JPWO2024257265A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024257265A5
JPWO2024257265A5 JP2023568734A JP2023568734A JPWO2024257265A5 JP WO2024257265 A5 JPWO2024257265 A5 JP WO2024257265A5 JP 2023568734 A JP2023568734 A JP 2023568734A JP 2023568734 A JP2023568734 A JP 2023568734A JP WO2024257265 A5 JPWO2024257265 A5 JP WO2024257265A5
Authority
JP
Japan
Prior art keywords
main electrode
sealing portion
semiconductor
corner
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023568734A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024257265A1 (https=
JP7433562B1 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/022085 external-priority patent/WO2024257265A1/ja
Application granted granted Critical
Publication of JP7433562B1 publication Critical patent/JP7433562B1/ja
Publication of JPWO2024257265A1 publication Critical patent/JPWO2024257265A1/ja
Publication of JPWO2024257265A5 publication Critical patent/JPWO2024257265A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023568734A 2023-06-14 2023-06-14 半導体装置 Active JP7433562B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/022085 WO2024257265A1 (ja) 2023-06-14 2023-06-14 半導体装置

Publications (3)

Publication Number Publication Date
JP7433562B1 JP7433562B1 (ja) 2024-02-19
JPWO2024257265A1 JPWO2024257265A1 (https=) 2024-12-19
JPWO2024257265A5 true JPWO2024257265A5 (https=) 2025-05-27

Family

ID=89904370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023568734A Active JP7433562B1 (ja) 2023-06-14 2023-06-14 半導体装置

Country Status (4)

Country Link
US (1) US20260011685A1 (https=)
JP (1) JP7433562B1 (https=)
CN (1) CN120513519A (https=)
WO (1) WO2024257265A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648417B2 (ja) * 1999-12-09 2005-05-18 株式会社東芝 パワー半導体モジュール及び電力変換装置
US6392145B1 (en) * 2000-05-11 2002-05-21 Advanced Micro Devices, Inc. Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals
JP5292779B2 (ja) * 2007-11-26 2013-09-18 富士電機株式会社 半導体装置
CN104584213B (zh) * 2012-08-24 2018-02-13 三菱电机株式会社 半导体装置
US10123443B2 (en) * 2014-12-25 2018-11-06 Fuji Electric Co., Ltd. Semiconductor device
DE102017202770B4 (de) * 2016-08-31 2023-06-07 Infineon Technologies Austria Ag Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster
JP7151361B2 (ja) * 2018-10-15 2022-10-12 富士電機株式会社 半導体装置
CN216054654U (zh) * 2021-04-14 2022-03-15 惠州市力迈电子有限公司 一种带有高气密性封装的功率晶体管
CN218602437U (zh) * 2022-08-26 2023-03-10 海丰宇航微电子有限公司 一种贴片型三极管
CN115723970B (zh) * 2022-11-21 2025-11-04 北京钧天航宇技术有限公司 面向低成本的模块化卫星结构装置

Similar Documents

Publication Publication Date Title
CN205789928U (zh) 散热封装构造
KR102554431B1 (ko) 반도체 장치 및 반도체 장치 제조 방법
JP2004336014A (ja) 積層セラミックコンデンサ，積層セラミックコンデンサの実装構造及びコンデンサモジュール
US9865787B2 (en) Chip substrate and chip package module
US20130087896A1 (en) Stacking-type semiconductor package structure
TWI553828B (zh) 整合型功率模組
TW201813013A (zh) 半導體裝置
CN103855137B (zh) 半导体器件
JP3832170B2 (ja) マルチベアチップ実装体
JPWO2024257265A5 (https=)
JP7551571B2 (ja) 半導体モジュール
US20250069967A1 (en) Semiconductor device
JP7354605B2 (ja) 半導体モジュールおよび半導体装置
US20230198047A1 (en) Composite Pad and Battery Module Including the Same
JPWO2024128011A5 (https=)
WO2019171795A1 (ja) 半導体モジュール
KR20240096086A (ko) 반도체 메모리 모듈 및 이를 포함하는 컴퓨터 시스템
JP6468095B2 (ja) 半導体装置
JP7061949B2 (ja) 半導体装置
US11935819B2 (en) Circuit module having a plurality of lead frames connected to a substrate by metal posts
US20150179540A1 (en) Semiconductor device
CN222146225U (zh) 半导体封装器件及电子设备
JP2001189413A (ja) マルチチップ、マルチチップパッケージ、半導体装置および電子機器
TWI625833B (zh) 封裝結構
TW202126130A (zh) 功率模組