CN117529805A - 配线板及电子装置 - Google Patents

配线板及电子装置 Download PDF

Info

Publication number
CN117529805A
CN117529805A CN202280042931.0A CN202280042931A CN117529805A CN 117529805 A CN117529805 A CN 117529805A CN 202280042931 A CN202280042931 A CN 202280042931A CN 117529805 A CN117529805 A CN 117529805A
Authority
CN
China
Prior art keywords
ground
insulating substrate
wiring board
metal layer
signal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280042931.0A
Other languages
English (en)
Chinese (zh)
Inventor
菅井广一朗
樋口进哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN117529805A publication Critical patent/CN117529805A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
CN202280042931.0A 2021-06-29 2022-06-27 配线板及电子装置 Pending CN117529805A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021108105 2021-06-29
JP2021-108105 2021-06-29
PCT/JP2022/025487 WO2023276923A1 (ja) 2021-06-29 2022-06-27 配線板および電子装置

Publications (1)

Publication Number Publication Date
CN117529805A true CN117529805A (zh) 2024-02-06

Family

ID=84689889

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280042931.0A Pending CN117529805A (zh) 2021-06-29 2022-06-27 配线板及电子装置

Country Status (5)

Country Link
US (1) US20240292516A1 (https=)
EP (1) EP4365936A4 (https=)
JP (2) JP7640694B2 (https=)
CN (1) CN117529805A (https=)
WO (1) WO2023276923A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3610238B2 (ja) 1998-08-28 2005-01-12 京セラ株式会社 高周波用パッケージ
JP2002252505A (ja) 2001-02-26 2002-09-06 Kyocera Corp 高周波用配線基板
AU2003289129A1 (en) * 2002-12-05 2004-06-23 Matsushita Electric Industrial Co., Ltd. High-frequency circuit and high-frequency package
JP5273922B2 (ja) 2006-12-28 2013-08-28 株式会社アライドマテリアル 放熱部材および半導体装置
CN104488135A (zh) * 2012-08-01 2015-04-01 申泰公司 多层传输线
JP6270762B2 (ja) * 2015-03-23 2018-01-31 アンリツ株式会社 Ｉｃ回路
JP6881746B2 (ja) 2016-04-25 2021-06-02 住友電工デバイス・イノベーション株式会社 光半導体装置
CN107306009B (zh) * 2016-04-25 2021-04-13 住友电工光电子器件创新株式会社 在承载体上提供共面线的光发射器

Also Published As

Publication number Publication date
US20240292516A1 (en) 2024-08-29
JPWO2023276923A1 (https=) 2023-01-05
EP4365936A1 (en) 2024-05-08
EP4365936A4 (en) 2025-08-06
JP2025084818A (ja) 2025-06-03
JP7640694B2 (ja) 2025-03-05
WO2023276923A1 (ja) 2023-01-05

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