JPWO2022230848A1 - - Google Patents
Info
- Publication number
- JPWO2022230848A1 JPWO2022230848A1 JP2023517540A JP2023517540A JPWO2022230848A1 JP WO2022230848 A1 JPWO2022230848 A1 JP WO2022230848A1 JP 2023517540 A JP2023517540 A JP 2023517540A JP 2023517540 A JP2023517540 A JP 2023517540A JP WO2022230848 A1 JPWO2022230848 A1 JP WO2022230848A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021075129 | 2021-04-27 | ||
| JP2021075129 | 2021-04-27 | ||
| PCT/JP2022/018814 WO2022230848A1 (ja) | 2021-04-27 | 2022-04-26 | 電子部品実装用パッケージ及び電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230848A1 true JPWO2022230848A1 (https=) | 2022-11-03 |
| JPWO2022230848A5 JPWO2022230848A5 (https=) | 2024-02-02 |
| JP7599007B2 JP7599007B2 (ja) | 2024-12-12 |
Family
ID=83848398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517540A Active JP7599007B2 (ja) | 2021-04-27 | 2022-04-26 | 電子部品実装用パッケージ及び電子装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240243055A1 (https=) |
| JP (1) | JP7599007B2 (https=) |
| CN (1) | CN117203756A (https=) |
| WO (1) | WO2022230848A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121795156A (zh) * | 2023-08-30 | 2026-04-03 | 京瓷株式会社 | 布线基板、电子部件收纳用封装体及电子模块 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9386687B2 (en) * | 2011-12-20 | 2016-07-05 | Kyocera Corporation | Electronic component housing package and electronic apparatus |
-
2022
- 2022-04-26 JP JP2023517540A patent/JP7599007B2/ja active Active
- 2022-04-26 US US18/557,765 patent/US20240243055A1/en active Pending
- 2022-04-26 CN CN202280030885.2A patent/CN117203756A/zh active Pending
- 2022-04-26 WO PCT/JP2022/018814 patent/WO2022230848A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP7599007B2 (ja) | 2024-12-12 |
| WO2022230848A1 (ja) | 2022-11-03 |
| US20240243055A1 (en) | 2024-07-18 |
| CN117203756A (zh) | 2023-12-08 |
Similar Documents
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