US20220149592A1

US20220149592A1 - Optical semiconductor module

Info

Publication number: US20220149592A1
Application number: US17/521,660
Authority: US
Inventors: Naoki ITABASHI
Original assignee: Sumitomo Electric Industries Ltd
Current assignee: Sumitomo Electric Industries Ltd
Priority date: 2020-11-09
Filing date: 2021-11-08
Publication date: 2022-05-12
Also published as: JP2022076389A; CN114530756A

Abstract

An optical semiconductor module according to the embodiment includes: a board including a transmission line; a block including a low-permittivity material; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and

a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.

Description

TECHNICAL FIELD

The present disclosure relates to an optical semiconductor module.
The application is based upon and claims the benefit of priority from Japanese Patent Application No. 2020-186793, filed Nov. 9, 2020, the entire contents of which are incorporated herein by reference.

BACKGROUND

Japanese Unexamined Patent Publication No. 2017-107920 discloses a semiconductor module having a laser unit and an optical modulator unit manufactured on a substrate. The semiconductor module includes a semiconductor laser in which a DFB laser and an EA modulator are integrated and a subcarrier having a high-frequency wiring which is a coplanar wiring. The semiconductor laser has a ground electrode on a back surface. A step difference formed with an upper stage and a lower stage is formed on an upper surface of the subcarrier. A lower surface of the subcarrier is flat. The high-frequency wiring has a coplanar line formed on the upper stage of the upper surface of the subcarrier. The coplanar line includes a ground wiring and a signal wiring. The ground electrode is formed in the lower stage of the upper surface of the subcarrier. The semiconductor laser is disposed so that the ground electrode provided on the back surface is in contact with the ground electrode of the subcarrier.

SUMMARY

An optical semiconductor module according to one aspect of the present disclosure includes a board including a transmission line; a block including a low-permittivity material; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.
An optical semiconductor module according to another aspect of the present disclosure includes a board; a block including a low-permittivity material and a transmission line; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view schematically illustrating an internal structure of an optical semiconductor module according to an embodiment.

FIG. 2 is a plan view schematically illustrating a substrate on which a semiconductor laser element is mounted and a block on which an inductor is mounted in the optical semiconductor module.

FIG. 3 is a side view schematically illustrating the inductor mounted on the block.

FIG. 4 is a plan view schematically illustrating the substrate on which the semiconductor laser element is mounted and the block on which the inductor is mounted in an optical semiconductor module different from that in FIG. 2.

FIG. 5 is a diagram illustrating an equivalent circuit of an exemplary optical semiconductor module.

FIG. 6 is a diagram illustrating an equivalent circuit which is a simplification of the equivalent circuit of FIG. 5.

FIG. 7 is a diagram illustrating an equivalent circuit of an optical semiconductor module according to a reference example.

FIG. 8 is a graph illustrating an example of a relationship between frequency and transmission characteristics.

FIG. 9 is a graph illustrating an example of a relationship between frequency and transmission characteristics.

FIG. 10 is a diagram illustrating an equivalent circuit of an optical semiconductor module according to a modified example.

FIG. 11 is a side view schematically illustrating a temperature control element, a substrate, and a semiconductor laser element of the optical semiconductor module of FIG. 2.

DETAILED DESCRIPTION

Specific examples of an optical semiconductor module according to an embodiment of the present disclosure will be described with reference to the drawings. The present invention is not limited to these examples, and is indicated by the scope of claims and is intended to include all modifications within the scope equivalent to the scope of claims. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and duplicate description will be omitted as appropriate. The drawings are partially simplified or exaggerated for the ease of understanding, and the dimensional ratios and the like are not limited to those described in the drawings.

