WO2015137489A1 - 電子部品収納用パッケージおよび電子装置 - Google Patents
電子部品収納用パッケージおよび電子装置 Download PDFInfo
- Publication number
- WO2015137489A1 WO2015137489A1 PCT/JP2015/057493 JP2015057493W WO2015137489A1 WO 2015137489 A1 WO2015137489 A1 WO 2015137489A1 JP 2015057493 W JP2015057493 W JP 2015057493W WO 2015137489 A1 WO2015137489 A1 WO 2015137489A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- insulating layer
- frame
- input
- frame body
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 36
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000007769 metal material Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 5
- 239000010941 cobalt Substances 0.000 description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 4
- 229910052863 mullite Inorganic materials 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6477—Impedance matching by variation of dielectric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Definitions
- the present invention relates to an electronic component storage package and an electronic device.
- a package described in Patent Document 1 is known as an electronic component storage package for storing electronic components (hereinafter also simply referred to as a package).
- the package described in Patent Document 1 has a lead connected to the bottom surface of the dielectric substrate. A part of the lower surface of the lead is notched.
- the leads cannot be arranged with high density. This is because capacitive coupling between leads increases when leads are arranged at high density.
- the present invention has been made in view of the above problems, and an object thereof is to provide an electronic component storage package having excellent electrical characteristics and an electronic device using the same.
- An electronic component storage package includes a substrate having a placement area on which an electronic component is placed on an upper surface, and an inner and outer sides provided on the upper surface of the substrate so as to surround the placement area. And a plurality of wiring conductors electrically connected to the electronic component, which are provided so as to close the through portion in the frame body, extend inside and outside the frame body. And an input / output member that extends to the lower surface outside the frame, and the input / output member extends between the wiring conductors on the lower surface along the wiring conductor. It has the notch part notched over the outer side surface, It is characterized by the above-mentioned.
- An electronic device is mounted on the electronic component storage package and the mounting region of the electronic component storage package, and is electrically connected to the wiring conductor via a connection member. And a lid that is bonded to the upper surface of the frame and seals the electronic component.
- the input / output member has a notch portion that is cut out between the plurality of wiring conductors and along the wiring conductors toward the outer side surface of the input / output member. It is possible to provide a small electronic component storage package in which conductors are arranged in close contact with each other and an electronic device using the same.
- FIG. 1 is an exploded perspective view showing an electronic device 1 according to an embodiment of the present invention.
- an electronic device 1 according to an embodiment of the present invention seals an electronic component storage package 10, an electronic component 20 mounted on the electronic component storage package 10, and the electronic component 20. And a lid 30.
- the electronic component storage package 10 includes a substrate 11, a frame body 12, and an input / output member 13 fixed to the frame body 12.
- the substrate 11 has a placement region R on the top surface where the electronic component 20 is placed.
- the frame body 12 is provided on the upper surface of the substrate 11 so as to surround the placement region R.
- the frame 12 has the penetration part H opened inside and outside.
- the input / output member 13 is provided in the frame body 12 so as to block the penetrating portion H provided in the frame body 12.
- the input / output member 13 includes a plurality of wiring conductors 131 that are electrically connected to the electronic component 20.
- the wiring conductor 131 is provided so as to extend inside and outside the frame body 12, and extends to the lower surface of the input / output member 13 outside the frame body 12.
- the input / output member 13 has a notch C cut out from between the plurality of wiring conductors 131 on the lower surface along the wiring conductor 131 to the outer side surface of the input / output member 13.
- the substrate 11 is a member for hermetically sealing the electronic component 20 together with the frame body 12, the input / output member 13 and the lid body 30.
- the substrate 11 is, for example, a plate-like member having a quadrangular shape when viewed in plan.
- the planar view shape of the substrate 11 is not limited to a quadrangular shape, and can be various shapes according to the purpose of the substrate 11.
- the substrate 11 has a placement region R on which the electronic component 20 is placed.
- the mounting substrate 14 is installed on the upper surface of the substrate 11, and the electronic component 20 is mounted on the upper surface of the mounting substrate 14.
- the mounting region R means a region where the mounting substrate 14 overlaps the substrate 11 when the substrate 11 is viewed in plan.
- a metal material such as iron, copper, nickel, chromium, cobalt, molybdenum or tungsten can be used. Or the alloy or composite material which consists of these metals can be used.
- the substrate 11 may have a function of radiating heat generated by the electronic component 20. In this case, it is preferable to use a material having good thermal conductivity. By subjecting such an ingot of a metal material to a metal processing method such as a rolling method or a punching method, the substrate 11 can be manufactured.
- the mounting substrate 14 a material having good insulation is used.
- the material constituting the mounting substrate 14 include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body. Can be used.
- the frame body 12 is a member that accommodates the electronic component 20 together with the substrate 11.
