CN118613907A - 布线基板、使用了布线基板的电子部件安装用封装体及电子模块 - Google Patents

布线基板、使用了布线基板的电子部件安装用封装体及电子模块 Download PDF

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Publication number
CN118613907A
CN118613907A CN202380018332.XA CN202380018332A CN118613907A CN 118613907 A CN118613907 A CN 118613907A CN 202380018332 A CN202380018332 A CN 202380018332A CN 118613907 A CN118613907 A CN 118613907A
Authority
CN
China
Prior art keywords
signal line
ground conductor
opening
line
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380018332.XA
Other languages
English (en)
Chinese (zh)
Inventor
川头芳规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118613907A publication Critical patent/CN118613907A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN202380018332.XA 2022-01-28 2023-01-20 布线基板、使用了布线基板的电子部件安装用封装体及电子模块 Pending CN118613907A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-012043 2022-01-28
JP2022012043 2022-01-28
PCT/JP2023/001745 WO2023145651A1 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (1)

Publication Number Publication Date
CN118613907A true CN118613907A (zh) 2024-09-06

Family

ID=87471877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380018332.XA Pending CN118613907A (zh) 2022-01-28 2023-01-20 布线基板、使用了布线基板的电子部件安装用封装体及电子模块

Country Status (4)

Country Link
US (1) US20250151200A1 (https=)
JP (1) JP7753403B2 (https=)
CN (1) CN118613907A (https=)
WO (1) WO2023145651A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025063160A1 (ja) * 2023-09-19 2025-03-27 京セラ株式会社 配線構造体および電子モジュール
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3300104B1 (en) * 2015-05-20 2026-01-21 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure
JP6777755B2 (ja) * 2016-10-21 2020-10-28 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
JP6923431B2 (ja) * 2017-12-25 2021-08-18 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
CN113519048B (zh) * 2019-03-07 2024-09-24 京瓷株式会社 布线基板、电子部件用封装体以及电子装置

Also Published As

Publication number Publication date
JPWO2023145651A1 (https=) 2023-08-03
WO2023145651A1 (ja) 2023-08-03
US20250151200A1 (en) 2025-05-08
JP7753403B2 (ja) 2025-10-14

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