First Embodiment

FIG. 1 is a plan view schematically illustrating an internal structure of an optical semiconductor module 1 according to a first embodiment. The optical semiconductor module 1 includes, for example, a rectangular housing 2 and external terminals 3 provided at one end of the housing 2 in a direction D1 which is the longitudinal direction of the housing 2. The external terminals 3 are aligned at one end of the housing 2 in the direction D1 along a direction D2 which is the width direction of the housing 2. The direction D2 is a direction intersecting the direction D1. The external terminals 3 are, for example, a terminal that receives a high-speed electric signal from the outside, a terminal that receives a drive current of a laser diode, a terminal that receives a drive current of a TEC, a monitor terminal for detecting a temperature of the laser diode, a terminal that supplies a ground potential (reference potential), and the like. As signals exchanged with the outside via the external terminals 3, there are high-speed signals and low-speed signals. The low speed signal includes a DC signal. The housing 2 has an inner wall 2 b that defines an internal space S of the housing 2. An optical output unit 4 that outputs a light beam L (optical transmission signal) is provided at an end of the housing 2 opposite to the external terminal 3 in the direction D1.
The optical semiconductor module 1 includes, for example, a transmission line 5, a pad 6 which is a DC pad, and a thermo-electric cooler (TEC) 7 which is a temperature control element in the internal space S of the housing 2. FIG. 2 is a schematic plan view in which an upper structure of the TEC 7 is enlarged. FIG. 11 is a side view schematically illustrating the upper structure of the TEC 7. As illustrated in FIGS. 1 and 2, the optical semiconductor module 1 includes the TEC 7, an AlN (Aluminum Nitride) substrate 8 (board) on which a semiconductor laser element 10 is mounted, and a block 9 on which an inductor 15 is mounted. The transmission line 5 and the pads 6 are formed on the inner surface of the housing 2. The transmission line 5 and the pads 6 are connected to the external terminals 3 by the wiring penetrating the inner wall 2 b. The wirings connecting each of the transmission line 5 and the pad 6 to the external terminal 3 is formed by, for example, metal plating or thin film deposition. The transmission line 5 includes a signal wiring 5 s extending in one direction at a certain distance from a ground wiring 5 g running in parallel.
For example, the AlN substrate 8 is stacked and mounted on the TEC 7 in a direction D3 which is the height direction. The direction D3 is a direction intersecting direction D1 and direction D2. The housing 2 accommodates, for example, the TEC 7, the AlN substrate 8, the block 9, the semiconductor laser element 10, and the inductor 15 in the internal space S. The TEC 7 has a heat sink surface 7 a and a temperature control surface 7 b. The TEC 7 is mounted on the housing 2 with the heat sink surface 7 a in contact with the housing 2. The temperature control surface 7 b is located opposite to the heat sink surface 7 a in the direction D3. For example, the heat sink surface 7 a and the temperature control surface 7 b are planes parallel to the directions D1 and D2. More specifically, for example, the AlN substrate 8 is mounted on the temperature control surface 7 b in contact with the temperature control surface 7 b. The AlN substrate 8 has a first surface 8 a which is a lower surface and a second surface 8 b which is an upper surface. The first surface 8 a is in surface contact with the temperature control surface 7 b. The second surface 8 b is a reverse surface of the first surface 8 a. The AlN substrate 8 has the second surface 8 b opposite to the TEC 7. The semiconductor laser element 10 is mounted on the second surface 8 b. The block 9 is juxtaposed with the AlN substrate 8 on the TEC 7. The TEC 7 performs the temperature controlling of, for example, the semiconductor laser element 10. For example, when a predetermined current is allowed to flow through the TEC 7, heat is absorbed in the temperature control surface 7 b, and the heat amount absorbed is exhausted from the heat sink surface 7 a. At this time, the semiconductor laser element 10 is cooled via the AlN substrate 8. For example, when a current is allowed to flow through the TEC 7 in a direction opposite to the predetermined current, heat is absorbed on the heat sink surface 7 a, and the heat amount absorbed is exhausted from the temperature control surface 7 b. At this time, the semiconductor laser element 10 is heated via the AlN substrate 8. The block 9 is made of a low dielectric constant material (low-permittivity material). For example, the block 9 is made of quartz. For example, a relative permittivity of the low dielectric constant material is 3 to 5. The AlN substrate 8 includes, for example, an insulator. The relative permittivity of the low dielectric constant material of the block 9 is smaller than the relative permittivity of the insulator of the AlN substrate 8. For example, the relative permittivity of the insulator is 8 to 10. The semiconductor laser element 10 is, for example, an Electro-absorption Modulator integrated Laser (EML). For example, the semiconductor laser element 10 includes a laser diode 10 b and an optical modulator 10 c (modulator). By maintaining the temperature of the semiconductor laser element 10 at a predetermined temperature, the optical characteristics and the electrical characteristics of the semiconductor laser element 10 can be stabilized against changes in the external environmental temperature. For example, the peak wavelength of the optical signal output from the semiconductor laser element 10 can be maintained within a predetermined range.