- the frame body 12 forms a recess that houses the electronic component 20 together with the substrate 11.
- the frame body 12 is a member for holding the input / output member 13.
- the frame body 12 is provided on the upper surface of the substrate 11 so as to surround the placement region R of the substrate 11.
- the shape of the inner periphery and the outer periphery of the frame body 12 when viewed in plan is a quadrangular shape.
- the shape of the frame 12 in plan view is often similar to the shape of the substrate 11 in plan view, but is not limited to this, and various shapes can be used according to the purpose of the frame 12.
- the frame body 12 is provided on the upper surface of the substrate 11 so as to surround the placement region R, and has a through portion H that opens to the inside and outside of the frame body 12.
- the through portion H is provided in a direction along the upper surface of the substrate 11.
- the input / output member 13 is fixed so as to close the through portion H.
- a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used.
- an alloy made of these metals can be used.
- the frame body 12 can be produced by subjecting such a metal material ingot to a metal processing method such as a rolling method, a punching method, or a cutting method.
- the frame 12 has an opening 15 in a part of the frame facing the penetrating part H.
- a holding member (not shown) is fixed to the opening 15.
- a translucent member and an optical fiber are fixed to the holding member via a bonding material such as a brazing material.
- the holding member is a cylindrical member.
- the holding member fixes the translucent member attached to the inside or the end of the holding member.
- an optical fiber is attached to the outer side of a translucent member.
- the holding member is provided for optically coupling the optical fiber and the electronic component 20 to input / output an optical signal.
- ⁇ A metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used for the holding member.
- an alloy made of these metals can be used.
- a holding member can be produced by subjecting such a metal material ingot to a metal processing method such as a rolling method, a punching method, or a cutting method.
- the frame body 12 and the holding member are preferably formed from the same metal material. Thereby, the thermal expansion difference between the frame 12 and the holding member can be reduced. As a result, the stress generated between the frame 12 and the holding member and the deformation of the holding member can be reduced under a heat cycle during the manufacturing process or use of the electronic component storage package 10.
- the input / output member 13 is connected to an external circuit board G or the like.
- the input / output member 13 is a member for electrically connecting the inside and outside of the electronic component storage package 10.
- a metallized layer is formed at a portion where the input / output member 13 is joined to the penetrating portion H. And it fixes so that the penetration part H may be block
- the input / output member 13 has one end located inside the frame 12 and the other end located outside the frame 12. As shown in FIG. 5, the input / output member 13 is cut out in a concave shape on the placement region R side in plan view.
- the input / output member 13 has a plurality of wiring conductors 131 extending inside and outside the frame body 12.
- the wiring conductor 131 extends to the upper surface of the input / output member 13 inside the frame body 12 and is electrically connected to the electronic component 20 with a bonding wire or the like as a connecting member.
- the wiring conductor 131 includes a signal line through which a high-frequency signal is transmitted, a ground conductor that functions as a reference potential, and the like.
- the input / output member 13 has a structure in which a plurality of insulating layers are laminated, and a wiring conductor 131 serving as a signal line or a ground conductor is formed between the plurality of insulating layers. Further, as shown in FIGS. 4, 7, and 8, the input / output member 13 is provided on the substrate-like first insulating layer 132 and the first insulating layer 132 as a part of the plurality of insulating layers. A second insulating layer 133. The first insulating layer 132 and the second insulating layer 133 are distinguished for convenience, and are actually formed integrally.
- the first insulating layer 132 is one layer of the stacked body of the input / output members 13.
- the outer side surface does not protrude outside the frame 12 from the second insulating layer 133.
- a part of the lower surface of the second insulating layer 133 is exposed at the outer portion of the frame body 12. That is, the input / output member 13 has a shape in which the lower side is cut out toward the end surface on the outer side of the frame body 12.
- the first insulating layer 132 is a plate-like member.
- the first insulating layer 132 has a quadrangular shape, and has a plan view shape in which a central portion of one inner side surrounded by the frame body 12 is cut out in a U shape so as to be along the inner side of the frame body 12. ing.
- the second insulating layer 133 is laminated on the upper surface of the first insulating layer 132 disposed inside and outside the frame body 12.
- the second insulating layer 133 protrudes toward the outside of the frame body 12 from the first insulating layer 132 outside the frame body 12.
- a plurality of wiring conductors 131 led out from the inside of the frame body 12 are formed on the lower surface of the second insulating layer 133.
- the second insulating layer 133 is a plate-like member. Similar to the first insulating layer 132, the second insulating layer 133 has a plan view shape in which a central portion of one side of the quadrangular shape is cut out in a U shape so as to be along the inner side of the frame body 12. . In addition, on the lower surface of the second insulating layer 133, a plurality of cutout portions C cut out in a groove shape are formed. The notch portion C is formed between the wiring conductors 131 along the wiring conductor 131 and on the outer side surface of the frame body 12.
