TWI704858B - 電子模組 - Google Patents
電子模組 Download PDFInfo
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- TWI704858B TWI704858B TW107124158A TW107124158A TWI704858B TW I704858 B TWI704858 B TW I704858B TW 107124158 A TW107124158 A TW 107124158A TW 107124158 A TW107124158 A TW 107124158A TW I704858 B TWI704858 B TW I704858B
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
本發明的電子模組,包括:第一基板(11);第一電子元件(13);第二電子元件(23);第二基板(21);設置在所述第一基板(11)側的第一端子部(110);以及設置在所述第二基板(21)側的第二端子部(120)。所述第一端子部(110)具有第一面方向延伸部(114)、以及向一側或另一側延伸的第一法線方向延伸部(113)。所述第二端子部(120)具有第二面方向延伸部(124)、以及向一側或另一側延伸的第二法線方向延伸部(123)。在所述第一面方向延伸部(114)的一側設置有所述第二面方向延伸部(124),所述第一面方向延伸部(114)與所述第二面方向延伸部(124)在面方向上重疊。
Description
本發明涉及具有端子部的電子模組。
以往,在封裝樹脂內配置有複數個電子部件的電子模組已被普遍認知(例如,參照特開2014-45157號)。產業普遍要求能將這種電子模組小型化。
作為小型化的一種手段,可以考慮將電子元件疊層。在這種情況下,可以在電子元件(第一電子元件)的一側(例如表面側)設置其他電子元件(第二電子元件)。
由於在採用這種態樣時電子元件的數量會變多,就需要增加用於與外部裝置連接的端子的數量。當在設置了第一電子元件或者第二電子元件的任意一個基板上設置端子時,因需要留有配置端子所需的空間,因此會導致模組在面方向上的尺寸變大。
本發明的目的在於提供一種電子模組,其能夠防止模組在面方向上的尺寸變大。
本發明涉及的電子模組,可以包括:
第一基板;第一電子元件,設置在所述第一基板的一側;第二電子元件,設置在所述第一電子元件的一側;第二基板,設置在所述第二電子元件的一側;第一端子部,設置在第一基板側,並且與所述第一電子元件電連接;以及第二端子部,設置在所述第二基板側,並且與所述第二電子元件電連接,其中,所述第一端子部具有:沿所述第一基板的面方向延伸的第一面方向延伸部以及設置在所述第一面方向延伸部的端部上的並且向一側或另一側延伸的第一法線方向延伸部,所述第二端子部具有:沿所述第二基板的面方向延伸的第二面方向延伸部以及設置在所述第二面方向延伸部的端部上的並且向一側或另一側延伸的第二法線方向延伸部,在所述第一面方向延伸部的一側設置有所述第二面方向延伸部,所述第一面方向延伸部與所述第二面方向延伸部在面方向上重疊,在本發明涉及的電子模組中,可以是:其中,所述第二法線方向延伸部向一側延伸,所述第一面方向延伸部相比所述第二面方向延伸部更加延伸至邊緣外部,所述第一法線方向延伸部在比所述第二法線方向延伸部更靠近邊緣外部的位置上向一側延伸。
在本發明涉及的電子模組中,可以是:其中,所述第一法線方向延伸部的一側端部,與所述第二法線方向延伸部的一側端部延伸至大致相同的位置上。
在本發明涉及的電子模組中,可以是:其中,所述第一法線方向延伸部向另一側延伸,所述第二法線方向延伸部也可向一側延伸。
在本發明涉及的電子模組中,可以是:其中,設置複數個第一端子部,設置有與所述第一端子部相同數量的第二端子部,在各個第一面方向延伸部的一側設置有第二面方向延伸部,在各個第二面方向延伸部的另一側設置有第一面方向延伸部。
