JPWO2025099997A5 - - Google Patents

Info

Publication number
JPWO2025099997A5
JPWO2025099997A5 JP2025556197A JP2025556197A JPWO2025099997A5 JP WO2025099997 A5 JPWO2025099997 A5 JP WO2025099997A5 JP 2025556197 A JP2025556197 A JP 2025556197A JP 2025556197 A JP2025556197 A JP 2025556197A JP WO2025099997 A5 JPWO2025099997 A5 JP WO2025099997A5
Authority
JP
Japan
Prior art keywords
pair
support member
electronic component
lands
extension portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025556197A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025099997A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/025904 external-priority patent/WO2025099997A1/ja
Publication of JPWO2025099997A1 publication Critical patent/JPWO2025099997A1/ja
Publication of JPWO2025099997A5 publication Critical patent/JPWO2025099997A5/ja
Pending legal-status Critical Current

Links

JP2025556197A 2023-11-07 2024-07-19 Pending JPWO2025099997A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023190269 2023-11-07
PCT/JP2024/025904 WO2025099997A1 (ja) 2023-11-07 2024-07-19 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPWO2025099997A1 JPWO2025099997A1 (https=) 2025-05-15
JPWO2025099997A5 true JPWO2025099997A5 (https=) 2026-02-27

Family

ID=95695392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025556197A Pending JPWO2025099997A1 (https=) 2023-11-07 2024-07-19

Country Status (2)

Country Link
JP (1) JPWO2025099997A1 (https=)
WO (1) WO2025099997A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140918A (ja) * 1997-07-22 1999-02-12 Taiyo Yuden Co Ltd セラミックス素子、部品実装基板及び配線基板
US6903920B1 (en) * 2004-08-06 2005-06-07 Kemet Electronics Clip-on leadframe for large ceramic SMD
JP5884653B2 (ja) * 2011-09-01 2016-03-15 株式会社村田製作所 実装構造
JP2013122939A (ja) * 2011-12-09 2013-06-20 Sony Corp 回路基板
WO2016017634A1 (ja) * 2014-07-30 2016-02-04 京セラ株式会社 積層型電子部品およびその実装構造体
US11257623B2 (en) * 2020-01-15 2022-02-22 Samsung Electro-Mechanics Co., Ltd. Multilayered electronic component and board having the same mounted thereon
JP7540416B2 (ja) * 2021-10-01 2024-08-27 株式会社村田製作所 電子部品の実装構造

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