- the width can be adjusted in the depth direction of the notch C.
- a two-stage shape having a width larger on the back side than the width of the opening of the notch C can be formed.
- the second insulating layer 133 may be provided with an upper U-shaped insulating member that matches the shape of the frame body 12 in a plan view.
- the electronic component housing package 10 can be hermetically sealed while electrically insulating the frame 12 and the wiring conductor 131.
- the first insulating layer 132 and the second insulating layer 133 a material having good insulating properties is used.
- the material constituting the first insulating layer 132 include ceramics such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body. Materials can be used.
- the first insulating layer 132 and the second insulating layer 133 are made of a metal paste containing a refractory metal material that forms the wiring conductor 131 while processing the green sheet containing particles made of the ceramic material into a desired shape. Are formed in an integrated manner by coating them in a desired wiring pattern shape, laminating them and firing them simultaneously.
- the wiring conductor 131 is provided on the upper surface of the first insulating layer 132 located inside the frame body 12.
- the wiring conductor 131 is electrically connected to the electronic component 20 via a bonding wire or the like as a connection member.
- the wiring conductor 131 includes a plurality of wirings and extends from the inside of the frame body 12 to the outside of the frame body 12.
- the wiring conductor 131 is made of a refractory metal material such as tungsten, molybdenum, or manganese.
- the wiring conductor 131 is also provided on the lower surface of the second insulating layer 133 located outside the frame body 12.
- the wiring conductor 131 formed on the upper surface of the first insulating layer 132 and the wiring conductor 131 formed on the lower surface of the second insulating layer 133 are electrically connected.
- the wiring conductors 131a and 131b formed on both the layers 132 and 133 are connected to each other. Can be electrically connected.
- the input / output member 13 is a portion where the notch C is provided on the lower surface of the second insulating layer 133, and the electric capacity generated between the wiring conductors 131 is reduced.
- the notch C may also be formed at a location that overlaps the first insulating layer 132 in plan view. Thereby, an electrical capacitance can further be reduced to the location which overlaps with the 1st insulating layer 132 by planar view.
- the cutout portion C may have a curved shape along the wiring conductor 131 arranged in a curved shape.
- a corner portion that intersects at a right angle or an acute angle in a cross-sectional view in a cross section that crosses the groove-shaped notch portion C may have a curved surface shape. In this case, it is possible to suppress the stress generated in the cutout portion C from being concentrated on the corner portion under a heat cycle in a manufacturing process, a reliability test, or the like of the electronic component storage package 10.
- a concave portion P that opens to the laminated surface with the second insulating layer 133 may be provided from the side surface of the first insulating layer 132 to the inside so as to be connected to the opening of the notch C.
- the cutout portion C of the present embodiment has a wider cutout at the back side of the cutout portion C which is the upper portion than the lower opening portion. That is, the notch C has a two-stage shape in which the upper part is notched larger than the lower part.
- the lower portion of the notch C is set to have a length in the width direction of 0.1 mm to 1 mm
- the vertical length of the lower portion of the notch C is set to 0.1 mm to 0.5 mm.
- the upper part of the notch C is set to have a length in the width direction of 0.2 mm or more and 2 mm or less and a length in the vertical direction of 0.1 mm or more and 1 mm or less.
- the depth of the lower part of the notch C is set to 1 mm to 5 mm, and the depth of the upper part of the notch C is set to 1.1 mm to 6 mm.
- the length of the depth refers to the length in the direction along the wiring conductor 131.
- a plurality of notches C are provided as shown in FIG. 4, and the three wiring conductors 131 between the pair of notches C are connected from one notch C to the other.
- a signal line, a ground line, and a signal line are formed toward the notch C. That is, the signal line is formed on both sides of the notch C.
- the notch C is open to the edge of the signal line formed on both sides of the notch C. And the wide upper part of the notch C is formed to the part which overlaps with a part of signal line formed in the both sides of the notch C in planar view.
- the capacity component can be reduced as follows.
- alumina ceramics having a dielectric constant of 10 is used for the second insulating layer 133 shown in FIGS. 2, 3, and 4, and two signal lines with a width of 0.2 mm are provided on the surface with a spacing of 0.3 mm.
- a notch C having a width of 0.3 mm and a depth of 0.5 mm is provided between the two signal lines.
- the notch C may have a two-stage shape, the lower width may be 0.3 mm, the lower depth may be 0.15 mm, the upper width may be 0.4 mm, and the upper depth may be 0.35 mm.
- the capacitance component can be reduced, and the numerical range in which the characteristic impedance can be matched can be expanded.
- the characteristic impedance of the two signal lines can be matched to 40 ⁇ in the case of a one-stage shape and to 100 ⁇ in the case of a two-stage shape.