在本發明涉及的電子模組中,還可以是:在所述端子部的寬度方向上,所述第一面方向延伸部與所述第二面方向延伸部實質上完全重疊。
作為本發明的一種態樣,當採用在第一基板側設置第一端子部、在第二基板側設置第二端子部,以及在第一面方向延伸部的一側至少定位有第二面方向延伸部的一部分態樣的情況下,就能夠同時使用第一基板以及第二基板這兩塊基板來配置端子部。這樣一來,就能夠將其在面方向上的尺寸縮小。
11:第一基板
12:第一導體層
13:第一電子元件
13g:第一閘極端子
13s:第一源極端子
21:第二基板
22:第二導體層
23:第二電子元件
23g:第二閘極端子
23s:第二源極端子
60:第一連接體
61:第一頭部
62:第一柱部
64:第一溝部
65(65a-65d):支撐部
70:第二連接體
71:第二頭部
72:第二柱部
75(75a、75b):延伸部
80:第三連接體
81:第三頭部
82:第三柱部
85、95:連接件
90:封裝部
100:端子部
110:第一端子部
111:第一端子基端部
112:第一彎曲部
113:第一法線方向延伸部
114:第一面方向延伸部
120:第二端子部
121:第二端子基端部
122:第二彎曲部
123:第二法線方向延伸部
124:第二面方向延伸部
第1圖是可在本發明第一實施方式中使用的電子模組的縱截面圖。
第2圖是可在本發明第一實施方式中使用的第一連接體的平面圖。
第3圖是可在本發明第一實施方式中使用的其他例電子模組的縱截面圖。
第4圖(a)是可在本發明第一實施方式中使用的第一基板側的結構的平面圖,第4圖(b)是可在本發明第一實施方式中使用的第二基板側的結構的平面圖。
第5圖(a)是可在本發明第一實施方式中使用的電子模組的平面圖,第5圖(b)是按第5圖(a)中的B-B直線切割後的截面圖。
第6圖(a)是可在本發明第二實施方式中使用的電子模組與第5圖(b)相對應的截面圖,第6圖(b)是可在本發明第二實施方式中使用的其他的電子模組與第6圖(a)相對應的截面圖,第6圖(c)是可在本發明第二實施方式中使用的其他的電子模組與第6圖(a)相對應的截面圖。
第7圖(a)是可在本發明第三實施方式中使用的電子模組的平面圖,第7圖(b)是可在本發明第三實施方式中使用的電子模組的側部圖(沿第三方向俯瞰的圖)。
第8圖是可在本發明第四實施方式中使用的電子模組的縱截面圖。
第9圖是可在本發明第五實施方式中使用的電子模組的縱截面圖。
第10圖是可在本發明第五實施方式中使用的電子模組的正面圖(沿第二方向俯瞰的圖),在第10圖中,第一法線方向延伸部以及第二法線方向延伸部用虛線表示,第一面方向延伸部以及第二面方向延伸部用實線表示。
第11圖(a)是可在本發明第六實施方式中使用的電子模組的正面圖,第11圖(b)是可在本發明第六實施方式中使用的其他電子模組的正面圖,在第11圖中也是,第一法線方向延伸部以及第二法線方向延伸部用虛線表示,第一面方向延伸部以及第二面方向延伸部用實線表示。
第12圖是可在本發明第七實施方式中使用的第一連接體的平面圖。
第13圖是可在本發明第八實施方式中使用的第二連接體的縱截面圖。
第14圖是可在本發明第九實施方式中使用的電子模組的縱截面圖。
[第一實施方式]
《構成》
在本實施方式中,“一側”指的是第1圖中的上方側,“另一側”指的是第1圖中的下方側。另外,將第1圖中的上下方向稱為“第一方向”、左右方向稱為“第二方向”、紙面的表裡方向稱為“第三方向”。將包含第二方向以及第三方向的面內方向稱為“面方向”,將從一側的方向進行觀看稱為“從平面看”。
在本實施方式中的電子模組,可以具有:第一電子單元、以及第二電子單元。
如第1圖所示,第一電子單元具有:第一基板11、在第一基板11的一側設置的複數個第一導體層12、以及在第一導體層12的一側設置的第一電子元件13。其中,第一電子元件13可以是開關元件,也可以是控制元件。當第一電子元件13成為開關元件的情況下,第一電子元件13也可以是MOSFET或IGBT等。第一電子元件13以及後述的第二電子元件23其各自可由半導體元件構成,作為半導體材料可以是矽、碳化矽、氮化鎵等。第一電子元件13的另一側的面可與第一導體層12藉由焊錫等導電性黏合劑(無圖示)連接。