FIG. 3 is a side view schematically illustrating the block 9 and the inductor 15. As illustrated in FIGS. 2 and 3, the block 9 has a third surface 9 a which is a lower surface and a fourth surface 9 b which is an upper surface. The third surface 9 a is connected to the temperature control surface 7 b. The fourth surface 9 b is a surface opposite to the third surface 9 a. The fourth surface 9 b faces the inductor 15. A wiring 9 c is formed on the fourth surface 9 b. The block 9 is mounted, for example, on the temperature control surface 7 b of the TEC 7. The third surface 9 a of the block 9 is in contact with, for example, the temperature control surface 7 b of the TEC 7. The TEC 7 is mounted on the inner surface of the housing 2 with the heat sink surface 7 a in contact with the inner surface of the housing 2. The fourth surface 9 b is, for example, a plane parallel to the direction D1 and the direction D2. The wiring 9 c includes, for example, a first wiring 9 d provided on the external terminals 3 side and a second wiring 9 f provided on the optical output unit 4 side. For example, the first wiring 9 d is disposed between the external terminals and the second wiring 9 f in the direction D1. For example, the second wiring 9 f is disposed between the first wiring 9 d and the optical output unit 4 in the direction D1. The first wiring 9 d and the second wiring 9 f are isolated from each other. A resistor 16 is mounted on the fourth surface 9 b. The resistor 16 is disposed, for example, between the first wiring 9 d and the second wiring 9 f The resistor 16 is electrically connected between the first wiring 9 d and the second wiring 9 f The inductor 15 is electrically connected between the first wiring 9 d and the second wiring 9 f One end (first electrode) of the inductor 15 is connected to the first wiring 9 d, and the other end (second electrode) of the inductor 15 is connected to the second wiring 9 f The resistor 16 is connected in parallel with the inductor 15 between the first wiring 9 d and the second wiring 9 f The optical semiconductor module 1 includes an RC series circuit 17. The inductor 15 is electrically connected between the RC series circuit 17 and a transmission line 11 described later. The inductor 15 functions as, for example, a bias T. The bias T supplies a bias (DC potential) to the transmission line 11. The bias becomes a reference potential of a high frequency signal propagating on the transmission line 11. The bias T has a high impedance at the high frequency as viewed from the transmission line 11, and the influence on the high frequency signal is suppressed to be small. The inductor 15 is mounted on the first wiring 9 d and the second wiring 9 f For example, the electrode (first electrode) at one end of the inductor 15 is soldered to the first wiring 9 d, and the electrode (second electrode) at the other end of the inductor 15 is soldered to the second wiring 9 f The RC series circuit may be configured by forming, for example, the pads 6 for mounting the resistor on the inner surface of the housing 2 and the pads 6 for mounting the capacitor and connecting these pads by wiring. The wiring to which these pads connect may be formed by plating or vapor deposition.
The AlN substrate 8 has the transmission line 11 on the second surface 8 b opposite to the TEC 7. The transmission line 11 includes a ground wiring 11 c running in parallel and a high-frequency wiring 11 b extending in one direction (D1 direction) while maintaining a constant distance. For example, the ground wiring 11 c includes a first ground wiring portion 11 d on which a die 12, a chip 13, and a resistor 14 are mounted and a second ground wiring portion 11 f located opposite to the first ground wiring portion 11 d as viewed from the high-frequency wiring 11 b. The second ground wiring portion 11 f is located opposite to the first ground wiring portion 11 d as viewed from the high-frequency wiring 11 b. In other words, the high-frequency wiring 11 b is disposed between the first ground wiring portion 11 d and the second ground wiring portion 11 f in the direction D2. It is noted that the first ground wiring portion 11 d and the second ground wiring portion 11 f are connected to each other between the high-frequency wiring 11 b and the optical output unit 4. Similar to the transmission line 11, the ground wiring 11 c may not be the wiring extending in one direction but may be a wide wiring pattern having a portion that maintains a certain distance from the transmission line.
A wire W1, a wire W2, a wire W3, and a wire W4 extend from the die 12, the first ground wiring portion 11 d, the high-frequency wiring 11 b, and the second ground wiring portion 11 f, respectively. For example, the optical semiconductor module 1 further connects a wire W5 connecting the die 12 and the laser diode 10 b to each other, a wire W6 connecting one end of the resistor 14 and the modulator 10 c to each other, and a wire W7 connecting the high-frequency wiring 11 b and the modulator 10 c to each other.
Further, the optical semiconductor module 1 includes a wire W8 connecting the RC series circuit 17 and the inductor 15 to each other and a wire W9 connecting the inductor 15 and the transmission line 11 to each other. The wires W1, W2, W3, W4, W5, W6, W7, W8, and W9 are, for example, bonding wires. The diameters of the wires W1, W2, W3, W4, W5, W6, W7, W8, and W9 are, for example, 18 μm, 25 μm, or 50 μm. The diameters of the wires W1, W2, W3, W4, W5, W6, W7, W8, and W9 may have the same value or different values from each other. It is noted that the wires W1, W2, W3, W4, W5, W6, W7, W8, and W9 may not be bonding wires but may be ribbon wires. The ribbon wire has a flat cross section rather than a circular cross section of, for example, a bonding wire. For example, in the ribbon wire, the lateral width of the cross section is twice or more of a thickness of the cross section. The wire W9 corresponds to the first wire connecting the inductor 15 and the transmission line 11 to each other. The wire W7 corresponds to the second wire connecting the semiconductor laser element 10 and the transmission line 11 to each other. An inductance of the wire W9 is larger than an inductance of the wire W7. For example, the wire W9 may be longer than the wire W7. A cross-sectional area (diameter as an example) of the wire W9 may be smaller than a cross-sectional area of the wire W7.