- a concave portion P connected to the cutout portion C is provided on the side surface of the first insulating layer 132.
- the recess P is provided directly below the notch C.
- the recess P is set to have a length in the width direction of 0.2 mm or more and 2 mm or less.
- the recess P has the same width as the width of the upper portion of the notch C.
- the concave portion P is set to have a vertical length of 0.1 mm to 1 mm.
- the depth of the recess P is set to 0.1 mm or more and 3 mm or less.
- the length of the depth refers to the length in the direction along the wiring conductor 131.
- the capacitive component along the wiring conductor 131 through which the high-frequency signal is transmitted can be further reduced.
- the corner part produced in an inner wall as a curved surface shape. Under the heat cycle in the manufacturing process or reliability test of the electronic component storage package 10, it is possible to suppress the stress generated in the concave portion P from concentrating on the corner portion.
- the concave portion P may be provided so as to be longer in the depth direction than the lower portion of the notch portion C in a plan view, that is, so as to be expanded in the direction inside the outer surface of the frame body 12.
- the wiring conductor 131b provided on the lower surface of the second insulating layer 133 may be provided with a large width so as to be exposed. As a result, capacitive coupling with the wiring conductor 131 through which high-frequency signals are transmitted can be suppressed.
- the width of the concave portion P is the widest, it is preferable to stack the first insulating layer 132 in which the concave portion P is formed after the green sheet to be the second insulating layer 133 is stacked. As a result, it is possible to make the lamination pressure uniform and to prevent the laminate from peeling off.
- the notch C and the recess P are provided between two adjacent signal lines. Two adjacent signal lines are used as lines for transmitting differential signals.
- the notch C and the recess P are arranged between the two signal lines, the interval between the two signal lines can be shortened. Further, it is possible to reduce the capacitance generated between one signal line, the other signal line, and the ground conductor disposed around the signal line.
- an external circuit board G as shown in FIG. 1 is electrically connected to two signal lines via a conductive bonding material, each signal line is prevented from being short-circuited by the bonding material. Can do. Since the two signal lines are separated by the notch C, a bridge due to the bonding material is unlikely to occur.
- the arrangement of the notch C and the recess P is not necessarily limited to between the two signal lines.
- the distance between the signal line and the ground line can be reduced.
- the pitch of the signal lines and the ground lines the input / output member 13 can be reduced in size and highly integrated.
- the wiring conductors 131a and 131b are not limited to differential signal lines.
- a coplanar waveguide in which the signal lines and the ground lines are alternately arranged and the signal lines are arranged between the ground lines may be used.
- the capacitance generated between the signal line and the ground line can be reduced. Therefore, even if the characteristic impedance is reduced by connecting the external circuit board G, the characteristic impedance can be made appropriate by arranging the notch C and the recess P.
- the wiring conductors 131a and 131b may be microstrip lines that are all signal lines.
- the external circuit board G is electrically connected to the two signal lines through the conductive bonding material by arranging the notch C and the recess P between the adjacent signal lines.
- the signal line and the ground line can be prevented from being short-circuited by the bonding material.
- the capacitance generated between the signal line and the surrounding ground line can be reduced, the characteristic impedance at the connection portion between the external circuit board G and the signal line can be increased.
- the characteristic impedance can be set to a desired value by providing the notch portion C and the concave portion P, and the signal line can be highly integrated. Can be realized.
- the line width of the wiring conductor 131a formed on the upper surface of the first insulating layer 132 and the line width of the wiring conductor 131b formed on the lower surface of the second insulating layer 133 are different.
- the line width of the wiring conductor 131a formed on the upper surface of the first insulating layer 132 is preferably thinner than the wiring conductor 131b. Further, it is preferable that the wiring conductor 131a is arranged with a smaller interval than the wiring conductor 131b.
- the wiring conductor 131 a formed on the upper surface of the first insulating layer 132 is led out to the inside surrounded by the frame body 12.
- a bonding wire is connected to the end portion of the wiring conductor 131a led out to the inside. Even if the line width of the wiring conductor 131a is narrow, the bonding wire can be electrically connected.
- the wiring conductor 131b formed on the lower surface of the second insulating layer 133 is connected to the external circuit board G.
- the line width of the wiring conductor 131b formed on the lower surface of the second insulating layer 133 is preferably larger than the line width of the wiring conductor 131a formed on the upper surface of the first insulating layer 132.
- the thicker one is good.
- the input / output member 13 is formed by laminating different green sheets and then sintering.
- the wiring conductor 131a is printed with a metalized paste that becomes the wiring conductor 131a after sintering on the green sheet that becomes the first insulating layer 132 after sintering.
- the wiring conductor 131b is printed on the green sheet that becomes the second insulating layer 133.
