JPWO2024004590A1 - - Google Patents
Info
- Publication number
- JPWO2024004590A1 JPWO2024004590A1 JP2024530634A JP2024530634A JPWO2024004590A1 JP WO2024004590 A1 JPWO2024004590 A1 JP WO2024004590A1 JP 2024530634 A JP2024530634 A JP 2024530634A JP 2024530634 A JP2024530634 A JP 2024530634A JP WO2024004590 A1 JPWO2024004590 A1 JP WO2024004590A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022103956 | 2022-06-28 | ||
| JP2022103956 | 2022-06-28 | ||
| PCT/JP2023/021562 WO2024004590A1 (ja) | 2022-06-28 | 2023-06-09 | 伸縮性デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004590A1 true JPWO2024004590A1 (https=) | 2024-01-04 |
| JPWO2024004590A5 JPWO2024004590A5 (https=) | 2025-03-07 |
| JP7722583B2 JP7722583B2 (ja) | 2025-08-13 |
Family
ID=89382035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530634A Active JP7722583B2 (ja) | 2022-06-28 | 2023-06-09 | 伸縮性デバイス |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7722583B2 (https=) |
| WO (1) | WO2024004590A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017113088A (ja) * | 2015-12-21 | 2017-06-29 | パナソニックＩｐマネジメント株式会社 | 生体センサー・デバイス |
| JP2020155605A (ja) * | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| WO2020213683A1 (ja) * | 2019-04-18 | 2020-10-22 | パナソニックＩｐマネジメント株式会社 | 回路実装品、及びデバイス |
-
2023
- 2023-06-09 JP JP2024530634A patent/JP7722583B2/ja active Active
- 2023-06-09 WO PCT/JP2023/021562 patent/WO2024004590A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017113088A (ja) * | 2015-12-21 | 2017-06-29 | パナソニックＩｐマネジメント株式会社 | 生体センサー・デバイス |
| JP2020155605A (ja) * | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| WO2020213683A1 (ja) * | 2019-04-18 | 2020-10-22 | パナソニックＩｐマネジメント株式会社 | 回路実装品、及びデバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7722583B2 (ja) | 2025-08-13 |
| WO2024004590A1 (ja) | 2024-01-04 |
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