在第一電子元件13的一側可設置第一連接體60。第一連接體60可與第一電子元件13的一側的面藉由焊錫等導電性黏合劑連接。
如第1圖所示,在第一連接體60的一側可設置第二電子單元。第二電子單元可以具有:在第一連接體60的一側設置的第二電子元件23。此外,第二電子單元也具有:第二基板21、以及在第二基板21的另一側設置的第二導
體層22。第二導體層22的另一側可設置第二連接體70。第二連接體70與第二電子元件23的一側的面以及第二導體層22的另一側的面可藉由焊錫等導電性黏合劑連接。
第二電子元件23既可以是開關元件,也可以是控制元件。當第二電子元件23成為開關元件的情況下,第二電子元件23可以是MOSFET或IGBT等。
第一連接體60可以具有:第一頭部61、以及從第一頭部61向另一側延伸的第一柱部62。第二連接體70可以具有:第二頭部71、以及從第二頭部71向另一側延伸的第二柱部72。第一連接體60的截面可以大致呈T字形,第二連接體70的截面也可大致呈T字形。
可採用陶瓷基板或絕緣樹脂層等作為第一基板11以及第二基板21。作為導電性黏合劑,除了焊錫以外,也可以使用Ag或Cu來作為主要成分使用。Cu等金屬同樣可作為第一連接體60以及第二連接體70的材料使用。此外,作為基板11、21,可使用經過電路圖案化後的金屬基板。此情況下,基板11、21可以兼做導體層12、22。
如前述般,電子模組具有封裝部90,封裝部90由將第一電子元件13、第二電子元件23、第一連接體60、第二連接體70、第一導體層12、以及將第二導體層22等封裝的封裝樹脂等構成。
第一導體層12可與端子部100連接,端子部100的前端側露出至封裝部90的外部,並可與控制基板等外部裝置連接。
端子部100具有與第一電子元件13電連接的第一端子部110、以及與第二電子元件23電連接的第二端子部120。
第一端子部110具有:沿第一基板11的面方向延伸的第一面方向延伸部114、以及在第一面方向延伸部114的端部上設置的,沿一側延伸的第一法線方向延伸部113。第二端子部120具有:沿第二基板21的面方向延伸的第二
面方向延伸部124、以及在第二面方向延伸部124的端部上設置的,沿一側延伸的第二法線方向延伸部123。其中,可以在第一面方向延伸部114的一側至少定位第二面方向延伸部124的一部分(參照第5圖)。
如第1圖所示,第一面方向延伸部114相比所述第二面方向延伸部124可以更加延伸至邊緣外部。第一法線方向延伸部113相比所述第二法線方向延伸部123也可以在邊緣外部上更向一側延伸。
第一法線方向延伸部113的一側端部,與第二法線方向延伸部123的一側端部可以延伸至大致相同的位置。“延伸至大致相同的位置”指的是:兩者之間的長度差在:第一法線方向延伸部113以及第二法線方向延伸部123中長度較短的法線方向延伸部(在本實施方式中為第二法線方向延伸部123)的整體長度的5%以內。
可以設置複數個第一端子部110。同樣的,也可設置複數個第二端子部120。另外,第一端子部110的數量可以與第二端子部120的總數相同。當第一端子部110的數量與第二端子部120的總數相同的情況下,在各個第一面方向延伸部114的一側可設置第二面方向延伸部124,兩者在面方向上可以重疊。作為採用這種態樣的一例,能夠指出將在第一基板11上設置的第一電子元件13與在第二基板21上設置的第二電子元件23發揮同樣作用的情況。
在本實施方式中,以下如第4圖以及第5圖所示,對使用了第一端子部110與第二端子部120的數量相同,在平面看時第一面方向延伸部114與第二面方向延伸部124位於相同位置,以及在第一面方向延伸部114的一側設置第二面方向延伸部124的態樣加以說明。但是,又不限於此態樣,也可如後述第二實施方式,採用在平面看時第一面方向延伸部114與第二面方向延伸部124僅一部分重疊的態樣。