Second Embodiment

Next, an optical semiconductor module 21 according to a second embodiment will be described with reference to FIG. 4. The partial configuration of the optical semiconductor module 21 according to the second embodiment is the same as the partial configuration of the optical semiconductor module 1 described above. Therefore, redundant description of the optical semiconductor module 1 is denoted by the same reference numerals as those of the elements of the optical semiconductor module 1 and omitted as appropriate. As illustrated in FIG. 4, in the optical semiconductor module 21, the block 9 has a transmission line 22 on the fourth surface 9 b. The transmission line 22 includes a ground wiring 22 c running in parallel and a high-frequency wiring 22 b extending in one direction at a certain distance. The ground wiring 22 c includes, for example, a third ground wiring portion 22 d and a fourth ground wiring portion 22 f located opposite to the third ground wiring portion 22 d as viewed from the high-frequency wiring 22 b. For example, in the optical semiconductor module 21, the AlN substrate 8 has only the first ground wiring portion 11 d.
The optical semiconductor module 21 further includes, for example, a wire W10 connecting the third ground wiring portion 22 d formed on the block 9 and the first ground wiring portion 11 d formed on the AlN substrate 8 to each other. In the optical semiconductor module 21, a wire W9 extending from the inductor 15 is connected to the transmission line 22. The wire W7 connects the high-frequency wiring 22 b and the modulator 10 c to each other. Similar to the optical semiconductor module 1 described above, the inductance of the wire W9 is larger than the inductance of the wire W7.
Next, the functions and effects obtained from the optical semiconductor modules 1 and 21 according to the above-described embodiments will be described. In the optical semiconductor module 1 according to the first embodiment, as illustrated in FIG. 2, the AlN substrate 8 has the transmission line 11. An inductor 15 is mounted on the block 9. The semiconductor laser element 10 is mounted on the AlN substrate 8. The block 9 is made of a low dielectric constant material. Therefore, it is possible to reduce a parasitic capacitance of the wiring 9 c formed on the fourth surface 9 b with respect to a ground potential. The inductance of the wire W9 connecting the inductor 15 and the transmission line 11 to each other is larger than the inductance of the wire W7 connecting the semiconductor laser element 10 and the transmission line 11 to each other. Since the inductance of the wire W9 connecting the inductor 15 and the transmission line 11 to each other is large, it is possible to suppress the influence on the high frequency signal propagating on the high-frequency wiring 11 b even in the state where there is an inductor 15. Then, it is possible to implement a wide band of the frequency characteristics of the optical semiconductor module 1.
In the optical semiconductor module 21 according to the second embodiment, as illustrated in FIG. 4, the block 9 has the transmission line 22, and the inductor 15 is mounted on the block 9. The semiconductor laser element 10 is mounted on the AlN substrate 8. In the optical semiconductor module 21, similar to the optical semiconductor module 1, since the block 9 is made of a low dielectric constant material, the parasitic capacitance of the wiring 9 c formed on the fourth surface 9 b can be reduced. Since the transmission line 22 is formed on a material having a low dielectric constant as compared with the first embodiment, it is possible to suppress a transmission loss (for example, a dielectric tangent) when transmitting the high frequency signal. Further, similarly to the wiring 9 c, the parasitic capacitance of the transmission line 22 can be reduced. Therefore, it is possible to implement a much wider band in the frequency characteristics of the transmission line 22. The inductance of the wire W9 connecting the inductor 15 and the transmission line 22 to each other is larger than the inductance of the wire W7 connecting the semiconductor laser element 10 and the transmission line 22 to each other. Therefore, even in the state where the inductor 15 exists, the influence on the high frequency signal propagating on the high-frequency wiring 22 b can be suppressed. Then, it is possible to implement a wide band of the optical semiconductor module 21.
FIG. 5 is a diagram illustrating an equivalent circuit regarding the bias T of the optical semiconductor module 1 (or the optical semiconductor module 21). The bias T includes, for example, the wire W9, the inductor 15, the resistor 16, and the RC series circuit 17. FIG. 6 is an equivalent circuit that is a simplification of the equivalent circuit of FIG. 5. As illustrated in FIGS. 5 and 6, when the inductance of the wire W9 is denoted by L, the resistance of the resistor 16 is denoted by R_para, the resistance of the RC series circuit 17 is denoted by R_dump, and R=R_para+R_dump, then a resonance frequency ω₀of a series circuit of the inductance L and the RC parallel circuit is expressed by Mathematical

Formula (1).

