WO2023145817A1 - 複合配線基板、電子部品収容用パッケージ及び電子装置 - Google Patents

複合配線基板、電子部品収容用パッケージ及び電子装置 Download PDF

Info

Publication number
WO2023145817A1
WO2023145817A1 PCT/JP2023/002420 JP2023002420W WO2023145817A1 WO 2023145817 A1 WO2023145817 A1 WO 2023145817A1 JP 2023002420 W JP2023002420 W JP 2023002420W WO 2023145817 A1 WO2023145817 A1 WO 2023145817A1
Authority
WO
WIPO (PCT)
Prior art keywords
signal line
wiring board
slit
composite wiring
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/002420
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2023576976A priority Critical patent/JP7789097B2/ja
Priority to EP23747027.3A priority patent/EP4475634A1/en
Priority to US18/834,246 priority patent/US20250142718A1/en
Publication of WO2023145817A1 publication Critical patent/WO2023145817A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Definitions

  • the present disclosure relates to a composite wiring board, an electronic component housing package, and an electronic device.
  • the composite wiring board according to the present disclosure is a wiring board having a first bonding region; a flexible substrate having a second bonding region overlapping the first bonding region;
  • the wiring board is a first signal line; a notch adjacent to the first signal line,
  • the flexible substrate is a second signal line joined to the first signal line; a slit adjacent to the second signal line, The notch is located in the first joint region in planar perspective, The slit is located in the second bonding area in planar see-through.
  • the package for housing electronic components includes: the above composite wiring board; a frame positioned on the wiring board; Prepare.
  • An electronic device includes: the electronic component housing package; an electronic component positioned within the frame; Prepare.
  • FIG. 1 is a perspective view showing a main part of a composite wiring board according to Embodiment 1 of the present disclosure
  • FIG. FIG. 2 is a back side perspective view showing a main part of the composite wiring board according to Embodiment 1 of the present disclosure
  • FIG. 3 is a plan view of the front side showing the main part of the flexible substrate
  • FIG. 4 is a plan view of the back side showing the main part of the flexible substrate
  • 3 is a plan view showing a main part of the wiring board
  • FIG. FIG. 3 is a vertical cross-sectional view showing the vicinity of a junction of signal lines
  • FIG. 3 is a plan view showing the vicinity of a junction of signal lines
  • FIG. 4C is a diagram illustrating the width of each part in the cross section taken along line AA of FIG.
  • FIG. 4B; FIG. 4C is a diagram for explaining the overlapping region in the cross section taken along line AA of FIG. 4B;
  • 5 is a graph showing frequency characteristics of the composite wiring board of Embodiment 1 and a comparative example; 5 is a graph showing impedance characteristics of the composite wiring board of Embodiment 1 and a comparative example;
  • FIG. 5 is a cross-sectional view showing a composite wiring board of Embodiment 2;
  • FIG. 11 is a cross-sectional view showing a composite wiring board of Embodiment 3;
  • FIG. 11 is a perspective view showing a composite wiring board of Embodiment 4;
  • FIG. 4 is a diagram showing slits of Embodiments 1 to 4; It is a figure which shows the modification 1 of a slit. It is a figure which shows the modification 2 of a slit. It is a figure which shows the modification 3 of a slit. It is a figure which shows the modification 4 of a slit.
  • FIG. 11 is a diagram showing a modified example 5 of the slit;
  • FIG. 11 is a diagram showing a sixth modified example of the slit;
  • FIG. 11 is a vertical cross-sectional view showing modification 7 of the notch of the wiring board;
  • FIG. 11 is a vertical cross-sectional view showing Modified Example 8 of the notch of the wiring board;
  • FIG. 11 is a vertical cross-sectional view showing Modified Example 9 of the notch of the wiring board;
  • 1 is a perspective view showing an electronic component housing package and an electronic device according to an embodiment of the present disclosure;
  • FIG. FIG. 4 is a perspective view showing another example of the electronic component housing package according to the embodiment of the present disclosure;
  • FIG. 1A is a perspective view showing a main part of a composite wiring board according to Embodiment 1 of the present disclosure
  • FIG. 1B is a back side perspective view showing a main part of the composite wiring board according to Embodiment 1 of the present disclosure
  • FIG. 2A and 2B are a plan view of the front side and a plan view of the back side, respectively, showing the main part of the flexible substrate.
  • FIG. 3 is a plan view showing the essential parts of the wiring board.
  • a composite wiring board 10 according to Embodiment 1 includes a wiring board 20 and a flexible board 30 .
  • the wiring board 20 has an insulating substrate 21, a first signal line 22 located on the insulating substrate 21, and a recess 24 as a notch.
  • the recess 24 is adjacent to the first signal line 22 .
  • the direction in which the first signal line 22 and the recess 24 are adjacent to each other may be the line width direction of the first signal line 22, the line direction, or a direction oblique to the line width direction. may When adjacent to each other, the center line in the line direction of the first signal line 22 and the center line in the longitudinal direction of the concave portion 24 may or may not be parallel.
  • the recess 24 may be positioned around the first signal line 22 .
  • the vicinity of the first signal line 22 means that it is close enough to affect the transmission characteristics of the first signal line 22 , and the distance from the first signal line 22 is 2 of the line width of the first signal line 22 . It may mean less than double.
  • the wiring board 20 may further have a ground conductor 23 located on the insulating substrate 21 .
  • the insulating substrate 21 may be ceramic or resin. 1 to 5 show an example in which the wiring board 20 is integrated with the frame 52, but the frame 52 may be omitted.
  • the insulating substrate 21 may be plate-shaped without the frame 52 .
  • the frame body 52 may be formed integrally with the wiring board 20 or may be formed separately and joined to the wiring board 20 .
  • Another member may be provided between the insulating substrate 21 and the frame 52 .
  • the first signal line 22 is a signal line that transmits high frequency signals.
  • the first signal line 22 may have a single-ended configuration that is one signal line, or may include two signal lines, that is, a 1a signal line 22a and a 1b signal line 22b.
  • the 1a-th signal line 22a and the 1b-th signal line 22b may be arranged in parallel with each other.
  • the 1a-th signal line 22a and the 1b-th signal line 22b may be signal lines through which differential signals are transmitted.
  • the first signal line 22 (that is, the 1a signal line 22a and the 1b signal line 22b) may be located on the upper surface of the insulating substrate 21. A portion of the first signal line 22 may be located on the upper surface of the insulating substrate 21 and the remaining portion may be located inside or on the back surface of the insulating substrate 21 . When the frame 52 is provided, part of the first signal line 22 may be located inside the frame 52 (for example, between the frame 52 and the insulating substrate 21).
