JPWO2023145651A1 - - Google Patents

Info

Publication number
JPWO2023145651A1
JPWO2023145651A1 JP2023576876A JP2023576876A JPWO2023145651A1 JP WO2023145651 A1 JPWO2023145651 A1 JP WO2023145651A1 JP 2023576876 A JP2023576876 A JP 2023576876A JP 2023576876 A JP2023576876 A JP 2023576876A JP WO2023145651 A1 JPWO2023145651 A1 JP WO2023145651A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023576876A
Other languages
Japanese (ja)
Other versions
JP7753403B2 (ja
JPWO2023145651A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023145651A1 publication Critical patent/JPWO2023145651A1/ja
Publication of JPWO2023145651A5 publication Critical patent/JPWO2023145651A5/ja
Application granted granted Critical
Publication of JP7753403B2 publication Critical patent/JP7753403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023576876A 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7753403B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012043 2022-01-28
JP2022012043 2022-01-28
PCT/JP2023/001745 WO2023145651A1 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145651A1 true JPWO2023145651A1 (https=) 2023-08-03
JPWO2023145651A5 JPWO2023145651A5 (https=) 2024-09-30
JP7753403B2 JP7753403B2 (ja) 2025-10-14

Family

ID=87471877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576876A Active JP7753403B2 (ja) 2022-01-28 2023-01-20 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (4)

Country Link
US (1) US20250151200A1 (https=)
JP (1) JP7753403B2 (https=)
CN (1) CN118613907A (https=)
WO (1) WO2023145651A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240027493A1 (en) * 2020-11-27 2024-01-25 Kyocera Corporation Wiring board and probe card
WO2025063160A1 (ja) * 2023-09-19 2025-03-27 京セラ株式会社 配線構造体および電子モジュール
WO2025070079A1 (ja) * 2023-09-29 2025-04-03 京セラ株式会社 配線基板および電子モジュール
WO2025225641A1 (ja) * 2024-04-25 2025-10-30 京セラ株式会社 配線基板、パッケージ及び光モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016186128A1 (ja) * 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
WO2018074100A1 (ja) * 2016-10-21 2018-04-26 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
JP2019114689A (ja) * 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
WO2020179937A1 (ja) * 2019-03-07 2020-09-10 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016186128A1 (ja) * 2015-05-20 2016-11-24 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体
WO2018074100A1 (ja) * 2016-10-21 2018-04-26 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
JP2019114689A (ja) * 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール
WO2020179937A1 (ja) * 2019-03-07 2020-09-10 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Also Published As

Publication number Publication date
CN118613907A (zh) 2024-09-06
WO2023145651A1 (ja) 2023-08-03
US20250151200A1 (en) 2025-05-08
JP7753403B2 (ja) 2025-10-14

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