如第1圖所示,第一端子部110具有:與第一導體層12連接的第一端子基端部111、所述第一面方向延伸部114、以及設置在第一端子基端部111與第一面方向延伸部114之間的,在第一端子基端部111側向另一側彎曲的第一彎曲部112。其中,第一端子基端部111可藉由導電性黏合劑與第一導體層12的一側的面連接。
第二端子部120具有:與第二導體層22連接的第二端子基端部121、所述第二面方向延伸部124、以及設置在第二端子基端部121與第二面方向延伸部124之間的,在第二端子基端部121側向一側彎曲的第二彎曲部122。其中,第二端子基端部121也可藉由導電性黏合劑與第二導體層22的另一側的面連接。
在封裝部90的外部,第一面方向延伸部114與第二面方向延伸部124之間可以在第一方向上隔開不小於閾值的距離。閾值的數值可以根據安全規格來決定。例如將電子部件在600V電壓的環境下使用時,第一面方向延伸部114與第二面方向延伸部124的之間距離必須不低於3.6mm。這種情況下,閾值為3.6mm。
如第2圖所示,可在第一頭部61的一側的面上設置第一溝部64。第一溝部64,在平視方向(面方向)上,雖設置在第一柱部62的邊緣外部上,但也可設置在邊緣外部的一部分上,還可以設置在第一柱部62的整個邊緣外部上。在第一頭部61的一側的面上,並且在第一溝部64的邊緣內部上不僅可設置焊錫等導電性黏合劑,也可藉由導電性黏合劑設置第二電子元件23。
如第1圖所示,可使用與第二電子元件23的後述第二閘極端子23g等的端子連接的連接件85。但又不限於此態樣,也可使用如第3圖所示的第三連接體80。第三連接體80具有,第三頭部81、以及從第三頭部81向另一側延伸的
第三柱部82。第三連接體80,可藉由焊錫等導電性黏合劑與第二導體層22的另一的面以及第二電子元件23的一側的面連接。
如第2圖所示,在平面看,第一電子元件13可以是從第一頭部61向外部露出的態樣。當第一電子元件13是MOSFET等開關元件的情況下,可在一側的面上設置第一閘極端子13g等。同樣,當第二電子元件23是MOSFET等開關元件的情況下,可在一側的面上設置第二閘極端子23g等。如第2圖所示,在第一電子元件13的一側的面上具有第一閘極端子13g以及第一源極端子13s,在第二電子元件23一側的面上具有第二閘極端子23g以及第二源極端子23s。在這種情況下,第二連接體70可與第二電子元件23的第二源極端子23s藉由導電性黏合劑連接,連接件85也可與第二電子元件23的第二閘極端子23g藉由導電性黏合劑連接。此外,第一連接體60與第一電子元件13的第一源極端子13s以及在第二電子元件23的另一側設置的第二汲極端子可藉由導電性黏合劑連接。在第一電子元件13的另一側設置的第一汲極端子可藉由導電性黏合劑與第一導體層12連接。第一電子元件13的第一閘極端子13g可藉由導電性黏合劑與連接件95(參照第1圖)連接,該連接件95也可藉由導電性黏合劑與第一導體層12連接。
當第一電子元件13以及第二電子元件23中的任何一個為開關元件的情況下,可考慮將載置在第一連接體60上的第二電子元件23作為發熱性較低的控制元件,並且將第一電子元件13作為開關元件。相反,也可考慮將載置在第一連接體60上的第二電子元件23作為開關元件,並且將第一電子元件13作為發熱性較低的控制元件。
端子部100與導體層12、22的接合,不僅可使用焊錫等導電性黏合劑來進行,也可使用激光焊接、以及超音波接合方式來進行。
《作用.效果》
接下來,對上述構成中本實施方式的作用以及效果進行說明。其中,“作用.效果”中說明的所有態樣,均可適用於上述構造。
當為了將電子模組小型化從而在第一電子元件13的一側設置第二電子元件23時,就會增加電子元件13、23的數量,這樣一來端子部100的數量也將增加。這時,當採用:在第一基板11側設置第一端子部110,並且在第二基板21側設置第二端子部120,以及第二面方向延伸部124的至少一部分位於第一面方向延伸部114的一側的態樣的情況下,就能夠設置同時使用了第一基板11以及第二基板21這兩塊基板的端子部100,這樣一來,就能夠有利於將模組在面方向上的尺寸縮小。