$\begin{matrix} [Mathematical Formula 1] \\ ω_{0} = \sqrt{\frac{1}{L C} - \frac{1}{{(C R)}^{2}}} & (1) \end{matrix}$
In Mathematical Formula (1), if R→∞, ω₀is equal to a resonance frequency in a series LC resonance circuit of the inductance L and the capacitance C. On the other hand, the impedance Z (ω=ω₀) at the resonance frequency ω₀is expressed by Mathematical Formula (2).
$\begin{matrix} [Mathematical Formula 2] \\ Z (ω = ω_{0}) = \frac{R}{1 + {(ω_{0} C R)}^{2}} & (2) \end{matrix}$
In the optical semiconductor module 1 (or the optical semiconductor module 21), since R is not 0, the impedance Z (ω=ω₀) does not become 0, and the smaller the ω₀(the larger L), the higher the impedance Z. Therefore, under the condition that the value of the product CR of the capacitance C and the resistor R in Mathematical Formulas (1) and (2) is constant, as the value of L is larger, the decrease in impedance at the resonance frequency can be suppressed. As described above, when the inductance L of the wire W9 extending from the inductor 15 is large, it is possible to implement a wide band of the frequency characteristics of the transmission line 11 under the condition that there is an inductor 15.
In this embodiment, the block 9 further has the resistor 16 connected in parallel to the inductor 15. Therefore, the damping effect of the resistor 16 can reduce the dip associated with the parasitic capacitance.
In the present embodiment, the optical semiconductor module 1 (or the optical semiconductor module 21) further includes the RC series circuit 17. The inductor 15 is electrically connected between the RC series circuit 17 and the transmission line 11 (or the transmission line 22). In this case, the transmission dip can be further reduced.
In this embodiment, the block 9 is disposed adjacent to the AlN substrate 8 on the temperature control surface 7 b of the TEC 7. Therefore, the block 9 on which the inductor 15 is mounted can be disposed at a position adjacent to the AlN substrate 8. For example, in a plan view from the direction D3, the distance between the block 9 and the AlN substrate 8 can be reduced down to 50 to 150 μm. As a result, the inductor 15 can be disposed close to the transmission line 11 formed on the AlN substrate 8. The transmission line 22 may be formed on the fourth surface 9 b of the block 9. In that case, the inductor 15 can be disposed close to the transmission line 22. It is noted that, for example, the AlN substrate 8 and the block 9 are mounted on the temperature control surface 7 b of the TEC 7. However, when the semiconductor laser element 10 does not require temperature control, the AlN substrate 8 and the block 9 may be mounted directly on the inner surface of the housing 2.
In the present embodiment, the dielectric constant of the low dielectric constant material of the block 9 is smaller than the dielectric constant of the insulator of the AlN substrate 8. Therefore, since the dielectric constant of the low dielectric constant material of the block 9 is smaller than the dielectric constant of the insulator of the AlN substrate 8, the parasitic capacitance can be further reduced. At this time, a thickness of the AlN substrate 8 may be allowed to be substantially equal to a thickness of the block 9. Accordingly, the parasitic capacitance of the wiring connected to the inductor 15 can be reliably reduced as compared with the case where the inductor 15 is mounted on the AlN substrate 8.
In the present embodiment, the inductance of the wire W9 may be twice or more of the inductance of the wire W7. In this case, it is possible to implement a much wider band.
Next, an example will be described. The present invention is not limited to the following example. An optical semiconductor module according to the example is the above-mentioned optical semiconductor module 1. As illustrated in FIG. 5, the optical semiconductor module according to the example includes the resistor 16 disposed in parallel with the inductor 15, and the RC series circuit 17. FIG. 7 illustrates an equivalent circuit relating to the bias T of the optical semiconductor module according to Reference Example. As illustrated in FIG. 7, the optical semiconductor module according to Reference Example does not have a configuration corresponding to the resistor 16 and the RC series circuit 17.
