JPWO2023145817A5 - - Google Patents

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Publication number
JPWO2023145817A5
JPWO2023145817A5 JP2023576976A JP2023576976A JPWO2023145817A5 JP WO2023145817 A5 JPWO2023145817 A5 JP WO2023145817A5 JP 2023576976 A JP2023576976 A JP 2023576976A JP 2023576976 A JP2023576976 A JP 2023576976A JP WO2023145817 A5 JPWO2023145817 A5 JP WO2023145817A5
Authority
JP
Japan
Prior art keywords
signal line
wiring board
board according
slit
composite wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023576976A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145817A1 (https=
JP7789097B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/002420 external-priority patent/WO2023145817A1/ja
Publication of JPWO2023145817A1 publication Critical patent/JPWO2023145817A1/ja
Publication of JPWO2023145817A5 publication Critical patent/JPWO2023145817A5/ja
Application granted granted Critical
Publication of JP7789097B2 publication Critical patent/JP7789097B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023576976A 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置 Active JP7789097B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022012614 2022-01-31
JP2022012614 2022-01-31
PCT/JP2023/002420 WO2023145817A1 (ja) 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置

Publications (3)

Publication Number Publication Date
JPWO2023145817A1 JPWO2023145817A1 (https=) 2023-08-03
JPWO2023145817A5 true JPWO2023145817A5 (https=) 2024-10-04
JP7789097B2 JP7789097B2 (ja) 2025-12-19

Family

ID=87471549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576976A Active JP7789097B2 (ja) 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置

Country Status (4)

Country Link
US (1) US20250142718A1 (https=)
EP (1) EP4475634A1 (https=)
JP (1) JP7789097B2 (https=)
WO (1) WO2023145817A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3493301B2 (ja) * 1998-01-26 2004-02-03 京セラ株式会社 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
JP2008160750A (ja) * 2006-12-26 2008-07-10 Toshiba Corp マイクロ波回路基板
JP6437886B2 (ja) * 2015-06-16 2018-12-12 日本電信電話株式会社 高周波接続線路
WO2019050046A1 (ja) * 2017-09-11 2019-03-14 Ｎｇｋエレクトロデバイス株式会社 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ

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