也就是說,即使將內部的電子元件13、23疊層(堆層),也會導致用於發送來自於電子元件13、23的訊號的端子部100數量變多,進而使其在面方向上的尺寸變大。另外,當端子部100只要與第一基板11側或者第二基板21側連接時,就必須要使用將第一導體層12與第二導體層22進行電連接的部件。這時,藉由在第一基板11側設置第一端子部110、以及在第二基板21側設置第二端子部120,就能夠解決這些問題。
即,當僅在第一基板11或第二基板21上形成用於與端子部100電連接的導體層12、22的電路圖案時,不僅會導致部件數變多,而且其在面方向上的尺寸也會變大。這時,藉由在第一基板11側設置第一端子部110、以及在第二基板21側設置第二端子部120,就能夠同時使用在第一基板11上設置的第一導體層12以及在第二基板21上設置的第二導體層22這兩個導體層。這樣一來,就能夠使用第一基板11以及第二基板21這兩塊基板來形成電路圖案,從而防止其在面方向上的尺寸變大。
藉由防止其在面方向上的尺寸變大,還能進一步防止第一基板11以及第二基板21發生翹曲變形。
另外,藉由在第一基板11側設置第一端子部110,並且在第二基板21側設置第二端子部120,能夠將佈線長度縮短,從而降低電阻,有利於將佈線電抗降低。
當第一法線方向延伸部113與第二法線方向延伸部123在相同方向,即如第1圖所示態樣中向一側延伸時,有利於將第一端子部110以及第二端子部120與相同的外部裝置相連接,作為外部裝置,可以例如用於控制電子模組的控制基板。
在這種情況下,第一面方向延伸部114相比所述第二面方向延伸部124更加延伸至邊緣外部,第一法線方向延伸部113相比所述第二法線方向延伸部123在邊緣外部上更向一側延伸。藉由採用這種態樣,即使第一面方向延伸部114與第二面方向延伸部124在平面上看是重疊的情況,也能夠將第一端子部110以及第二端子部120與控制基板等相同的外部裝置相連接。
當第一法線方向延伸部113的一側端部,與第二法線方向延伸部123的一側端部延伸至大致相同的位置上時,能夠更容易將第一端子部110以及第二端子部120與控制基板等相同的外部裝置相連接。
當第一端子部110的數量與第二端子部120的數量相同,在平面看時第一面方向延伸部114與第二面方向延伸部124位於相同位置,以及在第一面方向延伸部114的一側設置第二面方向延伸部124時,能夠在平面上看時將更多的第一端子部110以及第二端子部120重疊。這樣一來,有利於應對在端子部100的數量必須增加或其寬度必須增大時的情況。
從將端子部100的數量增加或將其寬度增大的觀點來說,對於在各第一面方向延伸部114的一側設置第二面方向延伸部124,以及在各第二面方向延伸部124的另一側設置第一面方向延伸部114的態樣是有利的。以及,在端子部100的寬度方向(第三方向)上,有利於採用第一面方向延伸部114與第二
面方向延伸部124實質上完全重疊的態樣(參照第4圖以及第5圖)。其中,“實質上完全重疊”指的是,在第一面方向延伸部114與第二面方向延伸部124之間,兩者在面方向上只存在十分之一以下的寬度偏差。
[第二實施方式]
接下來,將對本實施方式中的第二實施方式進行說明。
在第一實施方式中,在平面上看,雖然第一面方向延伸部114與第二面方向延伸部124完全實質性重疊,但是在本實施方式中,如第6圖所示,在平面上看(第三方向上),第一面方向延伸部114的一部分與第二面方向延伸部124的一部分是重疊的態樣。關於其他的構造,與第一實施方式相同,可以適用於第一實施方式中說明過的所有態樣。對於在第一實施方式中說明過的部件使用相同符號加以說明。
在第一基板11上設置的第一電子元件13與在第二基板21上設置的第二電子元件23當然可以實現不同的功能。這時,如第6圖(b)所示,第一端子部110與第二端子部120的設置態樣也將不同。這樣一來,在平面上看,僅第一面方向延伸部114的一部分與第二面方向延伸部124的一部分重疊,而不是全部重疊。
