JPWO2022264694A1 - - Google Patents
Info
- Publication number
- JPWO2022264694A1 JPWO2022264694A1 JP2023529659A JP2023529659A JPWO2022264694A1 JP WO2022264694 A1 JPWO2022264694 A1 JP WO2022264694A1 JP 2023529659 A JP2023529659 A JP 2023529659A JP 2023529659 A JP2023529659 A JP 2023529659A JP WO2022264694 A1 JPWO2022264694 A1 JP WO2022264694A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/112—Field plates comprising multiple field plate segments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/43—Layouts of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098851 | 2021-06-14 | ||
| PCT/JP2022/018821 WO2022264694A1 (ja) | 2021-06-14 | 2022-04-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264694A1 true JPWO2022264694A1 (https=) | 2022-12-22 |
| JPWO2022264694A5 JPWO2022264694A5 (https=) | 2024-03-18 |
Family
ID=84527103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529659A Pending JPWO2022264694A1 (https=) | 2021-06-14 | 2022-04-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240105835A1 (https=) |
| JP (1) | JPWO2022264694A1 (https=) |
| CN (1) | CN117480618A (https=) |
| DE (1) | DE112022002604T5 (https=) |
| WO (1) | WO2022264694A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022105886A1 (de) * | 2022-03-14 | 2023-09-14 | Infineon Technologies Ag | Halbleitervorrichtung mit makrozellen |
| JP2024130833A (ja) * | 2023-03-15 | 2024-09-30 | 株式会社東芝 | 半導体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014120656A (ja) * | 2012-12-18 | 2014-06-30 | Toshiba Corp | 半導体装置 |
| JP6219140B2 (ja) * | 2013-11-22 | 2017-10-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2016152357A (ja) * | 2015-02-18 | 2016-08-22 | 株式会社東芝 | 半導体装置および半導体パッケージ |
| JP6666671B2 (ja) * | 2015-08-24 | 2020-03-18 | ローム株式会社 | 半導体装置 |
| JP6967352B2 (ja) | 2017-02-07 | 2021-11-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法、ならびに、半導体ウエハ構造物 |
| JP2019114643A (ja) * | 2017-12-22 | 2019-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| DE102018114591B4 (de) * | 2018-06-18 | 2021-09-02 | Infineon Technologies Ag | Transistorbauelement |
| JP7061954B2 (ja) * | 2018-11-07 | 2022-05-02 | 三菱電機株式会社 | 半導体装置 |
-
2022
- 2022-04-26 DE DE112022002604.9T patent/DE112022002604T5/de active Pending
- 2022-04-26 CN CN202280041889.0A patent/CN117480618A/zh active Pending
- 2022-04-26 WO PCT/JP2022/018821 patent/WO2022264694A1/ja not_active Ceased
- 2022-04-26 JP JP2023529659A patent/JPWO2022264694A1/ja active Pending
-
2023
- 2023-12-12 US US18/536,248 patent/US20240105835A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022002604T5 (de) | 2024-03-14 |
| CN117480618A (zh) | 2024-01-30 |
| US20240105835A1 (en) | 2024-03-28 |
| WO2022264694A1 (ja) | 2022-12-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231129 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250303 |