JPWO2022264844A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022264844A5
JPWO2022264844A5 JP2023529785A JP2023529785A JPWO2022264844A5 JP WO2022264844 A5 JPWO2022264844 A5 JP WO2022264844A5 JP 2023529785 A JP2023529785 A JP 2023529785A JP 2023529785 A JP2023529785 A JP 2023529785A JP WO2022264844 A5 JPWO2022264844 A5 JP WO2022264844A5
Authority
JP
Japan
Prior art keywords
semiconductor elements
electrode
semiconductor device
semiconductor
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023529785A
Other languages
English (en)
Japanese (ja)
Other versions
JP7812855B2 (ja
JPWO2022264844A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/022702 external-priority patent/WO2022264844A1/ja
Publication of JPWO2022264844A1 publication Critical patent/JPWO2022264844A1/ja
Publication of JPWO2022264844A5 publication Critical patent/JPWO2022264844A5/ja
Application granted granted Critical
Publication of JP7812855B2 publication Critical patent/JP7812855B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2023529785A 2021-06-17 2022-06-06 半導体装置 Active JP7812855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021100841 2021-06-17
JP2021100841 2021-06-17
PCT/JP2022/022702 WO2022264844A1 (ja) 2021-06-17 2022-06-06 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022264844A1 JPWO2022264844A1 (https=) 2022-12-22
JPWO2022264844A5 true JPWO2022264844A5 (https=) 2025-04-25
JP7812855B2 JP7812855B2 (ja) 2026-02-10

Family

ID=84526402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529785A Active JP7812855B2 (ja) 2021-06-17 2022-06-06 半導体装置

Country Status (5)

Country Link
US (1) US20240047367A1 (https=)
JP (1) JP7812855B2 (https=)
CN (1) CN117501446A (https=)
DE (1) DE112022002594T5 (https=)
WO (1) WO2022264844A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016225493A (ja) 2015-06-01 2016-12-28 株式会社Ihi パワーモジュール
JPWO2017175686A1 (ja) * 2016-04-04 2019-02-14 ローム株式会社 パワーモジュールおよびその製造方法
CN109804465B (zh) * 2016-09-23 2022-11-29 三菱电机株式会社 电力用半导体模块以及电力用半导体装置
DE112018001927T5 (de) * 2017-03-14 2019-12-19 Rohm Co., Ltd. Halbleiterbauelement
JP7163054B2 (ja) * 2017-04-20 2022-10-31 ローム株式会社 半導体装置
CN110366816B (zh) * 2018-01-26 2021-09-10 新电元工业株式会社 电子模块
JP7267716B2 (ja) * 2018-11-12 2023-05-02 ローム株式会社 半導体装置
DE212020000598U1 (de) * 2019-09-27 2021-12-01 Rohm Co., Ltd. Halbleitervorrichtung

Similar Documents

Publication Publication Date Title
JP7498814B2 (ja) 半導体モジュール
JP2024029105A5 (https=)
JP7267716B2 (ja) 半導体装置
JP7143277B2 (ja) 半導体装置
JP2022181822A5 (https=)
JPWO2023053823A5 (https=)
JPWO2023243418A5 (https=)
JPWO2024018810A5 (https=)
JPWO2022264844A5 (https=)
JPWO2023140050A5 (https=)
JPWO2022224935A5 (https=)
JPWO2023190180A5 (https=)
JPWO2024122343A5 (https=)
US8502484B2 (en) Power stage for driving an electric machine
JPWO2022264851A5 (https=)
JPH06267709A (ja) 正特性サーミスタ
JPWO2024080089A5 (https=)
JP2001135762A (ja) 半導体素子の実装構造
JP7812855B2 (ja) 半導体装置
JPWO2024262253A5 (https=)
JP2967562B2 (ja) 圧電トランス及び圧電トランスの製造方法
JPH0558597B2 (https=)
JPH10270491A5 (https=)
JPWO2024257549A5 (https=)
JP7165612B2 (ja) 半導体コンデンサ装置及び半導体コンデンサ装置モジュール