即使在第一基板11上設置的第一電子元件13與在第二基板21上設置的第二電子元件23實現相同的功能時,也能在面方向上設置為錯開。在這種情況下,在平面上看,僅第一面方向延伸部114的一部分與第二面方向延伸部124的一部分重疊,而不是全部重疊(參照第6圖(a))。
就像這樣藉由在面方向上錯開,第一端子部110與第二端子部120之間的最短距離會成為包含第一方向以及第三方向的面內傾斜方向的距離。因此,就容易獲得安全規定中指定的距離,進而有利於能夠將厚度方向上的長度縮短。
從這觀點來看,與前述的態樣不同,如第6圖(c)所示,在平面上看,可以考慮採用第一面方向延伸部114與第二面方向延伸部124完全不重疊的態樣。
[第三實施方式]
接下來,將對本實施方式中的第三實施方式進行說明。
在上述的各實施方式中,第一端子部110以及第二端子部120在電子模組的一個側面上露出至封裝部90的外部的,即所謂的SIP(Single Inline Package)型構造。而在本實施方式中,如第7圖所示,第一端子部110以及第二端子部120是在與電子模組相向的兩個側面上露出至封裝部90的外部的,即所謂的DIP(Dual Inline Package)型構造。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
根據本實施方式,由於是利用兩個側面來使端子部100露出至封裝部90的外部,因此有助於增加端子部100的數量以及增加端子部100的寬度。在電流強度增大的情況下,有時有必要增加端子部100的寬度。藉由採用本實施方式,有助於滿足上述這些要求。
[第四實施方式]
接下來,將對本實施方式中的第四實施方式進行說明。
雖然在上述各實施方式中,第一端子部110的第一法線方向延伸部113與第二端子部120的第二法線方向延伸部123是向一側延伸的態樣,但是在本實施方式中,如第8圖所示,第一端子部110的第一法線方向延伸部113與第二端子部120的第二法線方向延伸部123是向另一側延伸的態樣。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,第二面方向延伸部124相比所述第一面方向延伸部114可以更加延伸至邊緣外部。第二法線方向延伸部123相比所述第一法線方向延伸部113可以在邊緣外部上更向另一側延伸。藉由採用這種態樣,即使第一面方向延伸部114與第二面方向延伸部124在平面上看是重疊的情況,也能夠將第一端子部110以及第二端子部120與控制基板等相同的外部裝置相連接。
也可採用第一法線方向延伸部113的另一側端部,與第二法線方向延伸部123的另一側端部延伸至大致相同的位置態樣,在採用這種態樣時,能夠更容易將第一端子部110以及第二端子部120與控制基板等相同的外部裝置相連接。
[第五實施方式]
接下來,將對本實施方式中的第五實施方式進行說明。
在上述各實施方式種,雖然第一端子部110的第一法線方向延伸部113與第二端子部120的第二法線方向延伸部123是向相同方向延伸的,但在本實施方式中,如第9圖所示,第一端子部110的第一法線方向延伸部113是向另一側延伸,第二端子部120的第二法線方向延伸部123向一側延伸,兩者是向相反方向延伸的態樣。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,第一面方向延伸部114與第二面方向延伸部124可以延伸至大致相同的位置。另外,與此態樣不同,第一面方向延伸部114相比第二面方向延伸部124可以更加延伸至邊緣外部,相反,第二面方向延伸部124相比第一面方向延伸部114可以更加延伸至邊緣外部。
在採用本實施方式時,可以將第一端子部110的第一法線方向延伸部113向另一側延伸,將第二端子部120的第二法線方向延伸部123向一側延
