JPWO2024185702A5 - - Google Patents

Info

Publication number
JPWO2024185702A5
JPWO2024185702A5 JP2025505308A JP2025505308A JPWO2024185702A5 JP WO2024185702 A5 JPWO2024185702 A5 JP WO2024185702A5 JP 2025505308 A JP2025505308 A JP 2025505308A JP 2025505308 A JP2025505308 A JP 2025505308A JP WO2024185702 A5 JPWO2024185702 A5 JP WO2024185702A5
Authority
JP
Japan
Prior art keywords
multilayer ceramic
ceramic electronic
electronic component
along
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025505308A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024185702A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/007847 external-priority patent/WO2024185702A1/ja
Publication of JPWO2024185702A1 publication Critical patent/JPWO2024185702A1/ja
Publication of JPWO2024185702A5 publication Critical patent/JPWO2024185702A5/ja
Pending legal-status Critical Current

Links

JP2025505308A 2023-03-03 2024-03-01 Pending JPWO2024185702A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023032770 2023-03-03
PCT/JP2024/007847 WO2024185702A1 (ja) 2023-03-03 2024-03-01 回路基板

Publications (2)

Publication Number Publication Date
JPWO2024185702A1 JPWO2024185702A1 (https=) 2024-09-12
JPWO2024185702A5 true JPWO2024185702A5 (https=) 2025-12-25

Family

ID=92675069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505308A Pending JPWO2024185702A1 (https=) 2023-03-03 2024-03-01

Country Status (3)

Country Link
JP (1) JPWO2024185702A1 (https=)
CN (1) CN120917877A (https=)
WO (1) WO2024185702A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918095B2 (ja) * 2002-11-28 2007-05-23 株式会社村田製作所 積層セラミック電子部品及びその製造方法
JP2005050962A (ja) * 2003-07-31 2005-02-24 Taiyo Yuden Co Ltd コンデンサ実装構造，コンデンサ実装基板及びコンデンサ実装用配線基板
KR101565641B1 (ko) * 2013-04-17 2015-11-03 삼성전기주식회사 적층 세라믹 전자부품 및 그 실장 기판
JP7510741B2 (ja) * 2018-08-23 2024-07-04 太陽誘電株式会社 積層セラミック電子部品の製造方法
KR102283078B1 (ko) * 2019-09-10 2021-07-30 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법
KR102724891B1 (ko) * 2020-10-20 2024-11-01 삼성전기주식회사 적층형 전자 부품

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