CN120513519A - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN120513519A
CN120513519A CN202380090101.XA CN202380090101A CN120513519A CN 120513519 A CN120513519 A CN 120513519A CN 202380090101 A CN202380090101 A CN 202380090101A CN 120513519 A CN120513519 A CN 120513519A
Authority
CN
China
Prior art keywords
semiconductor
semiconductor module
semiconductor device
main electrode
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380090101.XA
Other languages
English (en)
Chinese (zh)
Inventor
高久佳雅
多田圭佑
小冢聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120513519A publication Critical patent/CN120513519A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Inverter Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
CN202380090101.XA 2023-06-14 2023-06-14 半导体装置 Pending CN120513519A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/022085 WO2024257265A1 (ja) 2023-06-14 2023-06-14 半導体装置

Publications (1)

Publication Number Publication Date
CN120513519A true CN120513519A (zh) 2025-08-19

Family

ID=89904370

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380090101.XA Pending CN120513519A (zh) 2023-06-14 2023-06-14 半导体装置

Country Status (4)

Country Link
US (1) US20260011685A1 (https=)
JP (1) JP7433562B1 (https=)
CN (1) CN120513519A (https=)
WO (1) WO2024257265A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW488055B (en) * 2000-05-11 2002-05-21 Advanced Micro Devices Inc Semiconductor device including an integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals
CN104584213A (zh) * 2012-08-24 2015-04-29 三菱电机株式会社 半导体装置
CN105742278A (zh) * 2014-12-25 2016-07-06 富士电机株式会社 半导体装置
CN107799484A (zh) * 2016-08-31 2018-03-13 英飞凌科技奥地利有限公司 具有重复的覆盖区模的半导体芯片封装
US20200118986A1 (en) * 2018-10-15 2020-04-16 Fuji Electric Co., Ltd. Semiconductor equipment
CN216054654U (zh) * 2021-04-14 2022-03-15 惠州市力迈电子有限公司 一种带有高气密性封装的功率晶体管
CN115723970A (zh) * 2022-11-21 2023-03-03 北京钧天航宇技术有限公司 面向低成本的模块化卫星结构装置
CN218602437U (zh) * 2022-08-26 2023-03-10 海丰宇航微电子有限公司 一种贴片型三极管

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648417B2 (ja) * 1999-12-09 2005-05-18 株式会社東芝 パワー半導体モジュール及び電力変換装置
JP5292779B2 (ja) * 2007-11-26 2013-09-18 富士電機株式会社 半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW488055B (en) * 2000-05-11 2002-05-21 Advanced Micro Devices Inc Semiconductor device including an integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals
CN104584213A (zh) * 2012-08-24 2015-04-29 三菱电机株式会社 半导体装置
CN105742278A (zh) * 2014-12-25 2016-07-06 富士电机株式会社 半导体装置
CN107799484A (zh) * 2016-08-31 2018-03-13 英飞凌科技奥地利有限公司 具有重复的覆盖区模的半导体芯片封装
US20200118986A1 (en) * 2018-10-15 2020-04-16 Fuji Electric Co., Ltd. Semiconductor equipment
CN216054654U (zh) * 2021-04-14 2022-03-15 惠州市力迈电子有限公司 一种带有高气密性封装的功率晶体管
CN218602437U (zh) * 2022-08-26 2023-03-10 海丰宇航微电子有限公司 一种贴片型三极管
CN115723970A (zh) * 2022-11-21 2023-03-03 北京钧天航宇技术有限公司 面向低成本的模块化卫星结构装置

Also Published As

Publication number Publication date
US20260011685A1 (en) 2026-01-08
JPWO2024257265A1 (https=) 2024-12-19
JP7433562B1 (ja) 2024-02-19
WO2024257265A1 (ja) 2024-12-19

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