JPWO2024185702A1 - - Google Patents
Info
- Publication number
- JPWO2024185702A1 JPWO2024185702A1 JP2025505308A JP2025505308A JPWO2024185702A1 JP WO2024185702 A1 JPWO2024185702 A1 JP WO2024185702A1 JP 2025505308 A JP2025505308 A JP 2025505308A JP 2025505308 A JP2025505308 A JP 2025505308A JP WO2024185702 A1 JPWO2024185702 A1 JP WO2024185702A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023032770 | 2023-03-03 | ||
| PCT/JP2024/007847 WO2024185702A1 (ja) | 2023-03-03 | 2024-03-01 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024185702A1 true JPWO2024185702A1 (https=) | 2024-09-12 |
| JPWO2024185702A5 JPWO2024185702A5 (https=) | 2025-12-25 |
Family
ID=92675069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025505308A Pending JPWO2024185702A1 (https=) | 2023-03-03 | 2024-03-01 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024185702A1 (https=) |
| CN (1) | CN120917877A (https=) |
| WO (1) | WO2024185702A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3918095B2 (ja) * | 2002-11-28 | 2007-05-23 | 株式会社村田製作所 | 積層セラミック電子部品及びその製造方法 |
| JP2005050962A (ja) * | 2003-07-31 | 2005-02-24 | Taiyo Yuden Co Ltd | コンデンサ実装構造，コンデンサ実装基板及びコンデンサ実装用配線基板 |
| KR101565641B1 (ko) * | 2013-04-17 | 2015-11-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장 기판 |
| JP7510741B2 (ja) * | 2018-08-23 | 2024-07-04 | 太陽誘電株式会社 | 積層セラミック電子部品の製造方法 |
| KR102283078B1 (ko) * | 2019-09-10 | 2021-07-30 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
| KR102724891B1 (ko) * | 2020-10-20 | 2024-11-01 | 삼성전기주식회사 | 적층형 전자 부품 |
-
2024
- 2024-03-01 CN CN202480016321.2A patent/CN120917877A/zh active Pending
- 2024-03-01 JP JP2025505308A patent/JPWO2024185702A1/ja active Pending
- 2024-03-01 WO PCT/JP2024/007847 patent/WO2024185702A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN120917877A (zh) | 2025-11-07 |
| WO2024185702A1 (ja) | 2024-09-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251216 |