JPWO2025142038A5 - - Google Patents

Info

Publication number
JPWO2025142038A5
JPWO2025142038A5 JP2025566237A JP2025566237A JPWO2025142038A5 JP WO2025142038 A5 JPWO2025142038 A5 JP WO2025142038A5 JP 2025566237 A JP2025566237 A JP 2025566237A JP 2025566237 A JP2025566237 A JP 2025566237A JP WO2025142038 A5 JPWO2025142038 A5 JP WO2025142038A5
Authority
JP
Japan
Prior art keywords
pair
end portion
lands
opposing
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025566237A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025142038A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/036752 external-priority patent/WO2025142038A1/ja
Publication of JPWO2025142038A1 publication Critical patent/JPWO2025142038A1/ja
Publication of JPWO2025142038A5 publication Critical patent/JPWO2025142038A5/ja
Pending legal-status Critical Current

Links

JP2025566237A 2023-12-27 2024-10-16 Pending JPWO2025142038A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023221499 2023-12-27
PCT/JP2024/036752 WO2025142038A1 (ja) 2023-12-27 2024-10-16 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPWO2025142038A1 JPWO2025142038A1 (https=) 2025-07-03
JPWO2025142038A5 true JPWO2025142038A5 (https=) 2026-02-27

Family

ID=96217199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025566237A Pending JPWO2025142038A1 (https=) 2023-12-27 2024-10-16

Country Status (2)

Country Link
JP (1) JPWO2025142038A1 (https=)
WO (1) WO2025142038A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3683721B2 (ja) * 1998-10-23 2005-08-17 太陽誘電株式会社 チップ電子部品及びチップインダクタ
JP2013122939A (ja) * 2011-12-09 2013-06-20 Sony Corp 回路基板
JP6585340B2 (ja) * 2014-10-09 2019-10-02 京セラ株式会社 積層型電子部品およびその実装構造体
JP6486251B2 (ja) * 2015-09-14 2019-03-20 太陽誘電株式会社 複合電子部品及びこれを用いた回路基板
JPWO2017115441A1 (ja) * 2015-12-28 2018-10-18 オリンパス株式会社 実装構造体、撮像装置および内視鏡
KR102426211B1 (ko) * 2017-10-02 2022-07-28 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP7540416B2 (ja) * 2021-10-01 2024-08-27 株式会社村田製作所 電子部品の実装構造

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