  • the recess 24 may be located between the 1a signal line 22a and the 1b signal line 22b.
  • the recess 24 may have a shape elongated in the direction along the signal line.
  • the concave portion 24 may have an oval shape or a rectangular shape when viewed through a plane. Planar viewing means viewing from a direction perpendicular to the board surface of the wiring board 20 on which the first signal line 22 is located.
  • the recess 24 may be open on the substrate surface.
  • the concave portion 24 may be tapered, reverse tapered, or stepped in a cross-sectional view.
  • the tapered shape is a shape in which the open side of the recess 24 is wider than the bottom side
  • the reverse tapered shape is a shape in which the bottom side of the recessed portion 24 is wider than the open side.
  • the concave portion 24 may be spaced apart from or in contact with the 1a signal line 22a and the 1b signal line 22b.
  • the ground conductor 23 is composed of ground film conductors 23a and 23b (see FIG. 3) located on both sides of the first signal line 22 (that is, the 1a signal line 22a and the 1b signal line 22b) and the bottom surface of the recess 24.
  • grounding film conductor 23c see FIG. 3
  • grounding film conductor 23d extending below first signal line 22, and frame 52
  • first signal line in frame 52 a grounding film conductor 23e (see FIG. 1A) extending above the line 22, a ground via conductor 23v1 (see FIG. 1A) connecting the grounding film conductors 23a, 23b, 23c and the grounding film conductor 23d in the lower layer;
  • a ground via conductor 23v2 (see FIG.
  • the ground conductor 23 further includes a ground line 23h (see FIG. 3) located between the 1a signal line 22a and the 1b signal line 22b, and the ground line 23h and the lower or upper layer ground film conductors 23d and 23e. It may also include ground via conductors (not shown) that are electrically connected.
  • the ground film conductors 23a and 23b are arranged with a gap between the first signal line 22 (that is, the 1a signal line 22a and the 1b signal line 22b) in the direction along the signal line and the line width direction of the signal line. It may be in the form of a film that spreads across the surface.
  • the ground line 23h may be located between the 1a signal line 22a and the 1b signal line 22b in a region other than the area where the recess 24 is located.
  • the wiring substrate 20 has a first bonding region R1 on which the flexible substrate 30 overlaps, as shown in FIGS. 1A, 1B and 3 .
  • the wiring board 20 may have a first edge E20 intersecting the extension line of the first signal line 22 on one of the substrate surfaces, and the first junction region R1 may be a region including the first edge E20.
  • the first joint region R1 may extend to the bottom of the frame 52 . That is, the frame 52 and the edge of the flexible substrate 30 may be in contact with each other.
  • the first junction region R1 includes a portion of the first signal line 22 (that is, the 1a signal line 22a and the 1b signal line 22b), the concave portion 24, and the ground film conductor. A part of 23a, 23b and a ground film conductor 23c may be located.
  • a part of the 1a signal line 22a and the 1b signal line 22b, including the line ends, may be located in the first junction region R1.
  • One end of the 1a signal line 22a and one end of the 1b signal line 22b may be separated from the first edge E20.
  • the 1a-th signal line 22a and the 1b-th signal line 22b may be exposed on the first junction region R1.
  • the recess 24 may be located entirely in the first joint region R1.
  • the ground film conductors 23a and 23b may extend from the first edge E20 to the opposite edge in the first bonding region R1. In other words, the ground film conductors 23a and 23b may extend from the first edge E20 to a position overlapping the second edge E30 of the flexible substrate 30 in plan see-through.
  • the interval between the two ground film conductors 23a and 23b located across the first signal line 22 (specifically, the interval in the line width direction of the signal line) is It may be narrow, wide at the central portion of the first bonding region R1, and narrow at the edge opposite to the first edge E20.
  • the ground film conductors 23a and 23b may be exposed on the first junction region R1.
  • the ground film conductor 23c may be positioned on the bottom surface of the recess 24.
  • An insulating film 25 may cover the bottom surface of the recess 24 and the upper side of the ground film conductor 23c.
  • the insulating film 25 may be an alumina coat.
  • the first signal line 22 or the recess 24 may be in contact with the first edge E20.
  • the recess 24 may be open to the end surface of the wiring board 20 .
  • the recess 24 may be a hole penetrating from the upper surface to the lower surface of the wiring board 20 .
  • the flexible substrate 30 may have a flexible sheet-like insulating substrate 31 .
  • the insulating base 31 has a first surface S1 and a second surface S2 located opposite to the first surface S1.
  • the flexible substrate 30 has a second signal line 32 located on the first surface S1.
  • the second signal lines 32 are lines partially joined to the first signal lines 22 of the wiring board 20 and may have the same number of lines as the first signal lines 22 . Therefore, the second signal line 32 may include two signal lines, namely a 2a signal line 32a and a 2b signal line 32b.
  • the 2a-th signal line 32a and the 2b-th signal line 32b may be arranged in parallel with each other.
  • the 2a-th signal line 32a and the 2b-th signal line 32b may be signal lines through which differential signals are transmitted.
  • the second signal line 32 may have electrode pads 32c and 32d with a wider line width than other portions.
  • the electrode pads 32 c and 32 d may have a shape elongated in the direction along the signal line and may be positioned at the end of the second signal line 32 .
  • the flexible substrate 30 further has a slit 35 adjacent to the second signal line 32 .
  • the direction in which the second signal line 32 and the slit 35 are adjacent to each other may be the line width direction of the second signal line 32, the line direction, or a direction oblique to the line width direction. may When adjacent to each other, the line direction center line of the second signal line 32 and the longitudinal center line of the slit 35 need not be parallel.
  • the slit 35 may be positioned around the second signal line 32 .
  • the vicinity of the second signal line 32 means that the transmission characteristics of the second signal line 32 are affected. It may mean less than double.
  • the slit 35 may be positioned from the first surface S1 to the second surface S2.
  • the inside of the slit 35 may be a void.
  • the shape of the slit 35 may be rectangular, circular, oval, elliptical, or the like. Also, the width of the slit 35 may increase with distance from the second edge E30, or may decrease with distance from the second edge E30.
