JP2023122391A5 - - Google Patents

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Publication number
JP2023122391A5
JP2023122391A5 JP2022026064A JP2022026064A JP2023122391A5 JP 2023122391 A5 JP2023122391 A5 JP 2023122391A5 JP 2022026064 A JP2022026064 A JP 2022026064A JP 2022026064 A JP2022026064 A JP 2022026064A JP 2023122391 A5 JP2023122391 A5 JP 2023122391A5
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JP
Japan
Prior art keywords
lands
relay board
land
semiconductor
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022026064A
Other languages
English (en)
Japanese (ja)
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JP2023122391A (ja
JP7740055B2 (ja
Filing date
Publication date
Priority claimed from JP2022026064A external-priority patent/JP7740055B2/ja
Priority to JP2022026064A priority Critical patent/JP7740055B2/ja
Application filed filed Critical
Priority to CN202380022516.3A priority patent/CN118786526A/zh
Priority to PCT/JP2023/000866 priority patent/WO2023162501A1/ja
Publication of JP2023122391A publication Critical patent/JP2023122391A/ja
Publication of JP2023122391A5 publication Critical patent/JP2023122391A5/ja
Priority to US18/790,510 priority patent/US20240387474A1/en
Priority to JP2025140760A priority patent/JP2025169996A/ja
Publication of JP7740055B2 publication Critical patent/JP7740055B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022026064A 2022-02-22 2022-02-22 半導体装置 Active JP7740055B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022026064A JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置
CN202380022516.3A CN118786526A (zh) 2022-02-22 2023-01-13 半导体装置
PCT/JP2023/000866 WO2023162501A1 (ja) 2022-02-22 2023-01-13 半導体装置
US18/790,510 US20240387474A1 (en) 2022-02-22 2024-07-31 Semiconductor device
JP2025140760A JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022026064A JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025140760A Division JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2023122391A JP2023122391A (ja) 2023-09-01
JP2023122391A5 true JP2023122391A5 (https=) 2024-03-29
JP7740055B2 JP7740055B2 (ja) 2025-09-17

Family

ID=87765401

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022026064A Active JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置
JP2025140760A Pending JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025140760A Pending JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Country Status (4)

Country Link
US (1) US20240387474A1 (https=)
JP (2) JP7740055B2 (https=)
CN (1) CN118786526A (https=)
WO (1) WO2023162501A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP2026007786A (ja) * 2024-07-04 2026-01-19 株式会社三井ハイテック 半導体装置用基板及びその製造方法、並びに半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4774075B2 (ja) 2008-04-18 2011-09-14 富士通セミコンダクター株式会社 半導体装置に配設される中継部材及び半導体装置
JP2012146760A (ja) 2011-01-11 2012-08-02 Calsonic Kansei Corp パワー半導体モジュール
WO2014006724A1 (ja) 2012-07-05 2014-01-09 三菱電機株式会社 半導体装置
US11011443B2 (en) 2016-01-05 2021-05-18 Hitachi Automotive Systems, Ltd. Power semiconductor device including a spacer
JP6897869B2 (ja) 2018-04-18 2021-07-07 三菱電機株式会社 半導体モジュール

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