DE112023001273T5 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

Info

Publication number
DE112023001273T5
DE112023001273T5 DE112023001273.3T DE112023001273T DE112023001273T5 DE 112023001273 T5 DE112023001273 T5 DE 112023001273T5 DE 112023001273 T DE112023001273 T DE 112023001273T DE 112023001273 T5 DE112023001273 T5 DE 112023001273T5
Authority
DE
Germany
Prior art keywords
semiconductor device
terminal
semiconductor elements
conductive
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023001273.3T
Other languages
German (de)
English (en)
Inventor
Tomoki FUJIMURA
Tomohiro YASUNISHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112023001273T5 publication Critical patent/DE112023001273T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112023001273.3T 2022-03-30 2023-03-24 Halbleitervorrichtung Pending DE112023001273T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022055493 2022-03-30
JP2022-055493 2022-03-30
PCT/JP2023/011857 WO2023190180A1 (ja) 2022-03-30 2023-03-24 半導体装置

Publications (1)

Publication Number Publication Date
DE112023001273T5 true DE112023001273T5 (de) 2025-02-27

Family

ID=88201473

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023001273.3T Pending DE112023001273T5 (de) 2022-03-30 2023-03-24 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20240429139A1 (https=)
JP (1) JPWO2023190180A1 (https=)
CN (1) CN118974923A (https=)
DE (1) DE112023001273T5 (https=)
WO (1) WO2023190180A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024202594A1 (de) * 2024-03-19 2025-09-25 Zf Friedrichshafen Ag Halbbrückenpackage sowie elektronisches Leistungsmodul mit mehreren solcher Halbbrückenpackages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
JP6065839B2 (ja) * 2011-09-30 2017-01-25 富士電機株式会社 半導体装置及びその製造方法
JP2013131592A (ja) * 2011-12-21 2013-07-04 Mitsubishi Electric Corp リード端子およびこれを用いた半導体装置
JP6279860B2 (ja) * 2013-09-09 2018-02-14 三菱電機株式会社 半導体装置
JP7284566B2 (ja) * 2018-10-29 2023-05-31 ローム株式会社 半導体装置
JP7267716B2 (ja) * 2018-11-12 2023-05-02 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023190180A1 (ja) 2023-10-05
CN118974923A (zh) 2024-11-15
US20240429139A1 (en) 2024-12-26
JPWO2023190180A1 (https=) 2023-10-05

Similar Documents

Publication Publication Date Title
DE102007006447B4 (de) Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls
DE10310809B4 (de) Leistungshalbleitereinrichtung
DE102014118836B4 (de) Halbleiter-packaging-anordnung und halbleiter-package
DE102013207804B4 (de) Verfahren zum Herstellen eines Leistungsmoduls mit mittels Lichtbogenschweissen direkt verbundenen, wärmeleitenden Strukturen
DE102008051965B4 (de) Bauelement mit mehreren Halbleiterchips
DE102009042320B4 (de) Halbleiter-Anordnung mit einem Leistungshalbleiterchip, Halbbrückenschaltung und Verfahren zur Herstellung einer Halbleiter-Anordnung
DE112018005978T5 (de) Halbleitervorrichtung
DE112006001663T5 (de) Halbleiterchip-Gehäuse und Verfahren zur Herstellung desselben
DE112008001657T5 (de) Integriertes Leistungsbauelementgehäuse und Modul mit zweiseitiger Kühlung und Verfahren zur Herstellung
DE112023001614T5 (de) Halbleitervorrichtung
DE102012200863A1 (de) Halbleitervorrichtung mit Grundplatte
DE112020003885T5 (de) Halbleiterbauteil
DE102018104509A1 (de) Halbleitervorrichtung
DE112020002920T5 (de) Halbleitervorrichtung und produktionsverfahren für halbleitervorrichtung
DE102018212438A1 (de) Halbleitergehäuse mit elektromagnetischer abschirmstruktur und verfahren zu dessen herstellung
DE112019007415T5 (de) Halbleitermodul und stromwandler
DE112021001391T5 (de) Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements
DE112023000851T5 (de) Halbleitervorrichtung
DE112018001741T5 (de) Halbleiteranordnung Verfahren zu dessen Herstellung undLeistungswandlervorrichtung
DE102021128079A1 (de) Verbindungsclip mit drei levels
DE112022006171T5 (de) Halbleitervorrichtung
DE112023001273T5 (de) Halbleitervorrichtung
DE102019121229B4 (de) Elektronische Vorrichtungen mit elektrisch isolierten Lastelektroden und zugehörige Herstellungsverfahren
DE112022002743T5 (de) Halbleitervorrichtung
DE112022002551T5 (de) Halbleiterbauteil

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000