JPWO2022230848A5 - - Google Patents

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Publication number
JPWO2022230848A5
JPWO2022230848A5 JP2023517540A JP2023517540A JPWO2022230848A5 JP WO2022230848 A5 JPWO2022230848 A5 JP WO2022230848A5 JP 2023517540 A JP2023517540 A JP 2023517540A JP 2023517540 A JP2023517540 A JP 2023517540A JP WO2022230848 A5 JPWO2022230848 A5 JP WO2022230848A5
Authority
JP
Japan
Prior art keywords
signal line
electronic component
component mounting
insulating layer
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023517540A
Other languages
English (en)
Japanese (ja)
Other versions
JP7599007B2 (ja
JPWO2022230848A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/018814 external-priority patent/WO2022230848A1/ja
Publication of JPWO2022230848A1 publication Critical patent/JPWO2022230848A1/ja
Publication of JPWO2022230848A5 publication Critical patent/JPWO2022230848A5/ja
Application granted granted Critical
Publication of JP7599007B2 publication Critical patent/JP7599007B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023517540A 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置 Active JP7599007B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021075129 2021-04-27
JP2021075129 2021-04-27
PCT/JP2022/018814 WO2022230848A1 (ja) 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置

Publications (3)

Publication Number Publication Date
JPWO2022230848A1 JPWO2022230848A1 (https=) 2022-11-03
JPWO2022230848A5 true JPWO2022230848A5 (https=) 2024-02-02
JP7599007B2 JP7599007B2 (ja) 2024-12-12

Family

ID=83848398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517540A Active JP7599007B2 (ja) 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置

Country Status (4)

Country Link
US (1) US20240243055A1 (https=)
JP (1) JP7599007B2 (https=)
CN (1) CN117203756A (https=)
WO (1) WO2022230848A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121795156A (zh) * 2023-08-30 2026-04-03 京瓷株式会社 布线基板、电子部件收纳用封装体及电子模块

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9386687B2 (en) * 2011-12-20 2016-07-05 Kyocera Corporation Electronic component housing package and electronic apparatus

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