FIG. 8 illustrates the results of simulating the frequency characteristics (transmission characteristics) of the transmission line 11 in each of the optical semiconductor modules of the above Examples and Reference Examples. In FIG. 8, the horizontal axis represents a frequency of a signal transmitted through the transmission line, and the vertical axis represents a ratio of a signal strength (output signal strength) of a signal output from the transmission line with respect to a signal strength (input signal strength) of a signal input to the transmission line in decibel (dB). For example, when the output signal strength is equal to the input signal strength, the output signal strength becomes 0 dB. When the value of the transmission characteristic is larger than 0 dB, the output signal strength is larger than the input signal strength. When the value of the transmission characteristic is smaller than 0 dB, the output signal strength is smaller than the input signal strength. That is, when there is a loss in the transmission line, the output signal strength is smaller than the input signal strength, so that the value of the transmission characteristic becomes small. As illustrated in FIG. 8, in the optical semiconductor module according to Reference Example which does not have the resistor 16 and the RC series circuit 17, a large resonance dip (transmission dip) occurs at a frequency of around 30 GHz. The resonance dip indicates that the signal strength is greatly lost when the signal is transmitted through the transmission line 11. In contrast, it is found that, in the optical semiconductor module according to the embodiment, almost no resonance dip occurs similarly to the case where the bias T is not provided. That is, the loss is significantly suppressed. The bias T is necessary to provide the reference potential for the high frequency signal propagating on the transmission line. The fact that the equivalent characteristics do not deteriorate when the bias T is provided as compared with the case where the bias T is not provided is an example illustrating that the examples are more useful than Reference Examples.
FIG. 9 illustrates the result of simulation of the transmission characteristics when the inductance of the wire W9 is changed in the optical semiconductor module according to Example. As illustrated in FIG. 9, when the inductance of the wire W9 is 300 pH, a slight dip and high frequency loss occur. In contrast, it is found that, when the inductance of the wire W9 is 600 pH or more (600 pH or 1.2 nH), almost no dip and high frequency loss occur similarly to the case where the bias T is not provided.
The embodiments and examples of the optical semiconductor module according to the present disclosure have been described above. However, the present invention is not limited to the above-described embodiments or examples. It is easily recognized by those skilled in the art that the present invention can be changed and modified in various forms within the scope of the spirit described in the claims.
For example, in the above-described embodiment, as illustrated in FIG. 5, the optical semiconductor module 1 and the optical semiconductor module 21 including the resistor 16 and the RC series circuit 17 are described. However, as illustrated in FIG. 10, the optical semiconductor module may be, for example, an optical semiconductor module which does not include the RC series circuit 17. At least one of the resistor 16 and the RC series circuit 17 may be omitted.
In the above-described embodiment, the example where the die 12, the chip 13, and the resistor 14 are mounted on the transmission line 11 is described. However, the type and number of elements mounted on the transmission line 11 are not limited to the above example and can be changed as appropriate. In the above-described embodiment, the example where the semiconductor laser element 10 is EML is described. However, the semiconductor laser element may be a semiconductor laser element other than EML.
In the above-described embodiment, the example where the substrate is an AlN substrate 8 and the block 9 is a quartz substrate is described. However, the material of the substrate may be other than AlN. The block may be made of alumina, FPC or polyimide. That is, the materials of the substrate and the block are not particularly limited as long as the dielectric constant of the low dielectric constant material of the block 9 is smaller than the dielectric constant of the insulator of the substrate.

