JPWO2023145651A5 - - Google Patents

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Publication number
JPWO2023145651A5
JPWO2023145651A5 JP2023576876A JP2023576876A JPWO2023145651A5 JP WO2023145651 A5 JPWO2023145651 A5 JP WO2023145651A5 JP 2023576876 A JP2023576876 A JP 2023576876A JP 2023576876 A JP2023576876 A JP 2023576876A JP WO2023145651 A5 JPWO2023145651 A5 JP WO2023145651A5
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JP
Japan
Prior art keywords
ground conductor
signal line
wiring board
board according
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023576876A
Other languages
English (en)
Japanese (ja)
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JPWO2023145651A1 (https=
JP7753403B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001745 external-priority patent/WO2023145651A1/ja
Publication of JPWO2023145651A1 publication Critical patent/JPWO2023145651A1/ja
Publication of JPWO2023145651A5 publication Critical patent/JPWO2023145651A5/ja
Application granted granted Critical
Publication of JP7753403B2 publication Critical patent/JP7753403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023576876A 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753403B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012043 2022-01-28
JP2022012043 2022-01-28
PCT/JP2023/001745 WO2023145651A1 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145651A1 JPWO2023145651A1 (https=) 2023-08-03
JPWO2023145651A5 true JPWO2023145651A5 (https=) 2024-09-30
JP7753403B2 JP7753403B2 (ja) 2025-10-14

Family

ID=87471877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576876A Active JP7753403B2 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (4)

Country Link
US (1) US20250151200A1 (https=)
JP (1) JP7753403B2 (https=)
CN (1) CN118613907A (https=)
WO (1) WO2023145651A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
CN121866902A (zh) * 2023-09-19 2026-04-14 京瓷株式会社 布线结构体以及电子模块
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016186128A1 (ja) * 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
US10869387B2 (en) * 2016-10-21 2020-12-15 Kyocera Corporation High-frequency board, high-frequency package, and high-frequency module
JP6923431B2 (ja) * 2017-12-25 2021-08-18 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
JP7145311B2 (ja) * 2019-03-07 2022-09-30 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

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