JPWO2025099997A1 - - Google Patents
Info
- Publication number
- JPWO2025099997A1 JPWO2025099997A1 JP2025556197A JP2025556197A JPWO2025099997A1 JP WO2025099997 A1 JPWO2025099997 A1 JP WO2025099997A1 JP 2025556197 A JP2025556197 A JP 2025556197A JP 2025556197 A JP2025556197 A JP 2025556197A JP WO2025099997 A1 JPWO2025099997 A1 JP WO2025099997A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023190269 | 2023-11-07 | ||
| PCT/JP2024/025904 WO2025099997A1 (ja) | 2023-11-07 | 2024-07-19 | 電子部品の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025099997A1 true JPWO2025099997A1 (https=) | 2025-05-15 |
| JPWO2025099997A5 JPWO2025099997A5 (https=) | 2026-02-27 |
Family
ID=95695392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025556197A Pending JPWO2025099997A1 (https=) | 2023-11-07 | 2024-07-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025099997A1 (https=) |
| WO (1) | WO2025099997A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140918A (ja) * | 1997-07-22 | 1999-02-12 | Taiyo Yuden Co Ltd | セラミックス素子、部品実装基板及び配線基板 |
| US6903920B1 (en) * | 2004-08-06 | 2005-06-07 | Kemet Electronics | Clip-on leadframe for large ceramic SMD |
| JP5884653B2 (ja) * | 2011-09-01 | 2016-03-15 | 株式会社村田製作所 | 実装構造 |
| JP2013122939A (ja) * | 2011-12-09 | 2013-06-20 | Sony Corp | 回路基板 |
| WO2016017634A1 (ja) * | 2014-07-30 | 2016-02-04 | 京セラ株式会社 | 積層型電子部品およびその実装構造体 |
| US11257623B2 (en) * | 2020-01-15 | 2022-02-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayered electronic component and board having the same mounted thereon |
| JP7540416B2 (ja) * | 2021-10-01 | 2024-08-27 | 株式会社村田製作所 | 電子部品の実装構造 |
-
2024
- 2024-07-19 JP JP2025556197A patent/JPWO2025099997A1/ja active Pending
- 2024-07-19 WO PCT/JP2024/025904 patent/WO2025099997A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025099997A1 (ja) | 2025-05-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251126 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251126 |