伸。因此,例如能夠採用將第一端子部110與第一外部裝置連接,將第二端子部120與第一外部裝置不同的第二外部裝置相連接的態樣。
不限於此態樣,第一端子部110以及第二端子部120也可以與相同的外部裝置相連接。另外,即使如前述般採用第一外部裝置與第二外部裝置的情況,也可與第一外部裝置與第二外部裝置進行電連接,藉由這些來構成一個裝置單元。
即使在本實施方式中,第一端子部110與第二端子部120的數量相同,也可以是在各第一面方向延伸部114的一側設置第二面方向延伸部124,以及在各第二面方向延伸部124的另一側設置第一面方向延伸部114的態樣。在平面方向上看(第三方向上),也可採用第一面方向延伸部114與第二面方向延伸部124完全實質重疊的態樣(參照第10圖)。在這種情況下,有利於能夠將端子部100的數量增多以及將其寬度增大。
[第六實施方式]
接下來,將對本實施方式中的第六實施方式進行說明。
在第五實施方式中,從平面上看,雖然第一面方向延伸部114與第二面方向延伸部124是完全實質重疊的態樣,但是在本實施方式中,如第11圖所示,在平面上看(第三方向上),第一面方向延伸部114的一部分與第二面方向延伸部124的一部分是重疊的態樣。關於其他的構造,與第五實施方式相同。上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
如前述在第一基板11上設置的第一電子元件13與在第二基板21上設置的第二電子元件23當然也可以實現不同的功能。在這種情況下,第一端子部110與第二端子部120的設置態樣也將不同(參照第11圖(b))。這樣一來,
在平面上看,僅第一面方向延伸部114的一部分與第二面方向延伸部124的一部分重疊。而不是全部重疊。
即使在第一基板11上設置的第一電子元件13與在第二基板21上設置的第二電子元件23實現相同的功能時,也能在面方向上設置為錯開。在這種情況下,在平面上看,僅第一面方向延伸部114的一部分與第二面方向延伸部124的一部分重疊,而不是全部重疊(參照第11圖(a))。
由於將第一面方向延伸部114與第二面方向延伸部124的距離變長,在平面上看,能夠採用第一面方向延伸部114與第二面方向延伸部124完全不重疊的態樣(雖然有關於其他實施方式的圖式,也可參照第6圖(c))。
[第七實施方式]
接下來,將對本實施方式中的第七實施方式進行說明。
在上述各實施的方式中,雖使用了截面呈大致T字型的第一連接體60,但在本實施方式中,第一連接體60,如第12圖所示,具有從第一頭部61向另一側延伸的四個支撐部65(65a-65d)。支撐部65與第一導體層12或是與第一基板11相抵接。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,雖然對利用四個支撐部65的態樣加以說明,但不僅限於此,也可使用一個、兩個、三個或是五個以上的支撐部65。
如本實施方式般,在設置有從第一頭部61延伸的支撐部65的情況下,就能夠在安裝第二電子元件23時或安裝第二電子元件23後,防止因第二電子元件23的重量而導致第一連接體60傾斜。此外,藉由支撐部65與第一基板11或第一導體層12相抵接,就能夠提高散熱性。特別是當支撐部65與第一導體層12相抵接的情況下,有助於進一步提高散熱效果。
此外,如本實施方式中設置有複數個支撐部65的情況下,就能夠更穩定地來設置第一連接體60,並有助於實現更高的散熱效果。
[第八實施方式]
接下來,將對本實施方式中的第八實施方式進行說明。
在上述各實施方式中雖使用了由具有第二柱部72的,並且截面呈大致T字型的第二連接體70加以說明,但在本實施方式中,如第13圖所示,第二連接體70具有從第二頭部71向另一側延伸的延伸部75(75a、75b)。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
雖在本實施方式中對使用兩個延伸部75的態樣加以說明,但不僅限於此方式,也可使用一個或三個以上的延伸部75。
