JPWO2023189754A5 - - Google Patents
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- Publication number
- JPWO2023189754A5 JPWO2023189754A5 JP2024511836A JP2024511836A JPWO2023189754A5 JP WO2023189754 A5 JPWO2023189754 A5 JP WO2023189754A5 JP 2024511836 A JP2024511836 A JP 2024511836A JP 2024511836 A JP2024511836 A JP 2024511836A JP WO2023189754 A5 JPWO2023189754 A5 JP WO2023189754A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor device
- chip
- thickness direction
- well region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 239000011229 interlayer Substances 0.000 claims 8
- 239000002344 surface layer Substances 0.000 claims 6
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022061085 | 2022-03-31 | ||
| JP2022061084 | 2022-03-31 | ||
| PCT/JP2023/010676 WO2023189754A1 (ja) | 2022-03-31 | 2023-03-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189754A1 JPWO2023189754A1 (https=) | 2023-10-05 |
| JPWO2023189754A5 true JPWO2023189754A5 (https=) | 2024-12-12 |
Family
ID=88201055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511836A Pending JPWO2023189754A1 (https=) | 2022-03-31 | 2023-03-17 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250015171A1 (https=) |
| JP (1) | JPWO2023189754A1 (https=) |
| WO (1) | WO2023189754A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025143233A1 (ja) * | 2023-12-27 | 2025-07-03 | ローム株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6335829B2 (ja) * | 2015-04-06 | 2018-05-30 | 三菱電機株式会社 | 半導体装置 |
| JP6878848B2 (ja) * | 2016-02-16 | 2021-06-02 | 富士電機株式会社 | 半導体装置 |
| JP7001104B2 (ja) * | 2017-12-14 | 2022-01-19 | 富士電機株式会社 | 半導体装置 |
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2023
- 2023-03-17 WO PCT/JP2023/010676 patent/WO2023189754A1/ja not_active Ceased
- 2023-03-17 JP JP2024511836A patent/JPWO2023189754A1/ja active Pending
-
2024
- 2024-09-25 US US18/895,465 patent/US20250015171A1/en active Pending