- a metallized paste to be the wiring conductor 131b is printed. Thereafter, when these green sheets are laminated, the wiring conductor 131 is formed by overlapping the wiring conductor 131a and the wiring conductor 131b so as to be in close contact with each other.
- the characteristic impedance is reduced as compared with the case where the line conductor 131b is thin.
- the characteristic impedance of the wiring conductor 131b can be increased. Accordingly, by adjusting the size of the notch C and the recess P according to the increased line width of the wiring conductor 131, the change in characteristic impedance can be suppressed. For this reason, the notch C and the recess P are preferably provided deeply to the vicinity of the end position of the wiring conductor 131a.
- the electronic component 20 is placed on the placement region R of the substrate 11.
- the electronic component 20 is electrically connected to the wiring conductor 131 of the input / output member 13 through a conductive member such as a bonding wire.
- Examples of the electronic component 20 include an optical semiconductor element, an IC (Integrated Circuit) element, a capacitor, and the like.
- an optical semiconductor element is used as the electronic component 20.
- Examples of the optical semiconductor element include a light emitting element such as an LD (Laser Diode) element or a light receiving element such as a PD (Photodiode) element.
- a seal ring 16 having a frame shape similar to that of the frame body 12 may be disposed on the frame body 12.
- the seal ring 16 is provided through the brazing material continuously along the upper surface of the frame body 12.
- the seal ring 16 connects the lid body 30 to the frame body 12 when the lid body 30 is provided so as to cover the inside of the frame body 12.
- the seal ring 16 is made of, for example, a metal such as copper, tungsten, iron, nickel, or cobalt having excellent weldability with the lid 30 or an alloy containing these metals.
- the thermal expansion coefficient of the seal ring 16 is set to 4 ⁇ 10 ⁇ 6 / K or more and 16 ⁇ 10 ⁇ 6 / K or less, for example.
- the through portion H is formed between the frame body 12 and the seal ring 16 by cutting out the upper surface of the frame body 12 and joining the seal ring 16 to the upper surface of the frame body 12. Yes.
- the penetrating portion H may be provided by cutting off the lower surface or the upper surface of the frame body 12.
- the penetrating portion H is formed between the frame 12 and the substrate 11 or the frame 12 and the seal ring 16 or the lid 30.
- the seal ring 16 can be considered as a part of the frame body 12.
- the lid body 30 is provided on the seal ring 16 so as to cover the electronic component 20 in the frame body 12.
- the lid 30 is a member for hermetically sealing the electronic component 20 together with the substrate 11, the seal ring 16, the input / output member 13, and the frame 12.
- the lid 30 can hermetically seal a region surrounded by the frame 12.
- the lid 30 is made of, for example, a metal member such as copper, tungsten, iron, nickel, or cobalt, or an alloy or composite material containing these metals, an aluminum oxide sintered body, a mullite sintered body, or a silicon carbide sintered body. It consists of ceramics, such as a sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics.
- the region hermetically sealed by the lid body 30 may be filled with a vacuum state or nitrogen gas or the like.
- the lid 30 is mounted on the seal ring 16 by placing it on the seal ring 16 and performing seam welding or the like.
- the lid 30 may be attached via a bonding material such as a brazing material, a glass bonding material, or a resin bonding material.
- the electronic device 1 includes an electronic component storage package 10, an electronic component 20, and a lid 30. Specifically, the electronic device 1 is mounted on the electronic component storage package 10 and the mounting region R of the electronic component storage package 10 and is connected to the wiring conductor 131 via a conductive member such as a bonding wire. The electronic component 20 and a lid 30 joined to the upper surface of the frame 12 or the seal ring 16 are provided.
- the input / output member 13 is cut out from a portion between the plurality of wiring conductors 131 on the lower surface to the outer side surface of the input / output member 13 along the wiring conductor 131. have.
- an air layer is interposed between the wiring conductors 131, and even if the wiring conductors 131 having a wide line width are arranged in close contact with each other, mismatching in characteristic impedance can be alleviated.
- the electronic component storage package 10 is prepared.
- the substrate 11, the frame 12, and the seal ring 16 constituting the electronic component storage package 10 are formed by using a conventionally known rolling process or punching process for an ingot obtained by casting a molten metal material into a mold and solidifying it. By using a metal processing method, it is manufactured in a predetermined shape.
- the material of the first insulating layer 132 and the second insulating layer 133 is an aluminum oxide sintered body among ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, or a mullite sintered body. A method for manufacturing the input / output member 13 in some cases will be described.
- an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to prepare a slurry-like ceramic material.
- the ceramic green sheet can be produced by molding a ceramic material in a mud shape into a sheet shape.
