JPWO2024004590A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024004590A5
JPWO2024004590A5 JP2024530634A JP2024530634A JPWO2024004590A5 JP WO2024004590 A5 JPWO2024004590 A5 JP WO2024004590A5 JP 2024530634 A JP2024530634 A JP 2024530634A JP 2024530634 A JP2024530634 A JP 2024530634A JP WO2024004590 A5 JPWO2024004590 A5 JP WO2024004590A5
Authority
JP
Japan
Prior art keywords
stretchable
adhesive layer
substrate
wiring
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024530634A
Other languages
English (en)
Japanese (ja)
Other versions
JP7722583B2 (ja
JPWO2024004590A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021562 external-priority patent/WO2024004590A1/ja
Publication of JPWO2024004590A1 publication Critical patent/JPWO2024004590A1/ja
Publication of JPWO2024004590A5 publication Critical patent/JPWO2024004590A5/ja
Application granted granted Critical
Publication of JP7722583B2 publication Critical patent/JP7722583B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024530634A 2022-06-28 2023-06-09 伸縮性デバイス Active JP7722583B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022103956 2022-06-28
JP2022103956 2022-06-28
PCT/JP2023/021562 WO2024004590A1 (ja) 2022-06-28 2023-06-09 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024004590A1 JPWO2024004590A1 (https=) 2024-01-04
JPWO2024004590A5 true JPWO2024004590A5 (https=) 2025-03-07
JP7722583B2 JP7722583B2 (ja) 2025-08-13

Family

ID=89382035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530634A Active JP7722583B2 (ja) 2022-06-28 2023-06-09 伸縮性デバイス

Country Status (2)

Country Link
JP (1) JP7722583B2 (https=)
WO (1) WO2024004590A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) 2015-12-21 2017-06-29 パナソニックIpマネジメント株式会社 生体センサー・デバイス
JP7389958B2 (ja) 2019-03-20 2023-12-01 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7584033B2 (ja) 2019-04-18 2024-11-15 パナソニックIpマネジメント株式会社 回路実装品、及びデバイス

Similar Documents

Publication Publication Date Title
CN105304686B (zh) 一种显示面板及其制作方法
TWI609465B (zh) 散熱封裝構造
JP2018160653A5 (https=)
JPWO2020089726A5 (https=)
JP2019109291A5 (https=)
JPWO2024004590A5 (https=)
CN111445801B (zh) 一种显示面板及显示装置
JPWO2024070592A5 (https=)
JPWO2023032329A5 (https=)
TW201909717A (zh) 電子模組
JPWO2024214583A5 (https=)
JP2004079731A (ja) 可撓性回路基板
US20100300730A1 (en) Electronic apparatus and flexible printed circuit thereof
JPWO2024070591A5 (https=)
US20210405715A1 (en) Display panel and electronic device
JPWO2023171294A5 (https=)
JPWO2024225388A5 (https=)
JP7574585B2 (ja) 放熱構造体
CN118678529B (zh) 具有电磁屏蔽的软性线路板及其制造方法
TWI622971B (zh) 可撓性疊層結構及顯示器
JPWO2024043008A5 (https=)
JP2008277637A (ja) チップ抵抗器
JPWO2024214573A5 (https=)
US20100163299A1 (en) Electronic device and high frequency circuit board thereof
JPWO2024070518A5 (https=)