JPWO2023276923A1 - - Google Patents
Info
- Publication number
- JPWO2023276923A1 JPWO2023276923A1 JP2023531919A JP2023531919A JPWO2023276923A1 JP WO2023276923 A1 JPWO2023276923 A1 JP WO2023276923A1 JP 2023531919 A JP2023531919 A JP 2023531919A JP 2023531919 A JP2023531919 A JP 2023531919A JP WO2023276923 A1 JPWO2023276923 A1 JP WO2023276923A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021108105 | 2021-06-29 | ||
| PCT/JP2022/025487 WO2023276923A1 (ja) | 2021-06-29 | 2022-06-27 | 配線板および電子装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023276923A1 true JPWO2023276923A1 (ja) | 2023-01-05 |
Family
ID=84689889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023531919A Pending JPWO2023276923A1 (ja) | 2021-06-29 | 2022-06-27 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4365936A1 (ja) |
| JP (1) | JPWO2023276923A1 (ja) |
| CN (1) | CN117529805A (ja) |
| WO (1) | WO2023276923A1 (ja) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3610238B2 (ja) | 1998-08-28 | 2005-01-12 | 京セラ株式会社 | 高周波用パッケージ |
| JP2002252505A (ja) * | 2001-02-26 | 2002-09-06 | Kyocera Corp | 高周波用配線基板 |
| JP5273922B2 (ja) * | 2006-12-28 | 2013-08-28 | 株式会社アライドマテリアル | 放熱部材および半導体装置 |
| JP6270762B2 (ja) * | 2015-03-23 | 2018-01-31 | アンリツ株式会社 | Ｉｃ回路 |
| JP6881746B2 (ja) * | 2016-04-25 | 2021-06-02 | 住友電工デバイス・イノベーション株式会社 | 光半導体装置 |
-
2022
- 2022-06-27 JP JP2023531919A patent/JPWO2023276923A1/ja active Pending
- 2022-06-27 WO PCT/JP2022/025487 patent/WO2023276923A1/ja active Application Filing
- 2022-06-27 CN CN202280042931.0A patent/CN117529805A/zh active Pending
- 2022-06-27 EP EP22833070.0A patent/EP4365936A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN117529805A (zh) | 2024-02-06 |
| EP4365936A1 (en) | 2024-05-08 |
| WO2023276923A1 (ja) | 2023-01-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231221 |