  • the slit 35 may be tapered, reverse tapered, or stepped in cross section.
  • the tapered shape is a shape in which the side surfaces are inclined so that the dimension in height of the second surface S2 is larger than the dimension in height of the first surface S1.
  • the inverse tapered shape is a shape in which the side surfaces are inclined so that the height dimension of the second surface S2 is smaller than the height dimension of the first surface S1.
  • the slit 35 may be spaced from or in contact with the second signal line 32 .
  • the flexible substrate 30 may further include film conductors, which will be described later, located on the first surface S1 and the second surface S2, and via conductors, which will be described later, located from the first surface S1 to the second surface S2.
  • the above film conductors are electrode film conductors 33a and 33b positioned on the second surface S2, a second ground film conductor 33e positioned on the second surface S2, and both sides of the first surface S1 across the second signal line 32.
  • the electrode film conductors 33 a and 33 b may be positioned to face the electrode pads 32 c and 32 d of the second signal line 32 .
  • the second grounding film conductor 33e may extend around the electrode film conductors 33a and 33b with a gap therebetween to surround the electrode film conductors 33a and 33b from three directions. The three directions are both of the line width directions of the signal line and one direction along the signal line.
  • the via conductors are electrode via conductors 34a to 34d that connect the electrode pads 32c and 32d and the electrode film conductors 33a and 33b, and a plurality of via conductors that connect the first ground film conductors 33c and 33d and the second ground film conductor 33e. ground via conductors (not shown).
  • the plurality of ground via conductors may be arranged along the signal lines on both sides of the 2a-th signal line 32a and the 2b-th signal line 32b.
  • the flexible substrate 30 has a second bonding region R2 overlapping the first bonding region R1 of the wiring board 20, as shown in FIGS. 2A and 2B.
  • the flexible substrate 30 may have a second edge E30 crossing the extension of the second signal line 32 on one side, and the second bonding area R2 may be an area including the second edge E30.
  • the electrode pads 32c and 32d of the second signal line 32, parts of the first ground film conductors 33c and 33d, and the slit 35 may be positioned in the second junction region R2.
  • the electrode film conductors 33a and 33b, a portion of the second ground film conductor 33e, and the slit 35 may be positioned on the opposite surface of the second joint region R2.
  • the electrode pads 32c, 32d, the first grounding film conductors 33c, 33d, the electrode film conductors 33a, 33b, and the second grounding film conductor 33e may be separated from the second edge E30.
  • the slit 35 may be positioned across the second edge E30.
  • the electrode film conductors 33a and 33b may be wider at the portions connected to the electrode via conductors 34a to 34d than at other portions.
  • the contour lines of the electrode film conductors 33a and 33b are uneven (specifically, widthwise) in which portions protruding in the line width direction and recessed portions in the line width direction are alternately positioned in the direction along the signal line.
  • N1, N2 may be provided, with a concave portion of the narrow portion and a convex portion of the wide portion.
  • the second grounding film conductor 33e has unevenness N3 in which a portion protruding in the line width direction and a portion recessed in the line width direction are alternately located in a portion facing the electrode film conductors 33a and 33b in the line width direction of the signal line. , N4.
  • the projecting portion may be a portion to which a ground via conductor is connected.
  • the irregularities N1 and N2 of the electrode film conductors 33a and 33b and the irregularities N3 and N4 of the second ground film conductor 33e may be arranged in a zigzag manner.
  • the concave portions of the unevenness N1 and N2 and the convex portions of the unevenness N3 and N4 are aligned in the line width direction, and the convex portions of the unevenness N1 and N2 and the concave portions of the unevenness N3 and N4 are aligned in the line width direction.
  • 4A and 4B are a longitudinal sectional view and a plan view, respectively, showing the vicinity of the junction of the signal line.
  • 5A and 5B are cross-sectional views taken along line AA of FIG. 4B.
  • 5A and 5B show the same location.
  • the first bonding region R1 of the wiring substrate 20 and the second bonding region R2 of the flexible substrate 30 overlap.
  • a portion of the first bonding region R1 and a portion of the second bonding region R2 may be bonded via a conductive bonding material F such as brazing material (FIGS. 4A, 5A, and 5B).
  • a conductive bonding material F such as brazing material (FIGS. 4A, 5A, and 5B).
  • the first signal line 22 in the first joint region R1 and the electrode pads 32c and 32d in the second joint region R2 are jointed via the joint material F (that is, the second signal line 32 is jointed)
  • the grounding film conductors 23a, 23b in the first bonding region R1 and the first grounding film conductors 33c, 33d (see FIG. 2B) in the second bonding region R2 may be bonded via a bonding material F.
  • the wiring board 20 has the first signal line 22 and the recess 24 as a notch adjacent to the first signal line 22 .
  • the flexible substrate 30 has a second signal line 32 and a slit 35 adjacent to the second signal line 32 .
  • the recess 24 is located in the first bonding region R1, and the slit 35 is located in the second bonding region R2. According to this configuration, it is possible to reduce an increase in the capacitance component (for example, electrostatic capacitance component) around the junction between the first signal line 22 and the second signal line 32 .
  • the capacitance component for example, electrostatic capacitance component
  • the presence of the wiring substrate 20 and the insulating substrate 31 having a high relative permittivity at the junction increases the capacitance component around the first signal line 22 and the second signal line 32, and the characteristic impedance tends to decrease.
  • the presence of the slit 35 can reduce the dielectric constant of the insulating base 31 around the second signal line 32 . Therefore, it is possible to reduce the increase in the capacitance component of the second signal line 32 at the junction.
  • the presence of the concave portion 24 can reduce the dielectric constant of the insulating substrate 21 around the first signal line 22 . Therefore, it is possible to reduce the increase in the capacitance component of the first signal line 22 at the junction.
  • the possibility of increasing the capacitance component is reduced, and the matching of the characteristic impedance can be improved. Therefore, the high-frequency signal transmission characteristics of the composite wiring board 10 can be improved.
