JPWO2023190180A5 - - Google Patents

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Publication number
JPWO2023190180A5
JPWO2023190180A5 JP2024512366A JP2024512366A JPWO2023190180A5 JP WO2023190180 A5 JPWO2023190180 A5 JP WO2023190180A5 JP 2024512366 A JP2024512366 A JP 2024512366A JP 2024512366 A JP2024512366 A JP 2024512366A JP WO2023190180 A5 JPWO2023190180 A5 JP WO2023190180A5
Authority
JP
Japan
Prior art keywords
semiconductor device
portions
thickness
terminal
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512366A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023190180A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/011857 external-priority patent/WO2023190180A1/ja
Publication of JPWO2023190180A1 publication Critical patent/JPWO2023190180A1/ja
Publication of JPWO2023190180A5 publication Critical patent/JPWO2023190180A5/ja
Pending legal-status Critical Current

Links

JP2024512366A 2022-03-30 2023-03-24 Pending JPWO2023190180A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022055493 2022-03-30
PCT/JP2023/011857 WO2023190180A1 (ja) 2022-03-30 2023-03-24 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023190180A1 JPWO2023190180A1 (https=) 2023-10-05
JPWO2023190180A5 true JPWO2023190180A5 (https=) 2024-12-16

Family

ID=88201473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512366A Pending JPWO2023190180A1 (https=) 2022-03-30 2023-03-24

Country Status (5)

Country Link
US (1) US20240429139A1 (https=)
JP (1) JPWO2023190180A1 (https=)
CN (1) CN118974923A (https=)
DE (1) DE112023001273T5 (https=)
WO (1) WO2023190180A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024202594A1 (de) * 2024-03-19 2025-09-25 Zf Friedrichshafen Ag Halbbrückenpackage sowie elektronisches Leistungsmodul mit mehreren solcher Halbbrückenpackages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
JP6065839B2 (ja) * 2011-09-30 2017-01-25 富士電機株式会社 半導体装置及びその製造方法
JP2013131592A (ja) * 2011-12-21 2013-07-04 Mitsubishi Electric Corp リード端子およびこれを用いた半導体装置
JP6279860B2 (ja) * 2013-09-09 2018-02-14 三菱電機株式会社 半導体装置
JP7284566B2 (ja) * 2018-10-29 2023-05-31 ローム株式会社 半導体装置
JP7267716B2 (ja) * 2018-11-12 2023-05-02 ローム株式会社 半導体装置

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