JP7640694B2 - 配線板および電子装置 - Google Patents

配線板および電子装置 Download PDF

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Publication number
JP7640694B2
JP7640694B2 JP2023531919A JP2023531919A JP7640694B2 JP 7640694 B2 JP7640694 B2 JP 7640694B2 JP 2023531919 A JP2023531919 A JP 2023531919A JP 2023531919 A JP2023531919 A JP 2023531919A JP 7640694 B2 JP7640694 B2 JP 7640694B2
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JP
Japan
Prior art keywords
ground
insulating substrate
wiring board
lower ground
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023531919A
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English (en)
Japanese (ja)
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JPWO2023276923A1 (https=
Inventor
広一朗 菅井
進哉 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023276923A1 publication Critical patent/JPWO2023276923A1/ja
Priority to JP2025026197A priority Critical patent/JP2025084818A/ja
Application granted granted Critical
Publication of JP7640694B2 publication Critical patent/JP7640694B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2023531919A 2021-06-29 2022-06-27 配線板および電子装置 Active JP7640694B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025026197A JP2025084818A (ja) 2021-06-29 2025-02-20 配線板および電子装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021108105 2021-06-29
JP2021108105 2021-06-29
PCT/JP2022/025487 WO2023276923A1 (ja) 2021-06-29 2022-06-27 配線板および電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025026197A Division JP2025084818A (ja) 2021-06-29 2025-02-20 配線板および電子装置

Publications (2)

Publication Number Publication Date
JPWO2023276923A1 JPWO2023276923A1 (https=) 2023-01-05
JP7640694B2 true JP7640694B2 (ja) 2025-03-05

Family

ID=84689889

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023531919A Active JP7640694B2 (ja) 2021-06-29 2022-06-27 配線板および電子装置
JP2025026197A Pending JP2025084818A (ja) 2021-06-29 2025-02-20 配線板および電子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025026197A Pending JP2025084818A (ja) 2021-06-29 2025-02-20 配線板および電子装置

Country Status (5)

Country Link
US (1) US20240292516A1 (https=)
EP (1) EP4365936A4 (https=)
JP (2) JP7640694B2 (https=)
CN (1) CN117529805A (https=)
WO (1) WO2023276923A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252505A (ja) 2001-02-26 2002-09-06 Kyocera Corp 高周波用配線基板
JP2008166579A (ja) 2006-12-28 2008-07-17 Allied Material Corp 放熱部材および半導体装置
JP2016181737A (ja) 2015-03-23 2016-10-13 アンリツ株式会社 伝送線路
JP2017199906A (ja) 2016-04-25 2017-11-02 住友電工デバイス・イノベーション株式会社 光半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3610238B2 (ja) 1998-08-28 2005-01-12 京セラ株式会社 高周波用パッケージ
AU2003289129A1 (en) * 2002-12-05 2004-06-23 Matsushita Electric Industrial Co., Ltd. High-frequency circuit and high-frequency package
CN104488135A (zh) * 2012-08-01 2015-04-01 申泰公司 多层传输线
CN107306009B (zh) * 2016-04-25 2021-04-13 住友电工光电子器件创新株式会社 在承载体上提供共面线的光发射器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252505A (ja) 2001-02-26 2002-09-06 Kyocera Corp 高周波用配線基板
JP2008166579A (ja) 2006-12-28 2008-07-17 Allied Material Corp 放熱部材および半導体装置
JP2016181737A (ja) 2015-03-23 2016-10-13 アンリツ株式会社 伝送線路
JP2017199906A (ja) 2016-04-25 2017-11-02 住友電工デバイス・イノベーション株式会社 光半導体装置

Also Published As

Publication number Publication date
CN117529805A (zh) 2024-02-06
US20240292516A1 (en) 2024-08-29
JPWO2023276923A1 (https=) 2023-01-05
EP4365936A1 (en) 2024-05-08
EP4365936A4 (en) 2025-08-06
JP2025084818A (ja) 2025-06-03
WO2023276923A1 (ja) 2023-01-05

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