JPWO2023090137A5 - - Google Patents

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Publication number
JPWO2023090137A5
JPWO2023090137A5 JP2023561508A JP2023561508A JPWO2023090137A5 JP WO2023090137 A5 JPWO2023090137 A5 JP WO2023090137A5 JP 2023561508 A JP2023561508 A JP 2023561508A JP 2023561508 A JP2023561508 A JP 2023561508A JP WO2023090137 A5 JPWO2023090137 A5 JP WO2023090137A5
Authority
JP
Japan
Prior art keywords
edge
semiconductor device
thickness direction
viewed
surface electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561508A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023090137A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040667 external-priority patent/WO2023090137A1/ja
Publication of JPWO2023090137A1 publication Critical patent/JPWO2023090137A1/ja
Publication of JPWO2023090137A5 publication Critical patent/JPWO2023090137A5/ja
Pending legal-status Critical Current

Links

JP2023561508A 2021-11-16 2022-10-31 Pending JPWO2023090137A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021186425 2021-11-16
PCT/JP2022/040667 WO2023090137A1 (ja) 2021-11-16 2022-10-31 半導体素子および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023090137A1 JPWO2023090137A1 (https=) 2023-05-25
JPWO2023090137A5 true JPWO2023090137A5 (https=) 2024-07-31

Family

ID=86396871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561508A Pending JPWO2023090137A1 (https=) 2021-11-16 2022-10-31

Country Status (5)

Country Link
US (1) US20240297118A1 (https=)
JP (1) JPWO2023090137A1 (https=)
CN (1) CN118266086A (https=)
DE (1) DE112022004950T5 (https=)
WO (1) WO2023090137A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5037165B2 (ja) 2007-02-22 2012-09-26 三菱電機株式会社 半導体装置の製造方法
JP2010087124A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 絶縁ゲート型半導体装置
JP5321377B2 (ja) * 2009-09-11 2013-10-23 三菱電機株式会社 電力用半導体装置
US9508660B2 (en) * 2015-02-10 2016-11-29 Intel Corporation Microelectronic die having chamfered corners
JP6278048B2 (ja) * 2016-02-19 2018-02-14 トヨタ自動車株式会社 半導体装置
JP6910907B2 (ja) * 2017-09-25 2021-07-28 ルネサスエレクトロニクス株式会社 半導体装置
JP7280261B2 (ja) * 2018-07-12 2023-05-23 ローム株式会社 半導体素子および半導体装置

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