 2001-08-13 2003-06-10 Amkor Technology, Inc. Laser defined pads for flip chip on leadframe package
JP6395322B2 (ja) * 2015-12-01 2018-09-26 太陽誘電株式会社 電子部品及びその製造方法、並びに回路基板
JP6966379B2 (ja) * 2018-04-23 2021-11-17 株式会社 日立パワーデバイス 半導体装置およびその製造方法
JP7494808B2 (ja) * 2021-06-25 2024-06-04 株式会社村田製作所 積層セラミック電子部品
JP7609028B2 (ja) * 2021-10-04 2025-01-07 株式会社村田製作所 積層セラミック電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019145767A (ja) 2018-02-19 2019-08-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品

Also Published As

Publication number Publication date
WO2025004199A1 (ja) 2025-01-02
US20250006429A1 (en) 2025-01-02
JPWO2025004199A1 (https=) 2025-01-02
CN121444190A (zh) 2026-01-30

Similar Documents

Publication Publication Date Title
KR102523712B1 (ko) 적층 세라믹 전자부품
KR102292922B1 (ko) 적층 세라믹 전자 부품
JP6962305B2 (ja) 積層セラミック電子部品
KR102562428B1 (ko) 적층 세라믹 전자부품
JP5353839B2 (ja) 電子部品
US11887787B2 (en) Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component
US12334267B2 (en) Multilayer ceramic capacitor
KR20260009885A (ko) 적층 세라믹 전자부품
US12154723B2 (en) Multilayer ceramic capacitor
JP7567728B2 (ja) 積層セラミック電子部品
JP7494808B2 (ja) 積層セラミック電子部品
US12249458B2 (en) Multilayer ceramic electronic component including metal terminals, exterior material, and electrostatic shielding metal
KR20260012831A (ko) 적층 세라믹 전자부품
EP4611011A1 (en) Layered ceramic electronic component
EP4600985A1 (en) Multilayer ceramic electronic component
US12437931B2 (en) Multilayer ceramic electronic component
JP2022134972A (ja) 積層セラミック電子部品
JP2023045850A (ja) 積層セラミックコンデンサ
WO2025046970A1 (ja) 積層セラミック電子部品

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000