JPWO2022230848A1 - - Google Patents
Info
- Publication number
- JPWO2022230848A1 JPWO2022230848A1 JP2023517540A JP2023517540A JPWO2022230848A1 JP WO2022230848 A1 JPWO2022230848 A1 JP WO2022230848A1 JP 2023517540 A JP2023517540 A JP 2023517540A JP 2023517540 A JP2023517540 A JP 2023517540A JP WO2022230848 A1 JPWO2022230848 A1 JP WO2022230848A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021075129 | 2021-04-27 | ||
| PCT/JP2022/018814 WO2022230848A1 (ja) | 2021-04-27 | 2022-04-26 | 電子部品実装用パッケージ及び電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230848A1 true JPWO2022230848A1 (ja) | 2022-11-03 |
| JPWO2022230848A5 JPWO2022230848A5 (ja) | 2024-02-02 |
Family
ID=83848398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517540A Pending JPWO2022230848A1 (ja) | 2021-04-27 | 2022-04-26 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022230848A1 (ja) |
| CN (1) | CN117203756A (ja) |
| WO (1) | WO2022230848A1 (ja) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103999209B (zh) * | 2011-12-20 | 2016-11-16 | 京瓷株式会社 | 电子部件收纳用封装体以及电子装置 |
-
2022
- 2022-04-26 JP JP2023517540A patent/JPWO2022230848A1/ja active Pending
- 2022-04-26 CN CN202280030885.2A patent/CN117203756A/zh active Pending
- 2022-04-26 WO PCT/JP2022/018814 patent/WO2022230848A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN117203756A (zh) | 2023-12-08 |
| WO2022230848A1 (ja) | 2022-11-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231026 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231026 |