JP2025084818A5 - - Google Patents

Info

Publication number
JP2025084818A5
JP2025084818A5 JP2025026197A JP2025026197A JP2025084818A5 JP 2025084818 A5 JP2025084818 A5 JP 2025084818A5 JP 2025026197 A JP2025026197 A JP 2025026197A JP 2025026197 A JP2025026197 A JP 2025026197A JP 2025084818 A5 JP2025084818 A5 JP 2025084818A5
Authority
JP
Japan
Prior art keywords
wiring board
ground
insulating substrate
lower ground
signal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025026197A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025084818A (ja
Filing date
Publication date
Priority claimed from PCT/JP2022/025487 external-priority patent/WO2023276923A1/ja
Application filed filed Critical
Publication of JP2025084818A publication Critical patent/JP2025084818A/ja
Publication of JP2025084818A5 publication Critical patent/JP2025084818A5/ja
Pending legal-status Critical Current

Links

JP2025026197A 2021-06-29 2025-02-20 配線板および電子装置 Pending JP2025084818A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021108105 2021-06-29
JP2021108105 2021-06-29
PCT/JP2022/025487 WO2023276923A1 (ja) 2021-06-29 2022-06-27 配線板および電子装置
JP2023531919A JP7640694B2 (ja) 2021-06-29 2022-06-27 配線板および電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2023531919A Division JP7640694B2 (ja) 2021-06-29 2022-06-27 配線板および電子装置

Publications (2)

Publication Number Publication Date
JP2025084818A JP2025084818A (ja) 2025-06-03
JP2025084818A5 true JP2025084818A5 (https=) 2025-09-18

Family

ID=84689889

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023531919A Active JP7640694B2 (ja) 2021-06-29 2022-06-27 配線板および電子装置
JP2025026197A Pending JP2025084818A (ja) 2021-06-29 2025-02-20 配線板および電子装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2023531919A Active JP7640694B2 (ja) 2021-06-29 2022-06-27 配線板および電子装置

Country Status (5)

Country Link
US (1) US20240292516A1 (https=)
EP (1) EP4365936A4 (https=)
JP (2) JP7640694B2 (https=)
CN (1) CN117529805A (https=)
WO (1) WO2023276923A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3610238B2 (ja) 1998-08-28 2005-01-12 京セラ株式会社 高周波用パッケージ
JP2002252505A (ja) 2001-02-26 2002-09-06 Kyocera Corp 高周波用配線基板
AU2003289129A1 (en) * 2002-12-05 2004-06-23 Matsushita Electric Industrial Co., Ltd. High-frequency circuit and high-frequency package
JP5273922B2 (ja) 2006-12-28 2013-08-28 株式会社アライドマテリアル 放熱部材および半導体装置
CN104488135A (zh) * 2012-08-01 2015-04-01 申泰公司 多层传输线
JP6270762B2 (ja) * 2015-03-23 2018-01-31 アンリツ株式会社 Ｉｃ回路
JP6881746B2 (ja) 2016-04-25 2021-06-02 住友電工デバイス・イノベーション株式会社 光半導体装置
CN107306009B (zh) * 2016-04-25 2021-04-13 住友电工光电子器件创新株式会社 在承载体上提供共面线的光发射器

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