- a metal paste containing a metal powder such as molybdenum or manganese, an organic binder, an organic solvent, etc. is prepared. Then, this metal paste is formed on the ceramic green sheet by using, for example, a screen printing method in the shape of the wiring pattern to be the wiring conductor 131 or the through conductor and the predetermined shape of the other metallized pattern.
- the input / output member 13 can be produced by firing a laminate of these ceramic green sheets in a predetermined order.
- the input / output member 13 is formed with a metallized pattern at a portion to be a bonding surface to the substrate 11 or the frame 12, and can be bonded to the frame 12 or the like via a brazing material.
- the electronic component storage package 10 can be manufactured by bonding via a brazing material.
- a mounting substrate 14 having an electrical wiring formed on the upper surface is placed on the mounting region R of the electronic component storage package 10 as needed via solder. Further, the electronic component 20 is mounted on the mounting substrate 14, and the electrodes of the electronic component 20 and the electrical wiring of the mounting substrate 14 are electrically connected. Then, the electrical wiring of the mounting substrate 14 and the wiring conductor 131 of the input / output member 13 in the frame body 12 are electrically connected via a bonding wire or the like. Finally, the lid 30 is attached to the frame 12 via the seal ring 16 by seam welding or the like. In this way, the electronic device 1 can be manufactured.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Light Receiving Elements (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
図1は本発明の一実施形態に係る電子装置1を示す分解斜視図である。図1に示すように、本発明の一実施形態に係る電子装置1は、電子部品収納用パッケージ10と、電子部品収納用パッケージ10に実装された電子部品20と、電子部品20を封止する蓋体30とを備えている。
ここで、図1に示す電子装置1の製造方法を説明する。
10 電子部品収納用パッケージ
11 基板
12 枠体
13 入出力部材
131 配線導体
132 第1絶縁層
133 第2絶縁層
14 実装基板
15 光学部材
16 シールリング
20 電子部品
30 蓋体
R 載置領域
H 貫通部
C 切欠き部
P 凹部
G 外部回路基板
Claims (5)
- 電子部品が載置される載置領域を上面に有する基板と、
該基板の上面に前記載置領域を囲むように設けられた、内外に開口する貫通部を有する枠体と、
該枠体に前記貫通部を塞ぐように設けられた、前記電子部品に電気的に接続される複数の配線導体が前記枠体の内外に延在しているとともに該枠体の外側において下面に延出された入出力部材とを備え、
該入出力部材は、前記下面における複数の前記配線導体の間から該配線導体に沿って前記入出力部材の外側側面にかけて切り欠いた切欠き部を有していることを特徴とする電子部品収納用パッケージ。 - 請求項1に記載の電子部品収納用パッケージであって、
前記入出力部材は、第1絶縁層上に第2絶縁層を積層した構造であり、該第2絶縁層が前記第1絶縁層よりも前記枠体の外側に向かって突出しているとともに、前記第2絶縁層の下面に複数の前記配線導体が形成されていることを特徴とする電子部品収納用パッケージ。 - 請求項2に記載の電子部品収納用パッケージであって、
前記第1絶縁層の側面に、前記切欠き部とつながった凹部が設けられていることを特徴とする電子部品収納用パッケージ。 - 請求項1ないし請求項3のいずれかに記載の電子部品収納用パッケージであって、
前記切欠き部は、前記配線導体の間の開口部よりも奥側で幅が大きくなるように切り欠かれた二段形状であることを特徴とする電子部品収納用パッケージ。 - 請求項1ないし請求項4のいずれかに記載の電子部品収納用パッケージと、
該電子部品収納用パッケージの前記載置領域に載置されて、接続部材を介して前記配線導体に電気的に接続された電子部品と、
前記枠体の上面に接合された、前記電子部品を封止する蓋体とを備えた電子装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580011944.1A CN106062946B (zh) | 2014-03-13 | 2015-03-13 | 电子部件收纳用封装件以及电子装置 |
EP15761347.2A EP3118895B1 (en) | 2014-03-13 | 2015-03-13 | Package for housing an electronic component and electronic device including the package |
JP2016507849A JP6283094B2 (ja) | 2014-03-13 | 2015-03-13 | 電子部品収納用パッケージおよび電子装置 |
US15/122,475 US9935025B2 (en) | 2014-03-13 | 2015-03-13 | Electronic component housing package and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014050298 | 2014-03-13 | ||
JP2014-050298 | 2014-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015137489A1 true WO2015137489A1 (ja) | 2015-09-17 |
Family
ID=54071925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/057493 WO2015137489A1 (ja) | 2014-03-13 | 2015-03-13 | 電子部品収納用パッケージおよび電子装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9935025B2 (ja) |
EP (1) | EP3118895B1 (ja) |
JP (1) | JP6283094B2 (ja) |
CN (1) | CN106062946B (ja) |
