JPWO2023281969A5 - - Google Patents

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Publication number
JPWO2023281969A5
JPWO2023281969A5 JP2023533476A JP2023533476A JPWO2023281969A5 JP WO2023281969 A5 JPWO2023281969 A5 JP WO2023281969A5 JP 2023533476 A JP2023533476 A JP 2023533476A JP 2023533476 A JP2023533476 A JP 2023533476A JP WO2023281969 A5 JPWO2023281969 A5 JP WO2023281969A5
Authority
JP
Japan
Prior art keywords
region
insulating film
semiconductor device
gate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533476A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023281969A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/023165 external-priority patent/WO2023281969A1/ja
Publication of JPWO2023281969A1 publication Critical patent/JPWO2023281969A1/ja
Publication of JPWO2023281969A5 publication Critical patent/JPWO2023281969A5/ja
Pending legal-status Critical Current

Links

JP2023533476A 2021-07-08 2022-06-08 Pending JPWO2023281969A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021113669 2021-07-08
PCT/JP2022/023165 WO2023281969A1 (ja) 2021-07-08 2022-06-08 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023281969A1 JPWO2023281969A1 (https=) 2023-01-12
JPWO2023281969A5 true JPWO2023281969A5 (https=) 2024-10-25

Family

ID=84800267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533476A Pending JPWO2023281969A1 (https=) 2021-07-08 2022-06-08

Country Status (5)

Country Link
US (1) US20240128373A1 (https=)
JP (1) JPWO2023281969A1 (https=)
CN (1) CN117425966A (https=)
DE (1) DE112022003464T5 (https=)
WO (1) WO2023281969A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7815134B2 (ja) * 2020-10-29 2026-02-17 ローム株式会社 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5206028B2 (ja) * 2008-03-03 2013-06-12 株式会社デンソー 半導体装置
EP2608272A1 (en) * 2011-12-23 2013-06-26 Imec N-channel LDMOS device
JP6221284B2 (ja) * 2013-03-19 2017-11-01 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法
JP2015023208A (ja) 2013-07-22 2015-02-02 旭化成エレクトロニクス株式会社 電界効果トランジスタ及び半導体装置、電界効果トランジスタの製造方法
JP2017079432A (ja) * 2015-10-21 2017-04-27 株式会社デンソー 半導体装置
US11255589B2 (en) 2020-01-18 2022-02-22 True Manufacturing Co., Inc. Ice maker

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