  • the slit 35 may be located across the second edge E30 of the flexible substrate 30 as described above. According to this configuration, it is possible to further reduce the increase in the capacitance component around the second signal line 32 . Therefore, it is possible to efficiently reduce the increase in the capacitive component at the junction between the first signal line 22 and the second signal line 32 . Therefore, it is possible to further improve the matching of the characteristic impedance at the junction, and to further improve the transmission characteristics of the high-frequency signal.
  • the second signal line 32 includes a 2a signal line 32a and a 2b signal line 32b parallel to each other, and as described above, the slit 35 is positioned between the 2a signal line 32a and the 2b signal line 32b.
  • the first signal line 22 of the wiring board 20 includes the 1a signal line 22a and the 1b signal line 22b.
  • the recessed portion 24 as a notch and the slit 35 may at least partially overlap when seen from above (see FIG. 4B).
  • the capacitive component of the insulating substrate 21 and the capacitive component of the insulating base 31 can be reduced at symmetrical portions on the insulating substrate 21 side and the insulating base 31 side. Therefore, it is possible to reduce the difference in characteristic impedance between the junction between the first signal line 22 and the second signal line 32 and the front and rear stages of the junction. Therefore, the transmission characteristics of high frequency signals can be improved.
  • each of the recesses 24 and the slits 35 overlaps by 50% or more in terms of area ratio in planar perspective (that is, 50% or more of the total area of the recesses 24 overlaps the slits 35 in planar perspective, and the total area of the slits 35 50% or more of the area overlaps with the concave portion 24).
  • the capacitive component of the insulating substrate 21 and the capacitive component of the insulating base 31 can be reduced by overlapping by 50% or more in area ratio.
  • the dimension L2 of the slit 35 in the direction along the signal line may be longer than the dimension L1 of the recess 24 in that direction (see FIG. 3). According to this configuration, even if there is an error in the joining position along the signal line, the overlapping length of the slit 35 and the concave portion 24 can be stably secured. Therefore, it is possible to stably reduce the increase in the capacitance component at the junction, and stably improve the transmission characteristics of high-frequency signals.
  • the width W1 of the recess 24 (specifically, the width in the line width direction of the signal line, see FIGS. 3 and 5A) is the width W2 of the slit 35 (specifically, the width in the line width direction of the signal line, FIG. 2B and FIG. 5A).
  • this configuration it is possible to reduce the overlap of the slit 35 with a part of the first signal line 22 even if an error occurs in the joint position in the width direction of the signal line. Therefore, it is possible to stably realize a structure in which the flexible substrate 30 overlaps the first signal line 22 in the first joint region R1. Therefore, occurrence of large individual differences in characteristic impedance can be reduced. Therefore, stable transmission characteristics of high-frequency signals can be realized.
  • the thickness D1 of the concave portion 24 (that is, the length in the direction perpendicular to the substrate surface) may be greater than the thickness D2 of the slit 35 (see FIG. 5A).
  • the thickness D1 of the recess 24 may be defined as the minimum distance from the substrate surface to the bottom surface of the recess 24, for example.
  • the dimension L2 of the slit 35 may be longer than the dimension L3 of the overlapping region M (see FIG. 4B) in the direction along the signal line.
  • the overlapping region M corresponds to a region where the first signal line 22 and the second signal line 32 are joined (that is, a region where the joint material F is positioned) (see FIGS. 4B and 5B).
  • the superimposed region M is indicated by hatching. According to this configuration, it is easier to reduce the capacitive component around the second signal line 32 at the junction. Therefore, the capacitance component can be reduced more efficiently, and the transmission characteristics of high-frequency signals can be improved.
  • the line width W3 of the 1a-th signal line 22a may be narrower than the line width W4 of the 2a-th signal line 32a (specifically, the width W4 of the electrode pad 32c) (see FIG. 5A). According to this configuration, even if there is an error in the joining position of the signal lines in the width direction, the 1a signal line 22a does not protrude from the 2a signal line 32a (specifically, the electrode pad 32c) in plan view. can be reduced. Therefore, the structure in which the 2a signal line 32a (specifically, the electrode pad 32c) overlaps on the 1a signal line 22a in the overlapping region M can be stably realized. Therefore, occurrence of large individual differences in characteristic impedance can be reduced. Therefore, stable transmission characteristics of high-frequency signals can be realized.
  • the line width W3 of the 1a-th signal line 22a may be the maximum dimension of the line width W3 of the 1a-th signal line 22a.
  • the line width W3 of the 1b-th signal line 22b may be narrower than the line width W4 of the 2b-th signal line 32b (specifically, the width W4 of the electrode pad 32d) (see FIG. 5A). reference).
  • the 1b signal line 22b does not protrude from the 2b signal line 32b (specifically, the electrode pad 32d) when viewed through the plane. can be reduced. Therefore, a structure in which the 2b signal line 32b (specifically, the electrode pad 32d) overlaps the 1b signal line 22b in the overlapping region M can be stably realized. Therefore, occurrence of large individual differences in characteristic impedance can be reduced. Therefore, stable transmission characteristics of high-frequency signals can be realized.
  • the area of the electrode film conductors (corresponding to the first film conductors) 33a, 33b may be smaller than the area of the overlapping region M (see FIG. 4B). With this configuration as well, heat can be conducted from the second surface S2 to the electrode pads 32c and 32d located on the first surface S1 via the electrode film conductors 33a and 33b, and the bonding material F can be melted. Furthermore, since the areas of the electrode film conductors 33a and 33b are small, the capacitance component generated by the electrode film conductors 33a and 33b among the capacitance components applied to the second signal line 32 can be reduced. Therefore, the matching of the characteristic impedance at the junction between the first signal line 22 and the second signal line 32 can be improved, and the transmission characteristics of high frequency signals can be improved.
  • the slit 35 has a first slit end t35 (see FIG. 4B) positioned farther from the second edge E30 of the flexible substrate 30. Then, when viewed through the plane, the first slit end portion t35 may be positioned on the first bonding region R1 apart from the first edge E20 of the first bonding region R1. According to this configuration, bending of the first slit end portion t ⁇ b>35 can be reduced, so stress is less likely to be applied to the slit 35 . Therefore, it is possible to reduce the risk that the flexible substrate 30 will be damaged at the first slit end t35.
