JPWO2024257265A1 - - Google Patents
Info
- Publication number
- JPWO2024257265A1 JPWO2024257265A1 JP2023568734A JP2023568734A JPWO2024257265A1 JP WO2024257265 A1 JPWO2024257265 A1 JP WO2024257265A1 JP 2023568734 A JP2023568734 A JP 2023568734A JP 2023568734 A JP2023568734 A JP 2023568734A JP WO2024257265 A1 JPWO2024257265 A1 JP WO2024257265A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/022085 WO2024257265A1 (ja) | 2023-06-14 | 2023-06-14 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7433562B1 JP7433562B1 (ja) | 2024-02-19 |
| JPWO2024257265A1 true JPWO2024257265A1 (https=) | 2024-12-19 |
| JPWO2024257265A5 JPWO2024257265A5 (https=) | 2025-05-27 |
Family
ID=89904370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023568734A Active JP7433562B1 (ja) | 2023-06-14 | 2023-06-14 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260011685A1 (https=) |
| JP (1) | JP7433562B1 (https=) |
| CN (1) | CN120513519A (https=) |
| WO (1) | WO2024257265A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3648417B2 (ja) * | 1999-12-09 | 2005-05-18 | 株式会社東芝 | パワー半導体モジュール及び電力変換装置 |
| US6392145B1 (en) * | 2000-05-11 | 2002-05-21 | Advanced Micro Devices, Inc. | Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals |
| JP5292779B2 (ja) * | 2007-11-26 | 2013-09-18 | 富士電機株式会社 | 半導体装置 |
| CN104584213B (zh) * | 2012-08-24 | 2018-02-13 | 三菱电机株式会社 | 半导体装置 |
| US10123443B2 (en) * | 2014-12-25 | 2018-11-06 | Fuji Electric Co., Ltd. | Semiconductor device |
| DE102017202770B4 (de) * | 2016-08-31 | 2023-06-07 | Infineon Technologies Austria Ag | Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster |
| JP7151361B2 (ja) * | 2018-10-15 | 2022-10-12 | 富士電機株式会社 | 半導体装置 |
| CN216054654U (zh) * | 2021-04-14 | 2022-03-15 | 惠州市力迈电子有限公司 | 一种带有高气密性封装的功率晶体管 |
| CN218602437U (zh) * | 2022-08-26 | 2023-03-10 | 海丰宇航微电子有限公司 | 一种贴片型三极管 |
| CN115723970B (zh) * | 2022-11-21 | 2025-11-04 | 北京钧天航宇技术有限公司 | 面向低成本的模块化卫星结构装置 |
-
2023
- 2023-06-14 CN CN202380090101.XA patent/CN120513519A/zh active Pending
- 2023-06-14 US US19/117,409 patent/US20260011685A1/en active Pending
- 2023-06-14 JP JP2023568734A patent/JP7433562B1/ja active Active
- 2023-06-14 WO PCT/JP2023/022085 patent/WO2024257265A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20260011685A1 (en) | 2026-01-08 |
| JP7433562B1 (ja) | 2024-02-19 |
| WO2024257265A1 (ja) | 2024-12-19 |
| CN120513519A (zh) | 2025-08-19 |
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