JP7753403B2 - 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール - Google Patents

配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Info

Publication number
JP7753403B2
JP7753403B2 JP2023576876A JP2023576876A JP7753403B2 JP 7753403 B2 JP7753403 B2 JP 7753403B2 JP 2023576876 A JP2023576876 A JP 2023576876A JP 2023576876 A JP2023576876 A JP 2023576876A JP 7753403 B2 JP7753403 B2 JP 7753403B2
Authority
JP
Japan
Prior art keywords
ground conductor
opening
signal line
wiring board
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023576876A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145651A1 (https=
JPWO2023145651A5 (https=
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023145651A1 publication Critical patent/JPWO2023145651A1/ja
Publication of JPWO2023145651A5 publication Critical patent/JPWO2023145651A5/ja
Application granted granted Critical
Publication of JP7753403B2 publication Critical patent/JP7753403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023576876A 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753403B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012043 2022-01-28
JP2022012043 2022-01-28
PCT/JP2023/001745 WO2023145651A1 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145651A1 JPWO2023145651A1 (https=) 2023-08-03
JPWO2023145651A5 JPWO2023145651A5 (https=) 2024-09-30
JP7753403B2 true JP7753403B2 (ja) 2025-10-14

Family

ID=87471877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576876A Active JP7753403B2 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (4)

Country Link
US (1) US20250151200A1 (https=)
JP (1) JP7753403B2 (https=)
CN (1) CN118613907A (https=)
WO (1) WO2023145651A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025063160A1 (ja) * 2023-09-19 2025-03-27 京セラ株式会社 配線構造体および電子モジュール
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016186128A1 (ja) 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
JP2019114689A (ja) 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
WO2020179937A1 (ja) 2019-03-07 2020-09-10 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777755B2 (ja) * 2016-10-21 2020-10-28 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016186128A1 (ja) 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
JP2019114689A (ja) 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
WO2020179937A1 (ja) 2019-03-07 2020-09-10 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Also Published As

Publication number Publication date
CN118613907A (zh) 2024-09-06
JPWO2023145651A1 (https=) 2023-08-03
WO2023145651A1 (ja) 2023-08-03
US20250151200A1 (en) 2025-05-08

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