WO (1) | WO2015137489A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016186128A1 (ja) * | 2015-05-20 | 2016-11-24 | 京セラ株式会社 | 半導体素子パッケージ、半導体装置および実装構造体 |
JP2017135302A (ja) * | 2016-01-29 | 2017-08-03 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
JP2018137382A (ja) * | 2017-02-23 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子部品用パッケージおよび電子装置 |
CN109417054A (zh) * | 2016-06-27 | 2019-03-01 | Ngk电子器件株式会社 | 高频用陶瓷基板及高频用半导体元件收纳封装体 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3118895B1 (en) * | 2014-03-13 | 2020-04-01 | Kyocera Corporation | Package for housing an electronic component and electronic device including the package |
US10512155B2 (en) * | 2016-01-27 | 2019-12-17 | Kyocera Corporation | Wiring board, optical semiconductor element package, and optical semiconductor device |
CN110945644B (zh) * | 2017-07-24 | 2023-10-31 | 京瓷株式会社 | 布线基板、电子装置用封装件及电子装置 |
JP6849556B2 (ja) * | 2017-08-22 | 2021-03-24 | 京セラ株式会社 | 電子装置用パッケージおよび電子装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11214556A (ja) * | 1998-01-26 | 1999-08-06 | Kyocera Corp | 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ |
JP2014027158A (ja) * | 2012-07-27 | 2014-02-06 | Kyocera Corp | 素子収納用パッケージおよび実装構造体 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3500268B2 (ja) * | 1997-02-27 | 2004-02-23 | 京セラ株式会社 | 高周波用入出力端子ならびにそれを用いた高周波用半導体素子収納用パッケージ |
JPH1174396A (ja) * | 1997-08-28 | 1999-03-16 | Kyocera Corp | 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ |
US6796725B2 (en) * | 2001-10-05 | 2004-09-28 | Kyocera America, Inc. | Opto-electronic package for integrated sealing of optical fibers |
JP2004153165A (ja) | 2002-10-31 | 2004-05-27 | Sumitomo Metal Electronics Devices Inc | 半導体素子収納用パッケージ及びその実装構造 |
SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
JP2004356391A (ja) * | 2003-05-29 | 2004-12-16 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
US7284913B2 (en) * | 2003-07-14 | 2007-10-23 | Matsushita Electric Industrial Co., Ltd. | Integrated fiber attach pad for optical package |
US6992250B2 (en) * | 2004-02-26 | 2006-01-31 | Kyocera Corporation | Electronic component housing package and electronic apparatus |
JP4511376B2 (ja) * | 2005-01-28 | 2010-07-28 | 京セラ株式会社 | 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置 |
WO2008146531A1 (ja) * | 2007-05-29 | 2008-12-04 | Kyocera Corporation | 電子部品収納用パッケージ、及び電子装置 |
JP5127475B2 (ja) * | 2008-01-28 | 2013-01-23 | 京セラ株式会社 | 接続基板および電子装置 |
US20110048796A1 (en) * | 2008-01-30 | 2011-03-03 | Kyocera Corporation | Connector, Package Using the Same and Electronic Device |
EP2485253B1 (en) * | 2009-09-29 | 2019-12-18 | Kyocera Corporation | Device housing package |
WO2012029703A1 (ja) * | 2010-08-30 | 2012-03-08 | 京セラ株式会社 | 入出力部材、素子収納用パッケージおよび半導体装置 |
EP2624293B1 (en) * | 2010-09-28 | 2018-03-07 | Kyocera Corporation | Semiconductor device housing package and electronic apparatus using the same |
JP5518260B2 (ja) * | 2011-05-31 | 2014-06-11 | 京セラ株式会社 | 素子収納用パッケージ、半導体装置用部品および半導体装置 |
US8952518B2 (en) * | 2011-07-26 | 2015-02-10 | Kyocera Corporation | Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same |
WO2013111752A1 (ja) * | 2012-01-24 | 2013-08-01 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
US9408307B2 (en) * | 2012-03-22 | 2016-08-02 | Kyocera Corporation | Device housing package |
JP5902813B2 (ja) * | 2012-06-26 | 2016-04-13 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
CN102856302B (zh) * | 2012-09-14 | 2014-11-05 | 中国科学院半导体研究所 | 光子集成芯片匹配电路的三维封装装置 |
WO2014069123A1 (ja) * | 2012-10-30 | 2014-05-08 | 京セラ株式会社 | 電子部品収納用容器および電子装置 |
US9516770B2 (en) * | 2012-11-29 | 2016-12-06 | Kyocera Corporation | Electronic component housing container and electronic device |
