JP7433562B1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7433562B1
JP7433562B1 JP2023568734A JP2023568734A JP7433562B1 JP 7433562 B1 JP7433562 B1 JP 7433562B1 JP 2023568734 A JP2023568734 A JP 2023568734A JP 2023568734 A JP2023568734 A JP 2023568734A JP 7433562 B1 JP7433562 B1 JP 7433562B1
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JP
Japan
Prior art keywords
semiconductor
semiconductor module
semiconductor device
main electrode
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023568734A
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English (en)
Japanese (ja)
Other versions
JPWO2024257265A1 (https=
JPWO2024257265A5 (https=
Inventor
佳雅 ▲高▼久
圭佑 多田
聡 小塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
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Publication of JP7433562B1 publication Critical patent/JP7433562B1/ja
Publication of JPWO2024257265A1 publication Critical patent/JPWO2024257265A1/ja
Publication of JPWO2024257265A5 publication Critical patent/JPWO2024257265A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Inverter Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2023568734A 2023-06-14 2023-06-14 半導体装置 Active JP7433562B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/022085 WO2024257265A1 (ja) 2023-06-14 2023-06-14 半導体装置

Publications (3)

Publication Number Publication Date
JP7433562B1 true JP7433562B1 (ja) 2024-02-19
JPWO2024257265A1 JPWO2024257265A1 (https=) 2024-12-19
JPWO2024257265A5 JPWO2024257265A5 (https=) 2025-05-27

Family

ID=89904370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023568734A Active JP7433562B1 (ja) 2023-06-14 2023-06-14 半導体装置

Country Status (4)

Country Link
US (1) US20260011685A1 (https=)
JP (1) JP7433562B1 (https=)
CN (1) CN120513519A (https=)
WO (1) WO2024257265A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168278A (ja) * 1999-12-09 2001-06-22 Toshiba Corp パワー半導体モジュール及び電力変換装置
JP2009130163A (ja) * 2007-11-26 2009-06-11 Fuji Electric Device Technology Co Ltd 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392145B1 (en) * 2000-05-11 2002-05-21 Advanced Micro Devices, Inc. Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals
CN104584213B (zh) * 2012-08-24 2018-02-13 三菱电机株式会社 半导体装置
US10123443B2 (en) * 2014-12-25 2018-11-06 Fuji Electric Co., Ltd. Semiconductor device
DE102017202770B4 (de) * 2016-08-31 2023-06-07 Infineon Technologies Austria Ag Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster
JP7151361B2 (ja) * 2018-10-15 2022-10-12 富士電機株式会社 半導体装置
CN216054654U (zh) * 2021-04-14 2022-03-15 惠州市力迈电子有限公司 一种带有高气密性封装的功率晶体管
CN218602437U (zh) * 2022-08-26 2023-03-10 海丰宇航微电子有限公司 一种贴片型三极管
CN115723970B (zh) * 2022-11-21 2025-11-04 北京钧天航宇技术有限公司 面向低成本的模块化卫星结构装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168278A (ja) * 1999-12-09 2001-06-22 Toshiba Corp パワー半導体モジュール及び電力変換装置
JP2009130163A (ja) * 2007-11-26 2009-06-11 Fuji Electric Device Technology Co Ltd 半導体装置

Also Published As

Publication number Publication date
US20260011685A1 (en) 2026-01-08
JPWO2024257265A1 (https=) 2024-12-19
WO2024257265A1 (ja) 2024-12-19
CN120513519A (zh) 2025-08-19

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