JP7599007B2 - 電子部品実装用パッケージ及び電子装置 - Google Patents

電子部品実装用パッケージ及び電子装置 Download PDF

Info

Publication number
JP7599007B2
JP7599007B2 JP2023517540A JP2023517540A JP7599007B2 JP 7599007 B2 JP7599007 B2 JP 7599007B2 JP 2023517540 A JP2023517540 A JP 2023517540A JP 2023517540 A JP2023517540 A JP 2023517540A JP 7599007 B2 JP7599007 B2 JP 7599007B2
Authority
JP
Japan
Prior art keywords
signal line
electronic component
insulating layer
component mounting
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023517540A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022230848A1 (https=
JPWO2022230848A5 (https=
Inventor
俊彦 北村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022230848A1 publication Critical patent/JPWO2022230848A1/ja
Publication of JPWO2022230848A5 publication Critical patent/JPWO2022230848A5/ja
Application granted granted Critical
Publication of JP7599007B2 publication Critical patent/JP7599007B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2023517540A 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置 Active JP7599007B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021075129 2021-04-27
JP2021075129 2021-04-27
PCT/JP2022/018814 WO2022230848A1 (ja) 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置

Publications (3)

Publication Number Publication Date
JPWO2022230848A1 JPWO2022230848A1 (https=) 2022-11-03
JPWO2022230848A5 JPWO2022230848A5 (https=) 2024-02-02
JP7599007B2 true JP7599007B2 (ja) 2024-12-12

Family

ID=83848398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023517540A Active JP7599007B2 (ja) 2021-04-27 2022-04-26 電子部品実装用パッケージ及び電子装置

Country Status (4)

Country Link
US (1) US20240243055A1 (https=)
JP (1) JP7599007B2 (https=)
CN (1) CN117203756A (https=)
WO (1) WO2022230848A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121795156A (zh) * 2023-08-30 2026-04-03 京瓷株式会社 布线基板、电子部件收纳用封装体及电子模块

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094684A1 (ja) 2011-12-20 2013-06-27 京セラ株式会社 電子部品収納用パッケージおよび電子装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094684A1 (ja) 2011-12-20 2013-06-27 京セラ株式会社 電子部品収納用パッケージおよび電子装置

Also Published As

Publication number Publication date
WO2022230848A1 (ja) 2022-11-03
US20240243055A1 (en) 2024-07-18
JPWO2022230848A1 (https=) 2022-11-03
CN117203756A (zh) 2023-12-08

Similar Documents

Publication Publication Date Title
EP2237316B1 (en) Connection terminal, package using the same and electronic device
EP3493252B1 (en) Substrate for mounting semiconductor element and semiconductor device
CN104335345A (zh) 布线基板以及电子装置
US20240405130A1 (en) Wiring board, electronic component package, and electronic apparatus
JP7599007B2 (ja) 電子部品実装用パッケージ及び電子装置
KR101823189B1 (ko) 인덕터 어셈블리
US12328857B2 (en) Electronic component module and method of manufacturing electronic component module
JP7634657B2 (ja) 半導体パッケージ及び半導体電子装置
JP7431351B2 (ja) 半導体パッケージ及び半導体電子装置
JP7432703B2 (ja) 配線基体および電子装置
JP4249601B2 (ja) 配線基板
US20260059654A1 (en) Wiring board, electronic component mounting package including wiring board, and electronic module
JP7784549B2 (ja) 配線構造体および電子モジュール
EP4641629A1 (en) Wiring board, electronic component mounting board using wiring board, and electronic module
JP7817435B2 (ja) 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール
JP4404460B2 (ja) 多数個取り配線基板、配線基板、多数個取り半導体素子収納用パッケージおよび半導体素子収納用パッケージ
JP3866128B2 (ja) 配線基板
JP2020017622A (ja) 配線基板、電子部品用パッケージおよび電子装置
JP5257763B2 (ja) 多層回路基板
JP2014127589A (ja) 素子収納用パッケージおよび実装構造体
JP4953684B2 (ja) 配線基板およびそれを用いた電子装置
JP6042773B2 (ja) 入出力端子および入出力端子の製造方法、ならびにこれを用いた半導体素子収納用パッケージおよび半導体装置
JP2024048912A (ja) 配線基板、配線基板を用いた配線構造体、電子部品実装用パッケージ、および電子モジュール
CN116670818A (zh) 半导体封装体以及半导体电子装置
JP2003124386A (ja) 多数個取り配線基板、配線基板、多数個取り半導体素子収納用パッケージおよび半導体素子収納用パッケージ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231026

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231026

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240806

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241004

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241202

R150 Certificate of patent or registration of utility model

Ref document number: 7599007

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150