JPWO2024150668A1 - - Google Patents
Info
- Publication number
- JPWO2024150668A1 JPWO2024150668A1 JP2024570144A JP2024570144A JPWO2024150668A1 JP WO2024150668 A1 JPWO2024150668 A1 JP WO2024150668A1 JP 2024570144 A JP2024570144 A JP 2024570144A JP 2024570144 A JP2024570144 A JP 2024570144A JP WO2024150668 A1 JPWO2024150668 A1 JP WO2024150668A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023002780 | 2023-01-12 | ||
| PCT/JP2023/046586 WO2024150668A1 (ja) | 2023-01-12 | 2023-12-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024150668A1 true JPWO2024150668A1 (https=) | 2024-07-18 |
| JPWO2024150668A5 JPWO2024150668A5 (https=) | 2025-09-22 |
Family
ID=91896961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024570144A Pending JPWO2024150668A1 (https=) | 2023-01-12 | 2023-12-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024150668A1 (https=) |
| WO (1) | WO2024150668A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5542627B2 (ja) * | 2010-11-11 | 2014-07-09 | 新電元工業株式会社 | 接続板、接合構造及び半導体装置 |
| JP2013051295A (ja) * | 2011-08-31 | 2013-03-14 | Panasonic Corp | 半導体装置及びその製造方法 |
| JP2017073406A (ja) * | 2014-02-24 | 2017-04-13 | 三菱電機株式会社 | 電極リードおよび半導体装置 |
| CN114787991A (zh) * | 2020-06-30 | 2022-07-22 | 富士电机株式会社 | 半导体模块以及半导体模块的制造方法 |
-
2023
- 2023-12-26 JP JP2024570144A patent/JPWO2024150668A1/ja active Pending
- 2023-12-26 WO PCT/JP2023/046586 patent/WO2024150668A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024150668A1 (ja) | 2024-07-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250703 |