JP5981660B2 (ja) * | 2013-09-25 | 2016-08-31 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
US10051725B2 (en) * | 2013-10-30 | 2018-08-14 | Kyocera Corporation | Circuit board, electronic component housing package, and electronic device |
EP3118895B1 (en) * | 2014-03-13 | 2020-04-01 | Kyocera Corporation | Package for housing an electronic component and electronic device including the package |
-
2015
- 2015-03-13 EP EP15761347.2A patent/EP3118895B1/en active Active
- 2015-03-13 CN CN201580011944.1A patent/CN106062946B/zh active Active
- 2015-03-13 US US15/122,475 patent/US9935025B2/en active Active
- 2015-03-13 WO PCT/JP2015/057493 patent/WO2015137489A1/ja active Application Filing
- 2015-03-13 JP JP2016507849A patent/JP6283094B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11214556A (ja) * | 1998-01-26 | 1999-08-06 | Kyocera Corp | 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ |
JP2014027158A (ja) * | 2012-07-27 | 2014-02-06 | Kyocera Corp | 素子収納用パッケージおよび実装構造体 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016186128A1 (ja) * | 2015-05-20 | 2016-11-24 | 京セラ株式会社 | 半導体素子パッケージ、半導体装置および実装構造体 |
US10068818B2 (en) | 2015-05-20 | 2018-09-04 | Kyocera Corporation | Semiconductor element package, semiconductor device, and mounting structure |
JP2017135302A (ja) * | 2016-01-29 | 2017-08-03 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
CN109417054A (zh) * | 2016-06-27 | 2019-03-01 | Ngk电子器件株式会社 | 高频用陶瓷基板及高频用半导体元件收纳封装体 |
CN109417054B (zh) * | 2016-06-27 | 2022-11-15 | Ngk电子器件株式会社 | 高频用陶瓷基板及高频用半导体元件收纳封装体 |
JP2018137382A (ja) * | 2017-02-23 | 2018-08-30 | 京セラ株式会社 | 配線基板、電子部品用パッケージおよび電子装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015137489A1 (ja) | 2017-04-06 |
EP3118895A4 (en) | 2017-11-15 |
CN106062946A (zh) | 2016-10-26 |
US9935025B2 (en) | 2018-04-03 |
EP3118895A1 (en) | 2017-01-18 |
JP6283094B2 (ja) | 2018-02-21 |
EP3118895B1 (en) | 2020-04-01 |
CN106062946B (zh) | 2018-10-23 |
US20170069556A1 (en) | 2017-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6283094B2 (ja) | 電子部品収納用パッケージおよび電子装置 | |
EP2221867B1 (en) | Connection terminal, package using the same, and electronic device | |
US20110048796A1 (en) | Connector, Package Using the Same and Electronic Device | |
WO2015129731A1 (ja) | 電子部品収納用パッケージおよび電子装置 | |
WO2015030093A1 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP2009158511A (ja) | 入出力端子及び半導体素子収納用パッケージ | |
JP4511376B2 (ja) | 接続端子ならびにこれを用いた電子部品収納用パッケージおよび電子装置 | |
JP2016115736A (ja) | 半導体素子パッケージおよび半導体装置 | |
WO2015088028A1 (ja) | 素子収納用パッケージおよび実装構造体 | |
JP6224322B2 (ja) | 電子部品収納用パッケージおよびそれを用いた電子装置 | |
JP2009283898A (ja) | 電子部品容器体およびそれを用いた電子部品収納用パッケージならびに電子装置 | |
JP5812671B2 (ja) | 素子収納用パッケージおよびこれを備えた半導体装置 | |
JP5709427B2 (ja) | 素子収納用パッケージおよびこれを備えた半導体装置 | |
JP5235612B2 (ja) | パッケージ及び電子装置 | |
WO2021166498A1 (ja) | 配線基体および電子装置 | |
JP7244630B2 (ja) | 配線基板、電子部品用パッケージおよび電子装置 | |
JP4514597B2 (ja) | 電子部品実装用基板 | |
JP2002231845A (ja) | 電子部品収納用パッケージ | |
JP2021120985A (ja) | 配線基体および電子装置 | |
JP2017152557A (ja) | 光半導体素子収納用パッケージおよび光半導体装置 | |
JP4214035B2 (ja) | 配線基板および電子装置 | |
JP4000093B2 (ja) | 入出力端子、入出力端子の製造方法、入出力端子を用いた半導体素子収納用パッケージおよび半導体装置 | |
JP4535894B2 (ja) | 配線基板 | |
JP6525855B2 (ja) | 半導体素子パッケージおよび半導体装置 | |
JP6042773B2 (ja) | 入出力端子および入出力端子の製造方法、ならびにこれを用いた半導体素子収納用パッケージおよび半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15761347 Country of ref document: EP Kind code of ref document: A1 |
|
REEP | Request for entry into the european phase |
Ref document number: 2015761347 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15122475 Country of ref document: US Ref document number: 2015761347 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2016507849 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |