JP7740055B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP7740055B2
JP7740055B2 JP2022026064A JP2022026064A JP7740055B2 JP 7740055 B2 JP7740055 B2 JP 7740055B2 JP 2022026064 A JP2022026064 A JP 2022026064A JP 2022026064 A JP2022026064 A JP 2022026064A JP 7740055 B2 JP7740055 B2 JP 7740055B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor element
wiring
semiconductor device
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022026064A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023122391A (ja
JP2023122391A5 (https=
Inventor
俊浩 中村
啓年 草間
直仁 水野
彩子 下妻
知巳 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2022026064A priority Critical patent/JP7740055B2/ja
Priority to CN202380022516.3A priority patent/CN118786526A/zh
Priority to PCT/JP2023/000866 priority patent/WO2023162501A1/ja
Publication of JP2023122391A publication Critical patent/JP2023122391A/ja
Publication of JP2023122391A5 publication Critical patent/JP2023122391A5/ja
Priority to US18/790,510 priority patent/US20240387474A1/en
Priority to JP2025140760A priority patent/JP2025169996A/ja
Application granted granted Critical
Publication of JP7740055B2 publication Critical patent/JP7740055B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Inverter Devices (AREA)
  • Wire Bonding (AREA)
JP2022026064A 2022-02-22 2022-02-22 半導体装置 Active JP7740055B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022026064A JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置
CN202380022516.3A CN118786526A (zh) 2022-02-22 2023-01-13 半导体装置
PCT/JP2023/000866 WO2023162501A1 (ja) 2022-02-22 2023-01-13 半導体装置
US18/790,510 US20240387474A1 (en) 2022-02-22 2024-07-31 Semiconductor device
JP2025140760A JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022026064A JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025140760A Division JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2023122391A JP2023122391A (ja) 2023-09-01
JP2023122391A5 JP2023122391A5 (https=) 2024-03-29
JP7740055B2 true JP7740055B2 (ja) 2025-09-17

Family

ID=87765401

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022026064A Active JP7740055B2 (ja) 2022-02-22 2022-02-22 半導体装置
JP2025140760A Pending JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025140760A Pending JP2025169996A (ja) 2022-02-22 2025-08-26 半導体装置

Country Status (4)

Country Link
US (1) US20240387474A1 (https=)
JP (2) JP7740055B2 (https=)
CN (1) CN118786526A (https=)
WO (1) WO2023162501A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP2026007786A (ja) * 2024-07-04 2026-01-19 株式会社三井ハイテック 半導体装置用基板及びその製造方法、並びに半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211237A (ja) 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
WO2012096066A1 (ja) 2011-01-11 2012-07-19 カルソニックカンセイ株式会社 パワー半導体モジュール
WO2014006724A1 (ja) 2012-07-05 2014-01-09 三菱電機株式会社 半導体装置
WO2017119226A1 (ja) 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置
WO2019202687A1 (ja) 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211237A (ja) 2008-04-18 2008-09-11 Fujitsu Ltd 半導体装置に配設される中継部材及び半導体装置
WO2012096066A1 (ja) 2011-01-11 2012-07-19 カルソニックカンセイ株式会社 パワー半導体モジュール
WO2014006724A1 (ja) 2012-07-05 2014-01-09 三菱電機株式会社 半導体装置
WO2017119226A1 (ja) 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置
WO2019202687A1 (ja) 2018-04-18 2019-10-24 三菱電機株式会社 半導体モジュール

Also Published As

Publication number Publication date
JP2025169996A (ja) 2025-11-14
WO2023162501A1 (ja) 2023-08-31
JP2023122391A (ja) 2023-09-01
CN118786526A (zh) 2024-10-15
US20240387474A1 (en) 2024-11-21

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