JPWO2023189053A5 - - Google Patents
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- Publication number
- JPWO2023189053A5 JPWO2023189053A5 JP2024511470A JP2024511470A JPWO2023189053A5 JP WO2023189053 A5 JPWO2023189053 A5 JP WO2023189053A5 JP 2024511470 A JP2024511470 A JP 2024511470A JP 2024511470 A JP2024511470 A JP 2024511470A JP WO2023189053 A5 JPWO2023189053 A5 JP WO2023189053A5
- Authority
- JP
- Japan
- Prior art keywords
- trench
- resistor
- semiconductor device
- buried
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 23
- 239000012212 insulator Substances 0.000 claims 6
- 239000011229 interlayer Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022061315 | 2022-03-31 | ||
| PCT/JP2023/006632 WO2023189053A1 (ja) | 2022-03-31 | 2023-02-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189053A1 JPWO2023189053A1 (https=) | 2023-10-05 |
| JPWO2023189053A5 true JPWO2023189053A5 (https=) | 2024-12-10 |
Family
ID=88200440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511470A Pending JPWO2023189053A1 (https=) | 2022-03-31 | 2023-02-24 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250022796A1 (https=) |
| JP (1) | JPWO2023189053A1 (https=) |
| CN (1) | CN118974945A (https=) |
| WO (1) | WO2023189053A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022172625A1 (ja) * | 2021-02-15 | 2022-08-18 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| JP2023131415A (ja) * | 2022-03-09 | 2023-09-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| WO2025121036A1 (ja) * | 2023-12-05 | 2025-06-12 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6533613B2 (ja) * | 2013-08-28 | 2019-06-19 | ローム株式会社 | 半導体装置 |
| DE112015004374B4 (de) * | 2014-09-26 | 2019-02-14 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| JP6600475B2 (ja) * | 2015-03-27 | 2019-10-30 | ローム株式会社 | 半導体装置 |
| JP7234713B2 (ja) * | 2019-03-14 | 2023-03-08 | 富士電機株式会社 | 半導体装置 |
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2023
- 2023-02-24 JP JP2024511470A patent/JPWO2023189053A1/ja active Pending
- 2023-02-24 WO PCT/JP2023/006632 patent/WO2023189053A1/ja not_active Ceased
- 2023-02-24 CN CN202380032271.2A patent/CN118974945A/zh active Pending
-
2024
- 2024-09-30 US US18/900,908 patent/US20250022796A1/en active Pending