JPWO2023223829A5 - - Google Patents

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Publication number
JPWO2023223829A5
JPWO2023223829A5 JP2024521658A JP2024521658A JPWO2023223829A5 JP WO2023223829 A5 JPWO2023223829 A5 JP WO2023223829A5 JP 2024521658 A JP2024521658 A JP 2024521658A JP 2024521658 A JP2024521658 A JP 2024521658A JP WO2023223829 A5 JPWO2023223829 A5 JP WO2023223829A5
Authority
JP
Japan
Prior art keywords
arm
switching element
main surface
semiconductor device
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024521658A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023223829A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/017093 external-priority patent/WO2023223829A1/ja
Publication of JPWO2023223829A1 publication Critical patent/JPWO2023223829A1/ja
Publication of JPWO2023223829A5 publication Critical patent/JPWO2023223829A5/ja
Pending legal-status Critical Current

Links

JP2024521658A 2022-05-19 2023-05-01 Pending JPWO2023223829A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022082599 2022-05-19
PCT/JP2023/017093 WO2023223829A1 (ja) 2022-05-19 2023-05-01 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023223829A1 JPWO2023223829A1 (https=) 2023-11-23
JPWO2023223829A5 true JPWO2023223829A5 (https=) 2025-01-30

Family

ID=88835092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521658A Pending JPWO2023223829A1 (https=) 2022-05-19 2023-05-01

Country Status (2)

Country Link
JP (1) JPWO2023223829A1 (https=)
WO (1) WO2023223829A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026000407A (ja) * 2024-06-17 2026-01-05 Ａｓｔｅｍｏ株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268607B2 (ja) * 2005-09-30 2009-05-27 富士通マイクロエレクトロニクス株式会社 半導体装置に配設される中継部材及び半導体装置
JP5805513B2 (ja) * 2011-12-14 2015-11-04 三菱電機株式会社 電力用半導体装置
JP6541991B2 (ja) * 2015-03-04 2019-07-10 エイブリック株式会社 半導体素子および半導体装置

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