JPWO2024150668A5 - - Google Patents

Info

Publication number
JPWO2024150668A5
JPWO2024150668A5 JP2024570144A JP2024570144A JPWO2024150668A5 JP WO2024150668 A5 JPWO2024150668 A5 JP WO2024150668A5 JP 2024570144 A JP2024570144 A JP 2024570144A JP 2024570144 A JP2024570144 A JP 2024570144A JP WO2024150668 A5 JPWO2024150668 A5 JP WO2024150668A5
Authority
JP
Japan
Prior art keywords
semiconductor device
branch portion
recesses
protrusions
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024570144A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024150668A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/046586 external-priority patent/WO2024150668A1/ja
Publication of JPWO2024150668A1 publication Critical patent/JPWO2024150668A1/ja
Publication of JPWO2024150668A5 publication Critical patent/JPWO2024150668A5/ja
Pending legal-status Critical Current

Links

JP2024570144A 2023-01-12 2023-12-26 Pending JPWO2024150668A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023002780 2023-01-12
PCT/JP2023/046586 WO2024150668A1 (ja) 2023-01-12 2023-12-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024150668A1 JPWO2024150668A1 (https=) 2024-07-18
JPWO2024150668A5 true JPWO2024150668A5 (https=) 2025-09-22

Family

ID=91896961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024570144A Pending JPWO2024150668A1 (https=) 2023-01-12 2023-12-26

Country Status (2)

Country Link
JP (1) JPWO2024150668A1 (https=)
WO (1) WO2024150668A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5542627B2 (ja) * 2010-11-11 2014-07-09 新電元工業株式会社 接続板、接合構造及び半導体装置
JP2013051295A (ja) * 2011-08-31 2013-03-14 Panasonic Corp 半導体装置及びその製造方法
JP2017073406A (ja) * 2014-02-24 2017-04-13 三菱電機株式会社 電極リードおよび半導体装置
CN114787991A (zh) * 2020-06-30 2022-07-22 富士电机株式会社 半导体模块以及半导体模块的制造方法

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