WO2013015216A1 - 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 - Google Patents
半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 Download PDFInfo
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Abstract
Description
Claims (6)
- 上面に半導体素子を搭載する搭載領域を有する基体と、
前記搭載領域を囲むように前記基体の上面に設けられた枠状部および前記枠状部の内側から前記枠状部の外側までを貫通する開口部を有する枠体と、
前記開口部に設けられ、前記枠体の内側から前記枠体の外側にまで延在された平板状の絶縁部材と、
前記絶縁部材の上面に設けられ、前記枠体の内側から前記枠体の外側にまで延在された複数の配線導体と、
前記絶縁部材の上面であって前記枠体の外側に設けられ、前記複数の配線導体を取り囲む連続した金属膜と、
を備えたことを特徴とする半導体素子収納用パッケージ。 - 請求項1に記載の半導体素子収納用パッケージであって、
前記金属膜は、前記絶縁部材の上面から前記絶縁部材の側面にかけて設けられていることを特徴とする半導体素子収納用パッケージ。 - 請求項1または請求項2に記載の半導体素子収納用パッケージであって、
前記金属膜の一部は、前記複数の配線導体の間にまで設けられていることを特徴とする半導体素子収納用パッケージ。 - 請求項1ないし請求項3のいずれかに記載の半導体素子収納用パッケージであって、
前記絶縁部材は、前記絶縁部材の上面および前記絶縁部材の側面にかけて開口した溝部が設けられていることを特徴とする半導体素子収納用パッケージ。 - 請求項1ないし請求項4のいずれかに記載の半導体素子収納用パッケージと、
前記搭載領域に搭載された半導体素子と、
前記枠体に接合された、前記半導体素子を覆う金属からなる蓋体とを備えたことを特徴とする半導体装置。 - 請求項5に記載の半導体装置と、
前記半導体装置が搭載された搭載基板と、
前記搭載基板上に搭載された電子部品と、
前記配線導体と異なる第2の配線導体を有し、前記第2の配線導体が前記配線導体に電気的に接続された樹脂基板とを備えたことを特徴とする電子装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013525705A JP5537736B2 (ja) | 2011-07-26 | 2012-07-20 | 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 |
US14/006,527 US8952518B2 (en) | 2011-07-26 | 2012-07-20 | Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same |
CN201280005707.0A CN103329260B (zh) | 2011-07-26 | 2012-07-20 | 半导体元件收纳用封装体、具备其的半导体装置及电子装置 |
EP12817380.4A EP2738798B1 (en) | 2011-07-26 | 2012-07-20 | Package for accommodating semiconductor element, semiconductor device provided with same, and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2011-163426 | 2011-07-26 | ||
JP2011163426 | 2011-07-26 |
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WO2013015216A1 true WO2013015216A1 (ja) | 2013-01-31 |
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PCT/JP2012/068436 WO2013015216A1 (ja) | 2011-07-26 | 2012-07-20 | 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 |
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Country | Link |
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US (1) | US8952518B2 (ja) |
EP (1) | EP2738798B1 (ja) |
JP (1) | JP5537736B2 (ja) |
CN (1) | CN103329260B (ja) |
WO (1) | WO2013015216A1 (ja) |
Cited By (1)
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JP6082114B2 (ja) * | 2013-07-26 | 2017-02-15 | 京セラ株式会社 | 素子収納用パッケージおよび実装構造体 |
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JP5570609B2 (ja) * | 2010-09-28 | 2014-08-13 | 京セラ株式会社 | 素子収納用パッケージ、およびこれを用いた電子装置 |
US9603274B2 (en) * | 2012-10-30 | 2017-03-21 | Kyocera Corporation | Container for housing electronic component and electronic device |
WO2015137489A1 (ja) * | 2014-03-13 | 2015-09-17 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP5943985B2 (ja) * | 2014-10-30 | 2016-07-05 | 三菱電機株式会社 | 電子制御装置 |
CN107534023B (zh) * | 2015-05-20 | 2020-11-06 | 京瓷株式会社 | 半导体元件封装件、半导体装置以及安装构造体 |
US11335613B2 (en) * | 2017-02-23 | 2022-05-17 | Kyocera Corporation | Insulating component, semiconductor package, and semiconductor apparatus |
JP6967910B2 (ja) * | 2017-08-09 | 2021-11-17 | 新光電気工業株式会社 | 電子部品用パッケージ及び電子部品装置 |
US10453310B2 (en) * | 2017-09-29 | 2019-10-22 | Konami Gaming, Inc. | Gaming system and methods of operating gaming machines to provide skill-based wagering games to players |
DE102019104792A1 (de) * | 2018-03-01 | 2019-09-05 | Nichia Corporation | Lichtemittierendes modul |
JP1643134S (ja) * | 2019-03-15 | 2019-10-07 | ||
JP7279527B2 (ja) * | 2019-05-31 | 2023-05-23 | 株式会社オートネットワーク技術研究所 | 配線部材 |
WO2024067218A1 (zh) * | 2022-09-27 | 2024-04-04 | 青岛海信激光显示股份有限公司 | 投影设备 |
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- 2012-07-20 US US14/006,527 patent/US8952518B2/en active Active
- 2012-07-20 JP JP2013525705A patent/JP5537736B2/ja active Active
- 2012-07-20 EP EP12817380.4A patent/EP2738798B1/en active Active
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JP6082114B2 (ja) * | 2013-07-26 | 2017-02-15 | 京セラ株式会社 | 素子収納用パッケージおよび実装構造体 |
JPWO2015012405A1 (ja) * | 2013-07-26 | 2017-03-02 | 京セラ株式会社 | 素子収納用パッケージおよび実装構造体 |
Also Published As
Publication number | Publication date |
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EP2738798B1 (en) | 2021-07-14 |
EP2738798A4 (en) | 2015-06-03 |
JPWO2013015216A1 (ja) | 2015-02-23 |
EP2738798A1 (en) | 2014-06-04 |
US20140008780A1 (en) | 2014-01-09 |
CN103329260A (zh) | 2013-09-25 |
US8952518B2 (en) | 2015-02-10 |
JP5537736B2 (ja) | 2014-07-02 |
CN103329260B (zh) | 2016-05-11 |
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