JP2018113475A5 - - Google Patents
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- JP2018113475A5 JP2018113475A5 JP2018071431A JP2018071431A JP2018113475A5 JP 2018113475 A5 JP2018113475 A5 JP 2018113475A5 JP 2018071431 A JP2018071431 A JP 2018071431A JP 2018071431 A JP2018071431 A JP 2018071431A JP 2018113475 A5 JP2018113475 A5 JP 2018113475A5
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- Prior art keywords
- semiconductor element
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- 239000004065 semiconductor Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 230000005669 field effect Effects 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018071431A JP6610696B2 (ja) | 2018-04-03 | 2018-04-03 | トレンチmos型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018071431A JP6610696B2 (ja) | 2018-04-03 | 2018-04-03 | トレンチmos型半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014055728A Division JP6320808B2 (ja) | 2014-03-19 | 2014-03-19 | トレンチmos型半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019193587A Division JP6791337B2 (ja) | 2019-10-24 | 2019-10-24 | トレンチmos型半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018113475A JP2018113475A (ja) | 2018-07-19 |
| JP2018113475A5 true JP2018113475A5 (https=) | 2019-02-28 |
| JP6610696B2 JP6610696B2 (ja) | 2019-11-27 |
Family
ID=62912501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018071431A Active JP6610696B2 (ja) | 2018-04-03 | 2018-04-03 | トレンチmos型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6610696B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7223543B2 (ja) | 2018-10-05 | 2023-02-16 | ローム株式会社 | 半導体装置 |
| CN112219282B (zh) * | 2018-12-21 | 2024-12-03 | 富士电机株式会社 | 半导体装置和半导体装置的制造方法 |
| KR102251760B1 (ko) * | 2019-12-03 | 2021-05-14 | 현대모비스 주식회사 | 전력 반도체 소자 |
| KR102187903B1 (ko) * | 2019-12-03 | 2020-12-07 | 현대오트론 주식회사 | 전력 반도체 소자 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3504085B2 (ja) * | 1996-09-30 | 2004-03-08 | 株式会社東芝 | 半導体装置 |
| CN103022115B (zh) * | 2008-01-29 | 2015-09-02 | 富士电机株式会社 | 半导体装置 |
| JP5526849B2 (ja) * | 2010-02-18 | 2014-06-18 | 富士電機株式会社 | 半導体装置 |
| JP5633468B2 (ja) * | 2011-05-11 | 2014-12-03 | 三菱電機株式会社 | 半導体装置 |
-
2018
- 2018-04-03 JP JP2018071431A patent/JP6610696B2/ja active Active
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