JPWO2023223829A1 - - Google Patents
Info
- Publication number
- JPWO2023223829A1 JPWO2023223829A1 JP2024521658A JP2024521658A JPWO2023223829A1 JP WO2023223829 A1 JPWO2023223829 A1 JP WO2023223829A1 JP 2024521658 A JP2024521658 A JP 2024521658A JP 2024521658 A JP2024521658 A JP 2024521658A JP WO2023223829 A1 JPWO2023223829 A1 JP WO2023223829A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022082599 | 2022-05-19 | ||
| PCT/JP2023/017093 WO2023223829A1 (ja) | 2022-05-19 | 2023-05-01 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023223829A1 true JPWO2023223829A1 (https=) | 2023-11-23 |
| JPWO2023223829A5 JPWO2023223829A5 (https=) | 2025-01-30 |
Family
ID=88835092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521658A Pending JPWO2023223829A1 (https=) | 2022-05-19 | 2023-05-01 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023223829A1 (https=) |
| WO (1) | WO2023223829A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026000407A (ja) * | 2024-06-17 | 2026-01-05 | Ａｓｔｅｍｏ株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4268607B2 (ja) * | 2005-09-30 | 2009-05-27 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置に配設される中継部材及び半導体装置 |
| JP5805513B2 (ja) * | 2011-12-14 | 2015-11-04 | 三菱電機株式会社 | 電力用半導体装置 |
| JP6541991B2 (ja) * | 2015-03-04 | 2019-07-10 | エイブリック株式会社 | 半導体素子および半導体装置 |
-
2023
- 2023-05-01 WO PCT/JP2023/017093 patent/WO2023223829A1/ja not_active Ceased
- 2023-05-01 JP JP2024521658A patent/JPWO2023223829A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023223829A1 (ja) | 2023-11-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241017 |