  • the recess 24 may be open on the board surface of the wiring board 20 .
  • the wiring board 20 may have an insulating film 25 (see FIG. 3) positioned on the bottom surface of the recess 24 . According to this configuration, even if the bonding material F that joins the first signal line 22 and the second signal line 32 drips into the recess 24, the ground film conductor 23c in the recess 24, the first signal line 22, and the second signal It is possible to reduce the risk of short-circuiting with the line 32 . Therefore, the high-frequency signal transmission characteristics of the composite wiring board 10 can be improved.
  • the second signal line 32 may be positioned with a slit 35 and a gap Q (see FIG. 2B) in planar perspective. According to this configuration, it is possible to reduce the fact that the bonding material F that bonds the first signal line 22 and the second signal line 32 spreads to the inner peripheral surface of the slit 35 and affects the characteristic impedance of the joint. . Therefore, the high-frequency signal transmission characteristics of the composite wiring board 10 can be improved.
  • 6A is a graph showing frequency characteristics of the composite wiring board of Embodiment 1 and a comparative example.
  • FIG. 6B is a graph showing impedance characteristics of the composite wiring board of Embodiment 1 and a comparative example;
  • the graphs respectively show simulation results for the composite wiring board 10 of the embodiment and the composite wiring board of the comparative example.
  • Frequency characteristics include insertion loss and reflection loss, and impedance characteristics are represented by TDR (Time Domain Reflectometry).
  • TDR Time Domain Reflectometry
  • FIG. 6A shows that the recess 24 is positioned in the first bonding region R1 and the slit 35 is positioned in the second bonding region R2, so that the reflection loss is low in the range of 3 GHz to 40 GHz and the insertion loss characteristics are shown in the high band. This indicates that the deterioration of
  • FIG. 6B shows that the recess 24 is positioned in the first bonding region R1 and the slit 35 is positioned in the second bonding region R2, so that the difference in characteristic impedance between the periphery of the junction and the front stage of the junction and the difference in characteristic impedance between the periphery of the junction and the This indicates that the difference in characteristic impedance from the subsequent stage of the junction is small, and the matching of the characteristic impedance is improved.
  • the time domain from 20 ps to 40 ps in TDR represents the impedance around the junction.
  • FIG. 7 is a cross-sectional view showing a composite wiring board of Embodiment 2.
  • FIG. The cross-sectional position of FIG. 7 is the same as the cross-sectional position of FIG. 5A.
  • the composite wiring board 10 of Embodiment 2 is the same as that of Embodiment 1, except that some elements are different. Elements different from the first embodiment will be described below.
  • the center CL1 of the 1a signal line 22a in the line width direction is located from the center CL2 of the 2a signal line 32a (specifically, the electrode pad 32c) in the line width direction. may also be located off one side of the line width direction (see FIG. 7).
  • the center CL1 of the 1a-th signal line 22a may be positioned closer to the recess 24 than the center CL2 of the 2a-th signal line 32a (specifically, the electrode pad 32c). That is, the distance between the recess 24 and the center CL1 of the 1a signal line 22a in the line width direction may be smaller than the distance between the recess 24 and the center CL2 of the 2a signal line 32a in the line width direction.
  • the center CL3 in the line width direction of the 1b signal line 22b is It may be located in one direction in the line width direction away from the center CL4 (see FIG. 7).
  • the center CL3 of the 1b-th signal line 22b may be positioned closer to the recess 24 than the center CL4 of the 2b-th signal line 32b (specifically, the electrode pad 32c). That is, the distance between the recess 24 and the center CL3 of the 1b signal line 22b in the line width direction may be smaller than the distance between the recess 24 and the center CL4 of the 2b signal line 32b in the line width direction.
  • the overlapped portion between the concave portion 24 and the slit 35 can be enlarged. Therefore, the high-frequency signal transmission characteristics of the composite wiring board 10 can be further improved.
  • FIG. 8 is a cross-sectional view showing a composite wiring board of Embodiment 3.
  • FIG. The cross-sectional position of FIG. 8 is the same as the cross-sectional position of FIG. 5A.
  • the composite wiring board 10 of Embodiment 3 is the same as that of Embodiment 1 except that some elements are different. Elements different from the first embodiment will be described below.
  • the concave portion 24 may include an upper layer portion 241 and a lower layer portion 242, and the upper layer portion 241 and the lower layer portion 242 may be vertically connected.
  • the width W1 of the upper layer portion 241 (specifically, the width in the line width direction of the signal line) and the width W1a of the lower layer portion 242 (specifically, the width in the line width direction of the signal line) may be different. Width W1a>Width W1 may be satisfied. That is, the width W1a may be larger than the width W1.
  • the width W1 of the upper layer portion 241 ⁇ the interval W5 between the 1ath signal line 22a and the 1bth signal line 22b ⁇ the width W1a of the lower layer portion 242 may be satisfied. That is, the width W1 of the upper layer portion 241 may be smaller than the interval W5, and the width W1a of the lower layer portion 242 may be larger than the interval W5.
  • the interval W5 is the distance between the 1a signal line 22a and the 1b signal line 22b.
  • width W1 of the upper layer portion 241 may be wider than the width W2 of the slit 35, and the width W2 of the lower layer portion 242 may be wider than the width W2 of the slit 35.
  • the center of the upper layer portion 241 in the width direction and the center of the lower layer portion 242 in the width direction may overlap each other when viewed through the plane.
  • the insulating substrate 21 may have a laminated structure in which a plurality of dielectric layers are stacked.
  • the upper layer 241 of the recess 24 may be located on the nth dielectric layer of the insulating substrate 21 and the lower layer 242 of the recess 24 may be located on the (n+1)th dielectric layer of the insulating substrate 21. .
  • the width W1 of the upper layer portion 241 is limited by the 1a signal line 22a and the 1b signal line 22b, but the width W1a of the lower layer portion 242 is not subject to the above limitation and can be widened. can. Since the width W1a of the lower layer portion 242 is wide, the dielectric constant around the first signal line 22 of the insulating substrate 21 can be further reduced. Therefore, it is possible to further reduce the increase in the capacitance component of the first signal line 22 at the junction. As described above, at the junction between the first signal line 22 and the second signal line 32, the increase in the capacitance component is reduced, and the matching of the characteristic impedance can be improved. Therefore, the high-frequency signal transmission characteristics of the composite wiring board 10 can be improved.
