JP7722583B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7722583B2
JP7722583B2 JP2024530634A JP2024530634A JP7722583B2 JP 7722583 B2 JP7722583 B2 JP 7722583B2 JP 2024530634 A JP2024530634 A JP 2024530634A JP 2024530634 A JP2024530634 A JP 2024530634A JP 7722583 B2 JP7722583 B2 JP 7722583B2
Authority
JP
Japan
Prior art keywords
stretchable
adhesive layer
wiring
substrate
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024530634A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024004590A1 (https=
JPWO2024004590A5 (https=
Inventor
遼 浅井
圭佑 西田
勇人 勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024004590A1 publication Critical patent/JPWO2024004590A1/ja
Publication of JPWO2024004590A5 publication Critical patent/JPWO2024004590A5/ja
Application granted granted Critical
Publication of JP7722583B2 publication Critical patent/JP7722583B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
JP2024530634A 2022-06-28 2023-06-09 伸縮性デバイス Active JP7722583B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022103956 2022-06-28
JP2022103956 2022-06-28
PCT/JP2023/021562 WO2024004590A1 (ja) 2022-06-28 2023-06-09 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024004590A1 JPWO2024004590A1 (https=) 2024-01-04
JPWO2024004590A5 JPWO2024004590A5 (https=) 2025-03-07
JP7722583B2 true JP7722583B2 (ja) 2025-08-13

Family

ID=89382035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530634A Active JP7722583B2 (ja) 2022-06-28 2023-06-09 伸縮性デバイス

Country Status (2)

Country Link
JP (1) JP7722583B2 (https=)
WO (1) WO2024004590A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
JP2020155605A (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2020213683A1 (ja) 2019-04-18 2020-10-22 パナソニックＩｐマネジメント株式会社 回路実装品、及びデバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113088A (ja) 2015-12-21 2017-06-29 パナソニックＩｐマネジメント株式会社 生体センサー・デバイス
JP2020155605A (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2020213683A1 (ja) 2019-04-18 2020-10-22 パナソニックＩｐマネジメント株式会社 回路実装品、及びデバイス

Also Published As

Publication number Publication date
JPWO2024004590A1 (https=) 2024-01-04
WO2024004590A1 (ja) 2024-01-04

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