根據本實施方式,因設置有延伸部75,因此可以將第二電子元件23的熱量有效地進行散熱,從而藉由第二連接體70實現高散熱效果。
另外,如本實施方式般在設置有複數個延伸部75的情況下,有助於實現更高的散熱效果。
[第九實施方式]
接下來,將對本實施方式中的第九實施方式進行說明。
上述實施方式中,雖然對使用第一連接體60以及第二連接體70的態樣加以說明,但不僅限於此方式。如第14圖所示,也可不設置第一連接體60以及第二連接體70。在本實施方式中,上述的各實施方式中說明過的所有態樣都可採用。關於上述各實施方式中說明過的部件用相同符號加以說明。
在本實施方式中,同樣能夠獲得包含有關於端子部100的說明中所提到的效果,從而能夠使其在面方向上的尺寸縮小。
上述各實施方式中的記載以及圖式中所顯示的內容,僅為用於說明申請專利範圍中記載的發明的一個例子,本發明不受上述記載的實施方式以及圖式中所顯示的內容所限制。另外,本發明最初申請的申請專利範圍僅為一例,可根據說明書、圖式的記載,對申請專利範圍進行適宜地修改。
11:第一基板
12:第一導體層
13:第一電子元件
21:第二基板
22:第二導體層
23:第二電子元件
60:第一連接體
61:第一頭部
62:第一柱部
70:第二連接體
71:第二頭部
72:第二柱部
85、95:連接件
90:封裝部
100:端子部
110:第一端子部
111:第一端子基端部
112:第一彎曲部
113:第一法線方向延伸部
114:第一面方向延伸部
120:第二端子部
121:第二端子基端部
122:第二彎曲部
123:第二法線方向延伸部
124:第二面方向延伸部
Claims (6)
- 一種電子模組,其包括:第一基板;第一電子元件,設置在該第一基板的一側;第二電子元件,設置在該第一電子元件的一側;第二基板,設置在該第二電子元件的一側;第一端子部,設置在該第一基板側,並且與該第一電子元件電連接;以及第二端子部,設置在該第二基板側,並且與該第二電子元件電連接,其中,該第一端子部具有:第一端子基端部、沿該第一基板的面方向延伸的第一面方向延伸部、以及設置在該第一面方向延伸部的端部上的並且向一側或另一側延伸的第一法線方向延伸部,該第二端子部具有:第二端子基端部、沿該第二基板的面方向延伸的第二面方向延伸部、以及設置在該第二面方向延伸部的端部上的並且向一側或另一側延伸的第二法線方向延伸部,在該第一面方向延伸部的一側設置有該第二面方向延伸部,該第一面方向延伸部與該第二面方向延伸部在面方向上重疊,該第一端子基端部與該第一基板或與在該第一基板上設置的第一導體層相抵接,該第二端子基端部與該第二基板或與在該第二基板上設置的第二導體層相抵接,在該第一端子部的一側未設置該第一電子元件,在該第二端子部的另一側未設置有該第二電子元件。
- 如申請專利範圍第1項所述的電子模組,其中,該第一端子部具有設置在該第一端子基端部與該第一面方向延伸部之間的並且向另一側彎曲的第一彎曲部,該第二端子部具有設置在該第二端子基端部與該第二面方向延伸部之間的並且向一側彎曲的第二彎曲部。
- 如申請專利範圍第1項所述的電子模組,其中,在該第一端子部的一側以及另一側未設置有該第一電子元件,在該第二端子部的一側以及另一側未設置有該第二電子元件。
- 如申請專利範圍第1項所述的電子模組,其中,該第一法線方向延伸部向另一側延伸,該第二法線方向延伸部向一側延伸。
- 如申請專利範圍第1項至第4項中任一項所述的電子模組,其中,設置複數個第一端子部,設置與該複數個第一端子部相同數量的第二端子部,在各個第一面方向延伸部的一側設置有第二面方向延伸部,在各個第二面方向延伸部的另一側設置有第一面方向延伸部。
- 如申請專利範圍第1項至第4項中任一項所述的電子模組,其進一步包括:設置在該第一電子元件與該第二電子元件之間的並且設置在封裝部內的第一連接體,其中,該第一連接體與該第一端子部以及該第二端子部是相互獨立的構件。
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