JPWO2022264694A5 - - Google Patents

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Publication number
JPWO2022264694A5
JPWO2022264694A5 JP2023529659A JP2023529659A JPWO2022264694A5 JP WO2022264694 A5 JPWO2022264694 A5 JP WO2022264694A5 JP 2023529659 A JP2023529659 A JP 2023529659A JP 2023529659 A JP2023529659 A JP 2023529659A JP WO2022264694 A5 JPWO2022264694 A5 JP WO2022264694A5
Authority
JP
Japan
Prior art keywords
wiring
gate
connection
semiconductor device
source wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023529659A
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English (en)
Japanese (ja)
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JPWO2022264694A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/018821 external-priority patent/WO2022264694A1/ja
Publication of JPWO2022264694A1 publication Critical patent/JPWO2022264694A1/ja
Publication of JPWO2022264694A5 publication Critical patent/JPWO2022264694A5/ja
Pending legal-status Critical Current

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JP2023529659A 2021-06-14 2022-04-26 Pending JPWO2022264694A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021098851 2021-06-14
PCT/JP2022/018821 WO2022264694A1 (ja) 2021-06-14 2022-04-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022264694A1 JPWO2022264694A1 (https=) 2022-12-22
JPWO2022264694A5 true JPWO2022264694A5 (https=) 2024-03-18

Family

ID=84527103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529659A Pending JPWO2022264694A1 (https=) 2021-06-14 2022-04-26

Country Status (5)

Country Link
US (1) US20240105835A1 (https=)
JP (1) JPWO2022264694A1 (https=)
CN (1) CN117480618A (https=)
DE (1) DE112022002604T5 (https=)
WO (1) WO2022264694A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022105886A1 (de) * 2022-03-14 2023-09-14 Infineon Technologies Ag Halbleitervorrichtung mit makrozellen
JP2024130833A (ja) * 2023-03-15 2024-09-30 株式会社東芝 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014120656A (ja) * 2012-12-18 2014-06-30 Toshiba Corp 半導体装置
JP6219140B2 (ja) * 2013-11-22 2017-10-25 ルネサスエレクトロニクス株式会社 半導体装置
JP2016152357A (ja) * 2015-02-18 2016-08-22 株式会社東芝 半導体装置および半導体パッケージ
JP6666671B2 (ja) * 2015-08-24 2020-03-18 ローム株式会社 半導体装置
JP6967352B2 (ja) 2017-02-07 2021-11-17 ローム株式会社 半導体装置および半導体装置の製造方法、ならびに、半導体ウエハ構造物
JP2019114643A (ja) * 2017-12-22 2019-07-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
DE102018114591B4 (de) * 2018-06-18 2021-09-02 Infineon Technologies Ag Transistorbauelement
JP7061954B2 (ja) * 2018-11-07 2022-05-02 三菱電機株式会社 半導体装置

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