JPWO2024128011A5 - - Google Patents

Info

Publication number
JPWO2024128011A5
JPWO2024128011A5 JP2024564274A JP2024564274A JPWO2024128011A5 JP WO2024128011 A5 JPWO2024128011 A5 JP WO2024128011A5 JP 2024564274 A JP2024564274 A JP 2024564274A JP 2024564274 A JP2024564274 A JP 2024564274A JP WO2024128011 A5 JPWO2024128011 A5 JP WO2024128011A5
Authority
JP
Japan
Prior art keywords
lead
back surface
semiconductor element
thickness direction
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024564274A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024128011A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/042902 external-priority patent/WO2024128011A1/ja
Publication of JPWO2024128011A1 publication Critical patent/JPWO2024128011A1/ja
Publication of JPWO2024128011A5 publication Critical patent/JPWO2024128011A5/ja
Pending legal-status Critical Current

Links

JP2024564274A 2022-12-13 2023-11-30 Pending JPWO2024128011A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022198667 2022-12-13
PCT/JP2023/042902 WO2024128011A1 (ja) 2022-12-13 2023-11-30 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024128011A1 JPWO2024128011A1 (https=) 2024-06-20
JPWO2024128011A5 true JPWO2024128011A5 (https=) 2025-08-21

Family

ID=91484857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024564274A Pending JPWO2024128011A1 (https=) 2022-12-13 2023-11-30

Country Status (3)

Country Link
US (1) US20250300043A1 (https=)
JP (1) JPWO2024128011A1 (https=)
WO (1) WO2024128011A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121753550A (zh) * 2023-08-25 2026-03-27 罗姆股份有限公司 半导体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916745B2 (ja) * 2006-03-28 2012-04-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

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