  • FIG. 9 is a perspective view showing a composite wiring board according to Embodiment 4.
  • FIG. A composite wiring board 10 of Embodiment 4 is the same as that of Embodiment 1 except that some elements are different. Elements different from the first embodiment will be described below.
  • the flexible substrate 30 includes a portion of the second signal line 32 (corresponding to the conductor layer) and a portion of the first ground film conductors 33c and 33d (corresponding to the conductor layer) on the first surface S1.
  • the flexible substrate 30 may have a protective film 37b that covers and protects a portion of the second ground film conductor 33e (corresponding to a conductor layer) on the second surface S2.
  • the protective films 37a, 37b may be called coverlays.
  • the protective film 37a on the first surface S1 may be located in a region other than the first bonding region R1.
  • the protective film 37a and the slit 35 do not have to overlap when seen from above.
  • the protective film 37b on the second surface S2 includes the electrode film conductors 33a and 33b that are electrically connected to the second signal line 32, and a range (specifically, the signal line may be located in a region other than the range of lines in the line width direction).
  • the protective film 37b and the slit 35 do not have to overlap.
  • the conductors on the first surface S1 and the second surface S2 of the flexible substrate 30 are protected by the protective films 37a and 37b, and the conductors are prevented from being short-circuited. can be reduced. Furthermore, the strength of the flexible substrate 30 can be improved by the protective films 37a and 37b. Furthermore, since the slits 35 do not overlap the protective films 37a and 37b, it is possible to reduce the effect of the protective films 37a and 37b on the effect of improving the matching of the specific impedance by the slits 35. FIG.
  • FIG. 10A shows the slits of embodiments 1-4.
  • FIGS. 10B to 10G show variations 1 to 6 of the slit, respectively.
  • the slit 35 of the flexible substrate 30 is not limited to the configuration of FIG. 10A.
  • the width W2 and length L2 of the slit 35 may not necessarily be constant, and can be determined as appropriate so that the impedance can be adjusted appropriately.
  • the flexible substrate 30 includes, in addition to the slit 35, a slit 35a between the 2a signal line 32a and the first grounding film conductor 33c, a 2b signal line 32b and the first grounding film conductor 33d. and a slit 35b between them.
  • the slits 35a and 35b may be long in the direction along the signal line, and may be aligned with the 2a signal line 32a and the 2b signal line 32b in the line width direction of the signal line. According to this configuration, the addition of the slits 35a and 35b can further reduce the increase in the capacitance component around the joint portion due to the insulating base 31 of the flexible substrate 30 .
  • the width and length of the slit 35, the slit 35a, and the slit 35b may all be the same or different.
  • the width of slit 35 may be greater than the width of slit 35a and/or the width of slit 35b.
  • the flexible substrate 30 may have a slit 35c spaced apart from the second edge E30. According to this configuration, the strength of the flexible substrate 30 can be maintained while reducing the capacitive component around the joint.
  • the slit 35d of the flexible substrate 30 may have a plurality of child slits s separated from each other in the direction along the signal line. According to this configuration, while maintaining the strength of the flexible substrate 30, it is possible to reduce the increase in the capacitive component of the insulating substrate 31 around the joint due to the slits 35d.
  • the shape of the secondary slit s may be appropriately selected from a rectangular shape, a square shape, a circular shape, etc. according to the design conditions.
  • the flexible substrate 30 has a plurality of slits 35e, 35f, and 35g, and each of the slits 35e, 35f, and 35g is divided into a plurality of sub-slits s in the direction along the signal line.
  • the slits 35e, 35f, 35g may be located in the same locations as the slits 35, 35a, 35b of FIG. 10B. According to this configuration, it is possible to further reduce an increase in the capacitance component of the insulating substrate 31 while maintaining the strength of the flexible substrate 30 .
  • the flexible substrate 30 may have a slit 35h positioned apart from the second edge E30 between the 2a signal line 32a and the first ground film conductor 33c. Similarly, the flexible substrate 30 may have a slit 35i positioned away from the second edge E30 between the 2b signal line 32b and the first ground film conductor 33d. Similarly, the flexible substrate 30 may have a slit 35j positioned apart from the second edge E30 between the 2a signal line 32a and the 2b signal line 32b. According to this configuration, while maintaining the strength of the flexible substrate 30, it is possible to further reduce the increase in the capacitance component via the insulating substrate 31.
  • the flexible substrate 30 includes two conductors positioned between the 2a signal line 32a and the first grounding film conductor 33c and between the 2b signal line 32b and the first grounding film conductor 33d.
  • the slits 35k and 35l may be provided, and no slit may be provided between the 2a signal line 32a and the 2b signal line 32b. According to this configuration, even when the distance between the 2a signal line 32a and the 2b signal line 32b is narrow, the slits 35k and 35l can reduce an increase in the capacitance component of the insulating base 31 around the joint.
  • the recess 24 as a notch of the wiring board 20 may have one recess 24 or a plurality of recesses 24 so as to face each of the slits 35b to 35l in FIGS. 10B to 10G. That is, the recesses 24 are formed between the 1a signal line 22a and the 1b signal line 22b, between the 1a signal line 22a and the ground film conductor 23a, and between the 1b signal line 22b and the ground film conductor 23b. may be located in The recesses 24 are located between the 1a signal line 22a and the ground film conductor 23a and between the 1b signal line 22b and the ground film conductor 23b. It does not have to be between
  • the composite wiring board 10 according to the present embodiment has a configuration in which the wiring board 20 having the concave portion 24 at one of the above positions and the flexible board 30 having the slit 35 at one of the above positions are joined. There may be.
  • the concave portion 24 and the slit 35 may be positioned so as not to face each other.
  • FIG. 11A is vertical cross-sectional views showing modified examples 7, 8, and 9 of the notch of the wiring substrate, respectively.
  • 11A, 11B, and 11C show cross sections of the wiring substrate 20 cut at locations where the notches are located.
