JPWO2023145651A5 - - Google Patents

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Publication number
JPWO2023145651A5
JPWO2023145651A5 JP2023576876A JP2023576876A JPWO2023145651A5 JP WO2023145651 A5 JPWO2023145651 A5 JP WO2023145651A5 JP 2023576876 A JP2023576876 A JP 2023576876A JP 2023576876 A JP2023576876 A JP 2023576876A JP WO2023145651 A5 JPWO2023145651 A5 JP WO2023145651A5
Authority
JP
Japan
Prior art keywords
ground conductor
signal line
wiring board
board according
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023576876A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145651A1 (https=
JP7753403B2 (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001745 external-priority patent/WO2023145651A1/ja
Publication of JPWO2023145651A1 publication Critical patent/JPWO2023145651A1/ja
Publication of JPWO2023145651A5 publication Critical patent/JPWO2023145651A5/ja
Application granted granted Critical
Publication of JP7753403B2 publication Critical patent/JP7753403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023576876A 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753403B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012043 2022-01-28
JP2022012043 2022-01-28
PCT/JP2023/001745 WO2023145651A1 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145651A1 JPWO2023145651A1 (https=) 2023-08-03
JPWO2023145651A5 true JPWO2023145651A5 (https=) 2024-09-30
JP7753403B2 JP7753403B2 (ja) 2025-10-14

Family

ID=87471877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576876A Active JP7753403B2 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (4)

Country Link
US (1) US20250151200A1 (https=)
JP (1) JP7753403B2 (https=)
CN (1) CN118613907A (https=)
WO (1) WO2023145651A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025063160A1 (ja) * 2023-09-19 2025-03-27 京セラ株式会社 配線構造体および電子モジュール
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300104B1 (en) * 2015-05-20 2026-01-21 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure
JP6777755B2 (ja) * 2016-10-21 2020-10-28 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
JP6923431B2 (ja) * 2017-12-25 2021-08-18 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
CN113519048B (zh) * 2019-03-07 2024-09-24 京瓷株式会社 布线基板、电子部件用封装体以及电子装置

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