Claims

What is claimed is:

1. An optical semiconductor module comprising:

a board including a transmission line;

a block including a low-permittivity material;

an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance;

a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and

2. An optical semiconductor module comprising:

a board;

a block including a low-permittivity material and a transmission line;

3. The optical semiconductor module according to claim 1, wherein the block further has a resistor connected in parallel with the inductor.

4. The optical semiconductor module according to claim 1, further comprising an RC series circuit,

wherein the inductor is connected between the RC series circuit and the transmission line.

5. The optical semiconductor module according to claim 1, wherein the block is disposed adjacent to the board inside the housing.

6. The optical semiconductor module according to claim 1, wherein a dielectric constant of the low-permittivity material is smaller than a dielectric constant of an insulator of the board.

7. The optical semiconductor module according to claim 1, wherein the inductance of the first wire is twice or more of the inductance of the second wire.

8. The optical semiconductor module according to claim 2, wherein the block further has a resistor connected in parallel with the inductor.

9. The optical semiconductor module according to claim 2, further comprising an RC series circuit,

10. The optical semiconductor module according to claim 2, wherein the block is disposed adjacent to the board inside the housing.

11. The optical semiconductor module according to claim 2, wherein a dielectric constant of the low-permittivity material is smaller than a dielectric constant of an insulator of the board.

12. The optical semiconductor module according to claim 2, wherein the inductance of the first wire is twice or more of the inductance of the second wire.