  • the recess 24 is shown as the notch of the wiring board 20 .
  • notches 24a inside the substrate may be applied, as shown in FIG. 11A.
  • the notch 24a is located inside the wiring board 20 from the board surface, and does not open on the board surface or the end surface of the board.
  • the notch 24a has the same shape as the concave portion 24 described above and may be positioned at the same location as the concave portion 24 when seen from above.
  • a notch 24b that does not open on the substrate surface but opens on the end surface S11 of the substrate may be applied.
  • the notch 24b has the same shape as the recess 24 and is located at the same location as the recess 24, except that it is positioned across the first edge E20 of the first joint region R1 when viewed through the plane. good too.
  • a notch 24c penetrating from the substrate surface of the wiring substrate 20 to the opposite surface may be applied.
  • the notch 24c may have the same shape as the concave portion 24 described above and may be positioned at the same location as the concave portion 24 when seen from above.
  • FIG. 12 is a perspective view showing an electronic component housing package and an electronic device according to an embodiment of the present disclosure.
  • An electronic component housing package 50 of this embodiment includes a composite wiring board 10 and a frame body 52 integrated with the wiring board 20 .
  • the frame 52 surrounds the housing portion 51 for the electronic component 80 .
  • the frame body 52 may further cover the bottom of the housing portion 51 and have an open top. The opening may be closed by joining a lid (not shown).
  • the first bonding region R1 of the wiring board 20 may be located outside the frame 52.
  • FIG. 12 shows the composite wiring board 10 and the electronic component housing package 50 having a set of the first signal line 22 and the second signal line 32.
  • the composite wiring board 10 and the electronic component housing package 50 are A configuration having a plurality of sets of the first signal line 22 and the second signal line 32 may be employed.
  • the plurality of sets of the first signal lines 22 and the second signal lines 32 may be arranged in the same direction, or may be positioned in a plurality of locations facing different directions.
  • the electronic device 100 of this embodiment includes an electronic component housing package 50 and an electronic component 80 housed in a housing portion 51 .
  • the first signal line 22 of the wiring board 20 is positioned from the outside of the frame 52 to the inside of the frame 52, and is connected to the electronic component 80 of the housing portion 51 by a bonding member (for example, a brazing material, a linear conductor, or a belt-shaped conductor). may be electrically connected via
  • the electronic component 80 is an element that receives an electrical signal in a high frequency band and outputs light, an element that inputs an optical signal and outputs an electrical signal in a high frequency band, or various elements that input or output a signal in a high frequency band. There may be.
  • FIG. 13 is a perspective view showing another example of the electronic component housing package according to the embodiment of the present disclosure.
  • FIG. 13 is a perspective view of the back side of the electronic component housing package 50A.
  • the electronic component housing package 50A has a TO (Transistor Outline) package type (for example, TO-CAN type) structure, and has an electronic component housing section 51A on the upper surface of the wiring board 20A (that is, the lower side in FIG. 13).
  • a frame 52A is joined above the wiring board 20A (that is, below in FIG. 13) to cover the accommodating portion 51A.
  • the electronic component housing package 50A has a composite wiring board 10A having a wiring board 20A and a flexible board 30A, and a frame 52A.
  • the frame 52A may be, for example, a metal member or a ceramic member.
  • the wiring board 20A and the frame 52A may be integrally formed, or may be formed separately and joined together.
  • the wiring board 20A and the frame 52A may both be made of a ceramic-containing material and may be integrally fired.
  • the first signal line 22A and the first junction region R1 are located on the lower surface S21 of the wiring board 20A. Then, the second bonding region R2 of the flexible substrate 30A is bonded to the first bonding region R1.
  • the first signal line 22A is located on the lower surface S21 of the wiring board 20A and from the lower surface S21 to the upper surface.
  • the first signal line 22A is joined to the second signal line 32A of the flexible substrate 30A on the lower surface S21, and electrically connected to the electronic component on the upper surface.
  • the first signal line 22A of the wiring board 20A is a single-ended signal line, and the concave portions 24A and 24B as notches are located on both sides of the first signal line 22A in the line width direction, that is, the first signal line. It may be positioned between the first signal line 22A and the first grounding film conductor 23Aa and between the first signal line 22A and the second grounding film conductor 23Ab. The first grounding film conductor 23Aa and the second grounding film conductor 23Ab are located on both sides of the first signal line 22A with the first signal line 22A interposed therebetween.
  • the second signal line 32A of the flexible substrate 30A is a single-ended signal line, and the slits 35A and 35B are located on both sides of the second signal line 32A in the line width direction, that is, the second signal line 32A and the first ground. It is positioned between the film conductors 33c and 33d.
  • the electronic component housing packages 50 and 50A and the electronic device 100 according to the present embodiment by having the composite wiring boards 10 and 10A according to the embodiment, it is possible to improve the transmission characteristics of high-frequency signals.
  • the composite wiring board, the electronic element housing package, and the electronic device of the present disclosure are not limited to the above-described embodiments, and can be appropriately modified within the scope of the present disclosure.
  • Various combinations of each embodiment, each modification, and each feature are not limited to the above examples. Combinations of embodiments, modifications, and characteristic portions are also possible.
  • the present disclosure can be used for composite wiring boards, electronic component housing packages, and electronic devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2023/002420 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置 Ceased WO2023145817A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023576976A JP7789097B2 (ja) 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置
EP23747027.3A EP4475634A1 (en) 2022-01-31 2023-01-26 Composite wiring board, electronic component storage package, and electronic device
US18/834,246 US20250142718A1 (en) 2022-01-31 2023-01-26 Composite wiring board, electronic component accommodating package, and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012614 2022-01-31
JP2022-012614 2022-01-31

