JPWO2024095710A1 - - Google Patents
Info
- Publication number
- JPWO2024095710A1 JPWO2024095710A1 JP2024554348A JP2024554348A JPWO2024095710A1 JP WO2024095710 A1 JPWO2024095710 A1 JP WO2024095710A1 JP 2024554348 A JP2024554348 A JP 2024554348A JP 2024554348 A JP2024554348 A JP 2024554348A JP WO2024095710 A1 JPWO2024095710 A1 JP WO2024095710A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022177076 | 2022-11-04 | ||
| JP2022177076 | 2022-11-04 | ||
| PCT/JP2023/036705 WO2024095710A1 (ja) | 2022-11-04 | 2023-10-10 | 半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024095710A1 true JPWO2024095710A1 (https=) | 2024-05-10 |
| JP7831627B2 JP7831627B2 (ja) | 2026-03-17 |
Family
ID=90930490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024554348A Active JP7831627B2 (ja) | 2022-11-04 | 2023-10-10 | 半導体モジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250054897A1 (https=) |
| JP (1) | JP7831627B2 (https=) |
| CN (1) | CN119110994A (https=) |
| WO (1) | WO2024095710A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005011978A (ja) * | 2003-06-19 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2007173272A (ja) * | 2005-12-19 | 2007-07-05 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2020096153A (ja) * | 2018-12-13 | 2020-06-18 | 力成科技股▲分▼有限公司 | 半導体パッケージ構造体及びその製造方法 |
| JP2022062244A (ja) * | 2020-06-30 | 2022-04-19 | 富士電機株式会社 | 半導体モジュール |
-
2023
- 2023-10-10 JP JP2024554348A patent/JP7831627B2/ja active Active
- 2023-10-10 CN CN202380036348.3A patent/CN119110994A/zh active Pending
- 2023-10-10 WO PCT/JP2023/036705 patent/WO2024095710A1/ja not_active Ceased
-
2024
- 2024-10-31 US US18/933,720 patent/US20250054897A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005011978A (ja) * | 2003-06-19 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2007173272A (ja) * | 2005-12-19 | 2007-07-05 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2020096153A (ja) * | 2018-12-13 | 2020-06-18 | 力成科技股▲分▼有限公司 | 半導体パッケージ構造体及びその製造方法 |
| JP2022062244A (ja) * | 2020-06-30 | 2022-04-19 | 富士電機株式会社 | 半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250054897A1 (en) | 2025-02-13 |
| JP7831627B2 (ja) | 2026-03-17 |
| CN119110994A (zh) | 2024-12-10 |
| WO2024095710A1 (ja) | 2024-05-10 |
Similar Documents
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