JPWO2022158416A1 - - Google Patents

Info

Publication number
JPWO2022158416A1
JPWO2022158416A1 JP2022576668A JP2022576668A JPWO2022158416A1 JP WO2022158416 A1 JPWO2022158416 A1 JP WO2022158416A1 JP 2022576668 A JP2022576668 A JP 2022576668A JP 2022576668 A JP2022576668 A JP 2022576668A JP WO2022158416 A1 JPWO2022158416 A1 JP WO2022158416A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022576668A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158416A1 publication Critical patent/JPWO2022158416A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2022576668A 2021-01-19 2022-01-17 Pending JPWO2022158416A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006333 2021-01-19
PCT/JP2022/001365 WO2022158416A1 (ja) 2021-01-19 2022-01-17 配線基板、電子部品収容用パッケージ、電子装置及び電子モジュール

Publications (1)

Publication Number Publication Date
JPWO2022158416A1 true JPWO2022158416A1 (ja) 2022-07-28

Family

ID=82549722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576668A Pending JPWO2022158416A1 (ja) 2021-01-19 2022-01-17

Country Status (3)

Country Link
JP (1) JPWO2022158416A1 (ja)
CN (1) CN116783697A (ja)
WO (1) WO2022158416A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02237301A (ja) * 1989-03-10 1990-09-19 Nec Corp 同軸―マイクロストリップ線路変換器
JP2001102820A (ja) * 1999-09-30 2001-04-13 Toyota Central Res & Dev Lab Inc 高周波回路
JP3981645B2 (ja) * 2003-04-14 2007-09-26 京セラ株式会社 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2007006065A (ja) * 2005-06-23 2007-01-11 Ngk Spark Plug Co Ltd 高周波信号伝送用の基板と半導体素子用パッケージ
JP2009076828A (ja) * 2007-09-25 2009-04-09 Sumitomo Metal Electronics Devices Inc 半導体素子収納用パッケージ及び半導体装置

Also Published As

Publication number Publication date
CN116783697A (zh) 2023-09-19
WO2022158416A1 (ja) 2022-07-28

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230706