Publications (1)

Publication Number Publication Date
WO2023145817A1 true WO2023145817A1 (ja) 2023-08-03

Family

ID=87471549

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/002420 Ceased WO2023145817A1 (ja) 2022-01-31 2023-01-26 複合配線基板、電子部品収容用パッケージ及び電子装置

Country Status (4)

Country Link
US (1) US20250142718A1 (https=)
EP (1) EP4475634A1 (https=)
JP (1) JP7789097B2 (https=)
WO (1) WO2023145817A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214556A (ja) * 1998-01-26 1999-08-06 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
JP2008160750A (ja) * 2006-12-26 2008-07-10 Toshiba Corp マイクロ波回路基板
JP2017005646A (ja) * 2015-06-16 2017-01-05 日本電信電話株式会社 高周波接続線路
WO2019050046A1 (ja) 2017-09-11 2019-03-14 Ｎｇｋエレクトロデバイス株式会社 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214556A (ja) * 1998-01-26 1999-08-06 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
JP2008160750A (ja) * 2006-12-26 2008-07-10 Toshiba Corp マイクロ波回路基板
JP2017005646A (ja) * 2015-06-16 2017-01-05 日本電信電話株式会社 高周波接続線路
WO2019050046A1 (ja) 2017-09-11 2019-03-14 Ｎｇｋエレクトロデバイス株式会社 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ

Also Published As

Publication number Publication date
US20250142718A1 (en) 2025-05-01
JPWO2023145817A1 (https=) 2023-08-03
JP7789097B2 (ja) 2025-12-19
EP4475634A1 (en) 2024-12-11

Similar Documents

Publication Publication Date Title
US10790245B2 (en) High-frequency ceramic board and high-frequency semiconductor element package
JP7332090B2 (ja) 光変調器キャリア組立体及び光モジュール
US20190182949A1 (en) Flexible printed circuit board and optical module
JP7437278B2 (ja) 光モジュール
WO2013015216A1 (ja) 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置
US10777493B2 (en) Semiconductor device mounting board and semiconductor package
JP7468846B2 (ja) 光半導体装置及びキャリア
JP7545349B2 (ja) 光モジュール
JP7063695B2 (ja) 光モジュール
WO2023054419A1 (ja) 半導体素子実装用基板及び半導体装置
WO2023145817A1 (ja) 複合配線基板、電子部品収容用パッケージ及び電子装置
CN113013262B (zh) 光模块
CN112119489A (zh) 布线基板、封装体及模块
JP7542419B2 (ja) 光モジュール
CN119805684A (zh) 光学组件及具有其的光模块
CN112491479B (zh) 光接收装置
JP7600792B2 (ja) プリント基板及びプリント基板組立体
WO2025102540A1 (zh) 双端型eml coc组件
JP7156549B2 (ja) 光通信部品
US20220149592A1 (en) Optical semiconductor module
JP2019186379A (ja) 光モジュール
WO2021079510A1 (ja) 光半導体装置
JP7633841B2 (ja) 半導体発光装置および光サブアセンブリ
JP2002359443A (ja) 高周波パッケ−ジと配線基板との接続構造
JP7660676B2 (ja) 配線基板、電子部品収納用パッケージ及び電子装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23747027

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2023576976

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 18834246

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2023747027

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2023747027

Country of ref document: EP

Effective date: 20240902

WWP Wipo information: published in national office

Ref document number: 18834246

Country of ref document: US

WWW Wipo information: withdrawn in national office

Ref document number: 2023747027

Country of ref document: EP